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76-100 of 116

Replacing the Agilent 34401A with the New 34410A/34411A High Performance Digital Multimeters This application note provides a high level overview of the differences between the Agilent 34401A 6 1/2 Digit Digital Multimeter and the new Agilent 34410A and 34411A 6 1/2 Digit High Performance DMMs. Application Note 2005-11-15	PDF 298 KB Langues English \| 2005-11-15 \| PDF 298 KB 中文（简体） \| 2005-12-01 \| PDF 1.35 MB 日本語 \| 2005-11-17 \| PDF 1.02 MB 中文（繁體） \| 2006-02-08 \| PDF 298 KB 한국어 \| 2005-11-15 \| PDF 298 KB
Rolling Mill In this Application Note following the description of the rolling mill application, measurement and control requirements for characterizing the process are discussed. Then, Agilent VXI-based data acquisition suitable for such an application is listed. Description Steel, aluminum, fiberglass... Application Note 1997-11-01	PDF 82 KB
Rotating Boards on a Panel Rotating Boards on a Panel if often necessary. In addition to the software revisions named within, the explained technique in the document is utilized for for 4.x, 5.x, 6.x and 7.x. For 8.x Test Link deals with this automatically. Application Note 2001-05-17	PDF 40 KB
Running Rocky Mountain Basic from Board Test Basic Many of you have existing programs written in Rocky Mountain Basic (RM-Basic), or have found the RM-Basic program examples given in Agilent manuals, and wish to use them to do external instrumentation control using the Agilent 3070 Board Test Family. Application Note 2001-05-17	PDF 23 KB
Sampling on the Agilent 5DX Sampling Mode allows test coverage to be optimized with line speed. This document explore the setup procedure for the Agilent 5DX for sampling. Application Note 2002-05-08
Selective Retrieval for Agilent 3070 Board Test Systems with UNIX Controllers Most users are very diligent about backing-up their systems in the event of a catastrophic disk failure. Typically, you use SAM to set-up periodic automated backups or create a "crontab" entry to do this. Application Note 1996-07-01
SEMI S2 Standard Modifications for Agilent 3070 and Related Equipment This document describes three items pertaining to the Agilent 3070 and the SEMI S2 standard. Each of them is related to a variance with the SEMI standard. Application Note 2006-06-15	PDF 52 KB
Series II Compliance with the Machinery Directive (in Europe) - specific installation procedures Series II will meet requirements of Machinery Directive in European Community member countries, if the following steps, which are described in the document, are taken during installation of equipment. Application Note 2001-05-17
Simplify Multiple Bias Voltage Sequencing and Ramping for PC Motherboard Test (AN 1504) Application Note 2004-10-22	PDF 57 KB Langues English \| 2004-10-22 \| PDF 57 KB 中文（简体） \| 2005-04-01 \| PDF 366 KB 日本語 \| 2005-04-14 \| PDF 185 KB 中文（繁體） \| 2004-12-29 \| PDF 286 KB 한국어 \| 2004-10-22 \| PDF 57 KB
Solder Paste Inspection - Organize the Pieces Published in Global SMT & Packaging, November 2003 Application Note 2003-11-01	PDF 818 KB
Solder Paste Inspection for the SMT line: 3D In-line Systems Come of Age Published in Electronic Production & Test, May 2003. Application Note 2003-05-01	PDF 115 KB
Synchronizing 3070 System Clocks These instructions are for synchronizing the system clocks of several network-connected UX workstations in the absence of an existing timeserver. Application Note 2001-09-27	PDF 66 KB
System Issues in Boundary-Scan Board Test While Boundary-Scan is a powerful test tool, test engineers are finding out that yesterday's DFT rules and test approaches may actually be detrimental to successfully testing systems on a board. Application Note 2003-01-28	PDF 37 KB
Taking and Using Diagnostic Images Storing images can be a helpful method for trouble-shooting and collaboration with support. This document explains the methods for taking images. In addition to the software revisions named, the document applies to all 5DX software versions. Application Note 2001-05-17	PDF 61 KB
Test and Inspection as Part of the Lead-free Manufacturing Process The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies. Application Note 2005-02-22	PDF 421 KB
Test Coverage: What Does It Mean when a Board Test Passes? Originally presented at the 2002 International Test Conference -- Characterizing board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage, especially in a limited access testing environment. Application Note 2003-07-28	PDF 266 KB
Test Strategy for Complex Printed Circuit Board Assemblies This paper proposes a new test strategy for complex boards since the trend in Printed Circuit Board Assembly (PCBA) technology is towards higher complexity. Application Note 1999-02-22	PDF 195 KB
Testing FPGullwing Misalignment Across the Pad A technique is described which enables detection of misalignment of gullwing joints across the joint using duplicate components and FPGullwing Misalignment. Application Note 2004-12-08	PDF 1.58 MB
Testing Transformers on Unpowered Systems This paper explains how to test basic analog parts, using unpowered systems. Application Note 2003-03-21	PDF 10 KB
Testing Uninterruptible Power Supplies Using Agilent 6800 Series ac Power Source/Analyzers This Product Note describes how Agilent ac sources can be used to help test uninterruptible power supplies in many different environments, including research and development, manufacturing, and incoming inspection. Application Note 2001-01-16	PDF 430 KB
The Importance of Test and Inspection When Implementing Lead-Free Manufacturing Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free. Application Note 2004-08-20	PDF 260 KB
The Life of a 5DX Inspection C# File The {Hashed Panel Name}.C# file is basically cad information about a panel program. It is used in conjunction with various utilities to overlay cad data on images or provide cad data for filters. Application Note 2001-10-16	PDF 97 KB
The Why, Where, What, How, and When of X-ray Test How do the different AXI technologies work? What are the appropriate uses of 2D vs 3D X-ray? Where in the mfg process should AXI be placed? How can AXI be used to improve the mfg process? Application Note 2000-11-01	PDF 1.30 MB
Tying a Power Supply to Multiple Boards in a Panel If you have a situation with multiple boards on a panel, and you need to wire one or more power supplies to each board, you often can wind up with problems wiring power and ground. Usually, you'll see warnings of the type FXT66. Application Note 2001-06-12	PDF 16 KB
Understanding and Configuring the 5DX Selftest and Black/White Level Tests This paper discusses the theory and practice of 5DX automatic compensation tools, Selftest and gray level correction. Application Note 2004-12-01	PDF 158 KB

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