Manufacturing & Production Test
Refine the List
remove all refinementsBy Type of Content
- Document Library
- Application Notes
- Application Note (116)
- Application Notes
By Product Category
1-25 of 116
|
Building Hybrid Test Systems. Ensuring success in two common development scenarios - Application Not
Application Note 1465-33. When you migrate to a hybrid system that includes LXI along with GPIB, VXI, PXI, or any other architecture, two scenarios are most typical, minimum development time and maximum overall performance
Application Note 2008-10-15 |
|
|
High Node Count Fixturing Solutions for Agilent Short-Wire Test Fixtures
This paper discusses problems encountered in building large, high node count vacuum actuated test fixtures for the Agilent 3070 family of board test systems.
Application Note 2008-04-30 |
PDF
67 KB
|
|
Using LXI to Boost Throughput in Semiconductor Manufacturing
This document is a case study that discusses the successful customer implementation of an Agilent LXI solution for a multinational semiconductor manufacturer
Application Note 2007-04-25 |
PDF
234 KB
|
|
Maximising Test Coverage with Agilent Medalist VTEP v2.0
This paper describes how to get the most from Agilent Technologies’ industry-leading vectorless test innovation, the Medalist VTEP v2.0 which is a suite of solution comprising VTEP, iVTEP and NPM.
Application Note 2007-04-17 |
PDF
227 KB
|
|
Life and Stability of the Agilent 5DX Sealed X-ray Tube
Agilent has developed a sealed ultra-high vacuum X-ray tube that provides stable output throughout a significantly long life.
Application Note 2007-01-22 |
PDF
78 KB
|
|
Considerations for Surface Map Setup
The concept of delta-Zs is perhaps the most difficult thing to understand about the surface map process.
Application Note 2006-08-08 |
|
|
SEMI S2 Standard Modifications for Agilent 3070 and Related Equipment
This document describes three items pertaining to the Agilent 3070 and the SEMI S2 standard. Each of them is related to a variance with the SEMI standard.
Application Note 2006-06-15 |
PDF
52 KB
|
|
AOI - A Strategy for Closing the Loop
This paper describes a set of defect prevention solutions centered on the availability of high-quality inspection and measurements data from an AOI system and a few carefully engineered software applications
Application Note 2006-04-16 |
PDF
291 KB
|
|
“Shotgunning”, a Bad Fit for Lead-Free Test
Shotgunning, a common repair technique in functional test, will be negatively affected by lead-free processes. This article explores the technique and draws broad conclusions regarding the impact of lead-free on electronics manufacturing test
Application Note 2006-02-07 |
PDF
44 KB
|
|
Replacing the Agilent 34401A with the New 34410A/34411A High Performance Digital Multimeters
This application note provides a high level overview of the differences between the Agilent 34401A 6 1/2 Digit Digital Multimeter and the new Agilent 34410A and 34411A 6 1/2 Digit High Performance DMMs.
Application Note 2005-11-15 |
|
|
N6700 Modular Power System: Determining Specifications when Paralleling Outputs (AN 1560)
Application Note 2005-07-27 |
|
|
How to Get the Most from Agilent's Intelligent Yield Enhancement Test (IYET)
This paper describes how to get the most from IYET for Agilent board test systems.
Application Note 2005-07-15 |
|
|
Design Considerations for PC Board Carriers for Use in the Agilent 5DX
There are several reasons why it may be necessary or desirable to use a carrier to transport printed circuit assemblies through the 5DX. This paper discusses these and some considerations for the design of suitable carriers.
Application Note 2005-07-13 |
PDF
918 KB
|
|
AXI and Lead-Free Process Characterization
How to use Automated X-ray Inspection as a tool to characterize new lead-free soldering processes.
Application Note 2005-06-21 |
|
|
In-circuit Testing of Low Voltage Devices
Core technical document summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.
Application Note 2005-05-25 |
PDF
172 KB
|
|
Gauge Repeatability on 5DX X-ray System
Summary of 5DX repeatability capability, factors that influence the repeatability capabilities of the 5DX, impacts to gauge repeatability and reproducibility (GR&R) results.
Application Note 2005-03-09 |
PDF
102 KB
|
|
Test and Inspection as Part of the Lead-free Manufacturing Process
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.
Application Note 2005-02-22 |
PDF
421 KB
|
|
Innovative Power Supplies Save Rack Space
In the past, many programmable system DC power supplies in the medium power range (500W to 2kW) have been packaged in 2U-high (2-EIA rack units) and even 3U, full rack width chassis...
Application Note 2004-12-16 |
|
|
Testing FPGullwing Misalignment Across the Pad
A technique is described which enables detection of misalignment of gullwing joints across the joint using duplicate components and FPGullwing Misalignment.
Application Note 2004-12-08 |
PDF
1.58 MB
|
|
Understanding the PCAP Polarity Reject Signal
This paper describes the algorithm used to determine if polarized capacitors are properly oriented.
Application Note 2004-12-02 |
PDF
1.09 MB
|
|
Handling Surface Mapping with Varying Board Construction
This paper describes a method for dealing with lot-to-lot or supplier-to-supplier variations in board construction. Often the variations in board construction result in different color boards which otherwise cause problems with surface mapping.
Application Note 2004-12-02 |
PDF
1.02 MB
|
|
Understanding and Configuring the 5DX Selftest and Black/White Level Tests
This paper discusses the theory and practice of 5DX automatic compensation tools, Selftest and gray level correction.
Application Note 2004-12-01 |
PDF
158 KB
|
|
How and Why: Confirmation and Adjustments
This paper describes the process of and reason for periodic adjustment of a 5DX system using the confirmation and adjustment panel.
Application Note 2004-12-01 |
PDF
636 KB
|
|
Simplify Multiple Bias Voltage Sequencing and Ramping for PC Motherboard Test (AN 1504)
Application Note 2004-10-22 |
|
|
Increase DC-input Battery Adapter Test Throughput by Several-fold (AN 1506)
Application Note 2004-10-22 |
Enroll in myAgilent
Register Your Product
Why Buy Agilent