元件與特定裝置
移除所有細分1 / 1
|
Designing to Digital Wireless Specifications using Circuit Envelope Simulation
This Paper by How-Siang Yap discusses the Circuit Envelope technology developed specifically to simulate modern wireless circuits with complex digitally modulated RF signals such as CDMA and TDMA.
技術總覽 1998-06-01 |
PDF
245 KB
|
註冊myAgilent
註冊您的產品
為何選擇向安捷倫採購