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Reducing Process Defect Escapes with Vectorless Test 
Process defects that escape in-circuit test lead at best to increased repair costs, and at worst to a "bone pile1" problem.

Application Note 2001-05-17

PDF PDF 512 KB
System Issues in Boundary-Scan Board Test 
While Boundary-Scan is a powerful test tool, test engineers are finding out that yesterday's DFT rules and test approaches may actually be detrimental to successfully testing systems on a board.

Application Note 2003-01-28

PDF PDF 37 KB
Test and Inspection as Part of the Lead-free Manufacturing Process 
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.

Application Note 2005-02-22

PDF PDF 421 KB
Test Coverage: What Does It Mean when a Board Test Passes? 
Originally presented at the 2002 International Test Conference -- Characterizing board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage, especially in a limited access testing environment.

Application Note 2003-07-28

PDF PDF 266 KB
Testing Transformers on Unpowered Systems 
This paper explains how to test basic analog parts, using unpowered systems.

Application Note 2003-03-21

PDF PDF 10 KB
The Future of In-Circuit Testing in the High-speed, Complex Electronics Environment 
As board complexity and node counts continue to rise and high speed differential signaling continues to grow in popularity, In-Circuit Test needs to move quickly beyond the traditional realms. This article explores this in detail.

Application Note 2007-10-31

PDF PDF 176 KB
Sprachen 
The Importance of Test and Inspection When Implementing Lead-Free Manufacturing 
Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free.

Application Note 2004-08-20

PDF PDF 260 KB
Tying a Power Supply to Multiple Boards in a Panel 
If you have a situation with multiple boards on a panel, and you need to wire one or more power supplies to each board, you often can wind up with problems wiring power and ground. Usually, you'll see warnings of the type FXT66.

Application Note 2001-06-12

PDF PDF 16 KB
UNIX vs. Windows Differences for 3070 Users 
This documentation serves as a PC transition guide to help existing 3070 customers migrate from the Unix platform to the PC platform.

Application Note 2002-09-19

 
Up-and-Down Programming DUT Power Supplies 
There seems to be some confusion on what the current limits are when using the DUT supplies in the Agilent 3070 system. While this article is not meant to be an exhaustive treatise on the subject, a little clarification might help.

Application Note 2001-05-17

PDF PDF 23 KB
Using Boundary Scan to Link Design and Manufacturing Test 
By leveraging boundary-scan tests generated in Design and re-using them at Manufacturing Test, manufacturers can produce long-term benefits in terms of lower costs, greater efficiencies and higher quality products.

Application Note 2003-03-01

PDF PDF 502 KB
Using Lead-Free PCB Finishes at Manufacturing In-circuit Test Stage 
The purpose of this document is to share experiences and educate engineers regarding different PCB surface finishes and the specific changes required in the PCB build process to allow for ICT.

Application Note 2004-08-08

PDF PDF 102 KB
What to Consider When Selecting the Optimal Test Strategy 
This paper addresses several issues for selecting the optimal inspection strategy, presenting data from many studies that Agilent has performed in the quest to find the optimal test / inspection strategy.

Application Note 2003-03-01

PDF PDF 175 KB
Windows & Unix Feature Comparison 
The Windows & Unix 3070 Feature Comparison document provides a detailed listing of features translated to the Windows based 3070 from the Unix based 3070.

Application Note 2002-07-31

PDF PDF 71 KB
Writing Flash Memory with Agilent 3070 Systems 
Flash memory is traditionally programmed on PROM programmers, but some manufacturers report a one percent damage rate due to the extra handling steps required!

Application Note 2001-05-18

PDF PDF 31 KB

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