제조 및 생산 테스트
76-100 / 116
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Reducing Process Defect Escapes with Vectorless Test
Process defects that escape in-circuit test lead at best to increased repair costs, and at worst to a "bone pile1" problem.
어플리케이션 노트 2001-05-17 |
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Remote Network Connections Creation for the Operator Logon
Operator logon on the Agilent 5DX Series II System is limited, in that it does not allow Operator to make network connections that are required for sending images and res files to the PLR workstation.
어플리케이션 노트 2002-06-30 |
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Rolling Mill
In this Application Note following the description of the rolling mill application, measurement and control requirements for characterizing the process are discussed. Then, Agilent VXI-based data acquisition suitable for such an application is listed. Description
Steel, aluminum, fiberglass...
어플리케이션 노트 1997-11-01 |
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Rotating Boards on a Panel
Rotating Boards on a Panel if often necessary. In addition to the software revisions named within, the explained technique in the document is utilized for for 4.x, 5.x, 6.x and 7.x. For 8.x Test Link deals with this automatically.
어플리케이션 노트 2001-05-17 |
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Running Rocky Mountain Basic from Board Test Basic
Many of you have existing programs written in Rocky Mountain Basic (RM-Basic), or have found the RM-Basic program examples given in Agilent manuals, and wish to use them to do external instrumentation control using the Agilent 3070 Board Test Family.
어플리케이션 노트 2001-05-17 |
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Sampling on the Agilent 5DX
Sampling Mode allows test coverage to be optimized with line speed. This document explore the setup procedure for the Agilent 5DX for sampling.
어플리케이션 노트 2002-05-08 |
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Selective Retrieval for Agilent 3070 Board Test Systems with UNIX Controllers
Most users are very diligent about backing-up their systems in the event of a catastrophic disk failure. Typically, you use SAM to set-up periodic automated backups or create a "crontab" entry to do this.
어플리케이션 노트 1996-07-01 |
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SEMI S2 Standard Modifications for Agilent 3070 and Related Equipment
This document describes three items pertaining to the Agilent 3070 and the SEMI S2 standard. Each of them is related to a variance with the SEMI standard.
어플리케이션 노트 2006-06-15 |
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Series II Compliance with the Machinery Directive (in Europe) - specific installation procedures
Series II will meet requirements of Machinery Directive in European Community member countries, if the following steps, which are described in the document, are taken during installation of equipment.
어플리케이션 노트 2001-05-17 |
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Solder Paste Inspection - Organize the Pieces
Published in Global SMT & Packaging, November 2003
어플리케이션 노트 2003-11-01 |
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Solder Paste Inspection for the SMT line: 3D In-line Systems Come of Age
Published in Electronic Production & Test, May 2003.
어플리케이션 노트 2003-05-01 |
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Synchronizing 3070 System Clocks
These instructions are for synchronizing the system clocks of several network-connected UX workstations in the absence of an existing timeserver.
어플리케이션 노트 2001-09-27 |
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System Issues in Boundary-Scan Board Test
While Boundary-Scan is a powerful test tool, test engineers are finding out that yesterday's DFT rules and test approaches may actually be detrimental to successfully testing systems on a board.
어플리케이션 노트 2003-01-28 |
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Taking and Using Diagnostic Images
Storing images can be a helpful method for trouble-shooting and collaboration with support. This document explains the methods for taking images. In addition to the software revisions named, the document applies to all 5DX software versions.
어플리케이션 노트 2001-05-17 |
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Test and Inspection as Part of the Lead-free Manufacturing Process
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.
어플리케이션 노트 2005-02-22 |
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Test Coverage: What Does It Mean when a Board Test Passes?
Originally presented at the 2002 International Test Conference -- Characterizing board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage, especially in a limited access testing environment.
어플리케이션 노트 2003-07-28 |
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Test Strategy for Complex Printed Circuit Board Assemblies
This paper proposes a new test strategy for complex boards since the trend in Printed Circuit Board Assembly (PCBA) technology is towards higher complexity.
어플리케이션 노트 1999-02-22 |
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Testing FPGullwing Misalignment Across the Pad
A technique is described which enables detection of misalignment of gullwing joints across the joint using duplicate components and FPGullwing Misalignment.
어플리케이션 노트 2004-12-08 |
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Testing Transformers on Unpowered Systems
This paper explains how to test basic analog parts, using unpowered systems.
어플리케이션 노트 2003-03-21 |
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Testing Uninterruptible Power Supplies Using Agilent 6800 Series ac Power Source/Analyzers
This Product Note describes how Agilent ac sources can be used to help test uninterruptible power supplies in many different environments, including research and development, manufacturing, and incoming inspection.
어플리케이션 노트 2001-01-16 |
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The Importance of Test and Inspection When Implementing Lead-Free Manufacturing
Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free.
어플리케이션 노트 2004-08-20 |
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The Life of a 5DX Inspection C# File
The {Hashed Panel Name}.C# file is basically cad information about a panel program. It is used in conjunction with various utilities to overlay cad data on images or provide cad data for filters.
어플리케이션 노트 2001-10-16 |
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The Why, Where, What, How, and When of X-ray Test
How do the different AXI technologies work? What are the appropriate uses of 2D vs 3D X-ray? Where in the mfg process should AXI be placed? How can AXI be used to improve the mfg process?
어플리케이션 노트 2000-11-01 |
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Tying a Power Supply to Multiple Boards in a Panel
If you have a situation with multiple boards on a panel, and you need to wire one or more power supplies to each board, you often can wind up with problems wiring power and ground. Usually, you'll see warnings of the type FXT66.
어플리케이션 노트 2001-06-12 |
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Understanding and Configuring the 5DX Selftest and Black/White Level Tests
This paper discusses the theory and practice of 5DX automatic compensation tools, Selftest and gray level correction.
어플리케이션 노트 2004-12-01 |
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