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3070 Board Tests are Reliable, Repeatable and Transportable. Here's Why. 
It would take a very long paper to discuss all of the factors that make Agilent 3070 tests so reliable, repeatable, and transportable. This paper selects a few of the important ones.

Application Note 2001-08-15

PDF PDF 223 KB
3070 In System Programming (ISP) Family 
On Board Programming, Bottom Line Benefits

Application Note 2002-07-25

PDF PDF 200 KB
3070 Increasing Throughput 
There are decisions one can make that causes an Agilent 3070 test program to be slower or faster than what Test Consultant generates automatically. This paper offers many tips about how to optimize your system's performance.

Application Note 1997-03-03

PDF PDF 41 KB
3070 Series 3 Flash70 Programming Guide 
This guide contains information about the procedures, tasks, and syntax required to perform flash programming with HP 3070 test systems.

Application Note 2001-09-12

PDF PDF 1.85 MB
A New Process for Measuring and Displaying Board Test Coverage 
Written by Kenneth P. Parker, Agilent Technologies. First presented at Apex 2003, Anaheim, California.

Application Note 2003-01-01

PDF PDF 116 KB
Boundary Scan Helps EMS Companies Cut Test Costs and Increase Revenues 
Electronics Manufacturing Services (EMS) providers can utilize boundary-scan to reduce test cost expenses and also generate additional revenue opportunities.

Application Note 2003-03-01

PDF PDF 242 KB
Boundary-Scan Technology, Justification, and Test Implementation for Designers 
This paper provides practical insight for designers on the merits, design, and test implementation of Boundary-Scan Technology.

Application Note 1998-05-27

PDF PDF 29 KB
Design for Testability - Test for Designability 
This paper addresses testability considerations, both physical and logical, and focuses on both the new constraints and the new freedoms of modern manufacturing test in the ever-changing challenge.

Application Note 2003-01-28

PDF PDF 852 KB
Electrical In-circuit Test Methods for Limited-access Boards 
This paper surveys the various electrical test methods and tools available to address testing boards that lack full electrical access.

Application Note 2001-02-27

PDF PDF 47 KB
Enhanced Log Records for the Agilent Medalist In-Circuit Test System 
Track changes made to your i3070 test programs to improve success.

Application Note 2009-03-04

PDF PDF 801 KB
First pass Yield (FPY) and Alarm Triggers on the Agilent Medalist i3070 In-circuit Test System 
This application note will explain some customizations and how to create alarm triggers.

Application Note 2008-09-26

PDF PDF 131 KB
Ground Bounce Basics and Best Practices 
This article offers a description of the physical properties that result in ground bounce during board test.

Application Note 2003-01-28

PDF PDF 138 KB
How To Float, or Series, Agilent 3070 DUT Supplies 
The Agilent 3070 development software does an amazing job of calculating the wiring needed to build fixtures. Even so there are occasionally cases which require wiring that the standard Agilent 3070 software can not handle.

Application Note 1997-01-23

PDF PDF 34 KB
IEEE 1149.6 Standard Boundary Scan Testing on Agilent Medalist i3070 ICT Systems 
This paper introduces the latest advancements in Boundary Scan test capabilities on the Agilent Medalist i3070 In-Circuit Test platform that supports the testing of IEEE 1149.6-compliant devices.

Application Note 2008-11-24

PDF PDF 297 KB
Improved Fault Coverage in a Combined X-ray and In-Circuit Test Environment 
Cutting functional test failures in half and doubling the faults detected at process test! These are some of the case study results observed in combined X-ray and in-circuit test environments.

Application Note 2001-02-27

PDF PDF 575 KB
In-circuit Testing of Low Voltage Devices 
Core technical document summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.

Application Note 2005-05-25

PDF PDF 172 KB
In-System Programming on the Agilent 3070 
In-System Programmable devices are more widely used on today's boards to provide flexibility to design engineers and to reduce the cost of a product.

Application Note 2001-07-02

PDF PDF 205 KB
Maximising Test Coverage with Agilent Medalist VTEP v2.0 
This paper describes how to get the most from Agilent Technologies’ industry-leading vectorless test innovation, the Medalist VTEP v2.0 which is a suite of solution comprising VTEP, iVTEP and NPM.

Application Note 2007-04-17

PDF PDF 227 KB
Sprachen 
Medalist 3070 and Medalist i5000 System Recovery using Retrospect Express 
This app note describes how to perform backups of the system hard disk for the Agilent Medalist 3070 and Agilent Medalist i5000 In-circuit Test systems that have been shipped with Retrospect Express 7.0 and Roxio Digital Media Plus 7.2 software.

Application Note 2007-07-10

PDF PDF 628 KB
Medalist i3070 Test Throughput Optimization 
This application note explores some factors which cause test time to increase on the Medalist i3070 In-Circuit Test system, and methods which users can employ to reduce the test time and increase throughput on the Medalist i3070 ICT system.

Application Note 2008-11-24

PDF PDF 163 KB
Sprachen 
PLD Programming on the Agilent 3070 Using the PLD ISP Product 
In-System Programmable PLDs are more widely used on today's boards to provide flexibility to design engineers and to reduce the cost of a product.

Application Note 2002-02-26

PDF PDF 242 KB
Printed Circuit Board Split-Pad Test Method and Design 
This application note describes the split-pad concept for use with a bed of nails style test fixture.

Application Note 1999-06-01

PDF PDF 50 KB
Reducing Process Defect Escapes with Vectorless Test 
Process defects that escape in-circuit test lead at best to increased repair costs, and at worst to a "bone pile1" problem.

Application Note 2001-05-17

PDF PDF 512 KB
System Issues in Boundary-Scan Board Test 
While Boundary-Scan is a powerful test tool, test engineers are finding out that yesterday's DFT rules and test approaches may actually be detrimental to successfully testing systems on a board.

Application Note 2003-01-28

PDF PDF 37 KB
Test and Inspection as Part of the Lead-free Manufacturing Process 
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.

Application Note 2005-02-22

PDF PDF 421 KB

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