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System Issues in Boundary-Scan Board Test 
While Boundary-Scan is a powerful test tool, test engineers are finding out that yesterday's DFT rules and test approaches may actually be detrimental to successfully testing systems on a board.

Application Note 2003-01-28

PDF PDF 37 KB
Taking and Using Diagnostic Images 
Storing images can be a helpful method for trouble-shooting and collaboration with support. This document explains the methods for taking images. In addition to the software revisions named, the document applies to all 5DX software versions.

Application Note 2001-05-17

PDF PDF 61 KB
Test and Inspection as Part of the Lead-free Manufacturing Process 
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.

Application Note 2005-02-22

PDF PDF 421 KB
Test Coverage: What Does It Mean when a Board Test Passes? 
Originally presented at the 2002 International Test Conference -- Characterizing board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage, especially in a limited access testing environment.

Application Note 2003-07-28

PDF PDF 266 KB
Testing Transformers on Unpowered Systems 
This paper explains how to test basic analog parts, using unpowered systems.

Application Note 2003-03-21

PDF PDF 10 KB
The Importance of Test and Inspection When Implementing Lead-Free Manufacturing 
Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free.

Application Note 2004-08-20

PDF PDF 260 KB
The Life of a 5DX Inspection C# File 
The {Hashed Panel Name}.C# file is basically cad information about a panel program. It is used in conjunction with various utilities to overlay cad data on images or provide cad data for filters.

Application Note 2001-10-16

PDF PDF 97 KB
The Why, Where, What, How, and When of X-ray Test 
How do the different AXI technologies work? What are the appropriate uses of 2D vs 3D X-ray? Where in the mfg process should AXI be placed? How can AXI be used to improve the mfg process?

Application Note 2000-11-01

PDF PDF 1.30 MB
Tying a Power Supply to Multiple Boards in a Panel 
If you have a situation with multiple boards on a panel, and you need to wire one or more power supplies to each board, you often can wind up with problems wiring power and ground. Usually, you'll see warnings of the type FXT66.

Application Note 2001-06-12

PDF PDF 16 KB
UNIX vs. Windows Differences for 3070 Users 
This documentation serves as a PC transition guide to help existing 3070 customers migrate from the Unix platform to the PC platform.

Application Note 2002-09-19

 
Up-and-Down Programming DUT Power Supplies 
There seems to be some confusion on what the current limits are when using the DUT supplies in the Agilent 3070 system. While this article is not meant to be an exhaustive treatise on the subject, a little clarification might help.

Application Note 2001-05-17

PDF PDF 23 KB
Use of the Test Results Command Processor 
TRCMDPRO processes the results from the Agilent 5DX in a way that is specified by a command file. This file is TRCMDPRO.CMD. In addition to the software revisions named, the document applies to all 5DX software versions.

Application Note 1998-01-12

PDF PDF 20 KB
Use of Wrong Thickness Technique Gives Bad Test Results 
Beginning with release 6.0, there are two techniques for measurement of solder thickness on the Agilent 5DX, each based on use of a different Confirmation & Adjustment panel.

Application Note 2000-12-31

 
Using Boundary Scan to Link Design and Manufacturing Test 
By leveraging boundary-scan tests generated in Design and re-using them at Manufacturing Test, manufacturers can produce long-term benefits in terms of lower costs, greater efficiencies and higher quality products.

Application Note 2003-03-01

PDF PDF 502 KB
Using Lead-Free PCB Finishes at Manufacturing In-circuit Test Stage 
The purpose of this document is to share experiences and educate engineers regarding different PCB surface finishes and the specific changes required in the PCB build process to allow for ICT.

Application Note 2004-08-08

PDF PDF 102 KB
Using NDFCOL.EXE, the NDF "Line Up the Columns" Utility 
NDFCOL.EXE is a handy little utility that will form neat columns of data in NDF files.

Application Note 2002-06-06

 
What to Consider When Selecting the Optimal Test Strategy 
This paper addresses several issues for selecting the optimal inspection strategy, presenting data from many studies that Agilent has performed in the quest to find the optimal test / inspection strategy.

Application Note 2003-03-01

PDF PDF 175 KB
Windows & Unix Feature Comparison 
The Windows & Unix 3070 Feature Comparison document provides a detailed listing of features translated to the Windows based 3070 from the Unix based 3070.

Application Note 2002-07-31

PDF PDF 71 KB
Writing Flash Memory with Agilent 3070 Systems 
Flash memory is traditionally programmed on PROM programmers, but some manufacturers report a one percent damage rate due to the extra handling steps required!

Application Note 2001-05-18

PDF PDF 31 KB
“Shotgunning”, a Bad Fit for Lead-Free Test 
Shotgunning, a common repair technique in functional test, will be negatively affected by lead-free processes. This article explores the technique and draws broad conclusions regarding the impact of lead-free on electronics manufacturing test

Application Note 2006-02-07

PDF PDF 44 KB

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