Digital Design & Interconnect Standards
Achieve your best design with Agilent. Investigate specific solutions for high speed standards plus solutions for your high-speed digital design cycle (design, simulation, analysis, debug compliance and signal integrity) challenges.
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- High-Speed Digital (12)
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- HDMI (1)
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- Serial ATA (SATA) (5)
- Serial Attached SCSI (SAS) (1)
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- Notes d’application
- Notes d’application (22)
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6 Hints for Better SATA and SAS Measurements
These 6 Hints for better SATA and SAS measurements cover Tx, Rx, Impedance and Return Loss, and Host/Device Digital testing challenges.
Notes d’application 2012-02-02 |
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Agilent Method of Implementation (MOI) for 10GBASE-T Ethernet Cable Tests
Agilent Method of Implementation (MOI) for 10GBASE-T Cable Tests Using Agilent E5071C ENA Option TDR
Notes d’application 2013-05-21 |
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Agilent Method of Implementation (MOI) for DisplayPort Cable-Connector Assembly Compliance Test
Agilent Method of Implementation (MOI) for DisplayPort Cable-Connector Assembly Compliance Test Using Agilent E5071C ENA Network Analyzer Option TDR
Notes d’application 2013-02-18 |
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Agilent Method of Implementation (MOI) for MHL Cables Compliance Tests
Agilent Method of Implementation (MOI) for MHL Cable Compliance Tests Using Agilent E5071C ENA Network Analyzer Option TDR
Notes d’application 2013-02-14 |
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Agilent Method of Implementation (MOI) for MIPI D-PHY Conformance Tests
Agilent Method of Implementation (MOI) for MIPI D-PHY Conformance Tests Using Agilent E5071C ENA Network Analyzer Option TDR
Notes d’application 2011-12-01 |
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Agilent Method of Implementation (MOI) for MIPI M-PHY Conformance Tests
Agilent Method of Implementation (MOI) for MIPI M-PHY Conformance Tests Using Agilent E5071C ENA Network Analyzer Option TDR
Notes d’application 2011-12-01 |
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Agilent Method of Implementation (MOI) for PCI Express 3.0 PCB Differential Trace Impedance Test
Agilent Method of Implementation (MOI) for PCI Express 3.0 PCB Differential Trace Impedance Test Using Agilent E5071C ENA Network Analyzer Option TDR
Notes d’application 2012-10-16 |
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Agilent Method of Implementation (MOI) for SATA RXTX Compliance Test
Agilent Method of Implementation (MOI) for SATA RXTX Compliance Test Using Agilent E5071C ENA Network Analyzer Option TDR
Notes d’application 2011-01-12 |
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Agilent Method of Implementation (MOI) for SATA SI Compliance Test
Agilent Method of Implementation (MOI) for SATA SI Compliance Test Using Agilent E5071C ENA Network Analyzer Option TDR
Notes d’application 2011-01-12 |
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Agilent Method of Implementation (MOI) for USB3.0 Cable-Connector Assembly Compliance Test
Agilent Method of Implementation (MOI) for USB3.0 Cable-Connector Assembly Compliance Test Using Agilent E5071C ENA Network Analyzer Option TDR
Notes d’application 2012-12-17 |
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Characterization of Balanced Digital Components and Communication Paths
Notes d’application 2001-11-19 |
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Designing High Speed Backplanes Utilizing Physical Layer Test System
This Application Note focuses on the problems introduced into the backplane assembly design by the many linear passive components that create reflections due to impedance discontinuities.
Notes d’application 2006-01-18 |
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Effective Reflection Characterization for Active Devices Using ENA Option TDR Application Note
This application note describes Hot TDR measurement, which is an effective characterization method for the reflection of transmitter and receiver.
Notes d’application 2012-01-12 |
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Improving Usability and Performance in High-Bandwidth Active Oscilloscope Probes (AN 1419-02)
Understand how to get minimal probe loading and highest-possible-performance representation of your signal.
Notes d’application 2002-11-01 |
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Limitations and Accuracies of Time and Frequency Domain Analysis of Physical Layer Devices
Notes d’application 2005-11-01 |
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Measurement Uncertainty of VNA based TDR/TDT Measurement Application Note
This application note explains the theory of measurement uncertainty in TDR/TDT measurement with the ENA Option TDR.
Notes d’application 2011-07-08 |
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Method of Implementation (MOI) for HDMI 1.4b Cable Assembly Test
Method of Implementation (MOI) for HDMI 1.4b Cable Assembly Test Using Agilent E5071C ENA Network Analyzer Option TDR.
Notes d’application 2013-04-24 |
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Network Analysis - De-embedding and Embedding S-Parameter Networks (1364-1)
At RF and microwave frequencies, it becomes difficult to directly measure devices with nonstandard connectors (for example, devices using surface-mount packaging).
Notes d’application 2004-06-01 |
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S-Parameter Techniques for Faster, More Accurate Network Design (AN 95-1)
This Application Note is for information only. Agilent no longer sells or supports these products.
Notes d’application 1967-02-01 |
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Signal Integrity Analysis Series Part 1: Single-Port TDR, TDR/TDT, & 2-Port TDR
This Application Note focuses on part 1: those which use a single-port TDR, those which use TDR/TDT, and those which use 2-port TDR.
Notes d’application 2007-01-01 |
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Signal Integrity Analysis Series Part 2: 4-Port TDR/VNA/PLTS
This Application Note focuses on part 2: those which use a 4-port TDR/VNA/PLTS.
Notes d’application 2007-02-21 |
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Signal Integrity Analysis Series Part 3: The ABCs of De-Embedding
This Application Note focuses on Part 3: The ABCs of De-Embedding explaining different de-embedding techniques & shows how to minimize fixture effects for best results.
Notes d’application 2007-07-01 |
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