數位與類比設計
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- Agilent EEsof EDA 設計軟體 (27)
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軟體
26-44 / 44
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Is Simulation a Requirement for Memory Designs Webcast
Live broadcast February 20, 2013; 10am Pacific / 1pm Eastern
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Minimizing Crosstalk in Hi-Speed Interconnects using Measurement-based Modeling
This Presentation presented by Mike Resso (Agilent Technologies) focuses on minimizing crosstalk in high speed interconnects using measurement-based modeling.
研討會講義 2006-09-01 |
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Modeling Optical Fiber Communication with Channel Simulation Webcast
Live broadcast March 6, 2013; 10am Pacific / 1pm Eastern
網路廣播 -- 存檔 |
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Overcome High Speed Digital Design Challenges Webcast Series
Series of live and on-demand webcasts
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Overcome PI Challenges on Perforated Power/Groung Planes
This presentation explains a different approach that's applicable to PI analysis on cost reduced consumer boards whose power/ground planes are perforated with signal traces.
研討會講義 2012-01-19 |
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PCI Express(R) 3.0 Strategies for Transmitter and Receiver Validation
Originally broadcast Feb 10, 2011
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Physical Layer design challenges for PCI Express® 3.0 and 2.0 designs
You will learn advanced techniques for PCI Express phy-layer validation covering the latest PCIe 3.0 specification requirements as well as practical extensions to PCIe 2.0 and 1.1 designs. This seminar analyzes transmitter and receiver performance.
網路廣播 -- 存檔 |
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Signal Integrity Design Using Channel Simulation and EM Co-design
The materials in this self-guided workshop will show you the “what if” design space exploration workflow that our new statistical eye diagram channel simulator enables
研討會講義 2010-04-21 |
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Signal Integrity: Include Post-layout PCB Artwork into your Eye Diagram and BER Contour Simulation
Originally broadcast May 5, 2010. Part of the Series: Signal Integrity for High Speed Digital Interconnects.
網路廣播 -- 存檔 |
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Successful High Speed Digital Design with ADS, EMPro, and SystemVue
The materials in this self-guided workshop will show you the latest high speed digital capabilites in ADS 2011.
研討會講義 2011-09-29 |
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SuperSpeed USB 3.0 Validation and Compliance Testing Challenges
Originally broadcast May 18, 2011;
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Tips to Debugging DDR 1, 2 and 3 Physical and Protocol Layer Issues webcast
訓練教材 2009-01-06 |
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Understanding Cross Modulation Effects in a Full Duplex LTE Transceiver
Originally broadcast July 22, 2010
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Understanding DDR4 AC Timing Parametrics Webcast
Original broadcast March 20, 2013
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USB 3.0 Physical Layer Test Challenges: Gen3 and Beyond Webcast
Live broadcast June 13, 2013; 10am Pacific / 1pm Eastern
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USB 3.0 Superspeed PHY Testing Challenges: Verify your 5Gbps design to the specification
訓練教材 2009-04-15 |
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Using IBIS AMI Models as ‘Executable Data sheets’ in High Speed Digital Interconnect Simulations
Originally broadcast Sept 9, 2010. Part of the Series: Signal Integrity for High Speed Digital Interconnects.
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What on Earth is Jitter Amplification, and Why Should I Care Webcast
Original broadcast April 9, 2013
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Which EM Solver Should I Use?
Originally broadcast June 15, 2010
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