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射頻與微波設計

安捷倫設計軟體提供已驗證的射頻和微波解決方案，這些解決方案具有極其準確的模型和功能強大的模擬技術，以便進行電路、電磁場 (EM) 和系統級設計的模擬。 使用安捷倫產品，您可準確查明問題所在，將設計最佳化，並按時完成設計。

射頻和微波設計挑戰

不斷增加的基板層數目、更小巧的外型、複雜的封裝技術，以及更優異的設計接近性等因素，使得射頻和微波設計更具挑戰性。
無縫積體電路和電磁模擬工具涵蓋從電路圖輸入，一直到生產、驗證的整個過程。
模擬技術效能的不斷創新，不但可提高準確度，同時還可大幅加快模擬。

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智慧型手機應用中，射頻接收器對數位雜訊效應的靈敏度 
原始播放時間為 2011 年 10 月 6 日

網路廣播 -- 存檔

 
60 GHz Power Amplifier Design for Wireless HDMI 
Originally broadcast Oct 13, 2009 - Access the .pdf file of the presentation

網路廣播 -- 存檔

 
A Faster and Effective RF Module/LTCC Design Flow with AMC 
This Presentation details why Electro-Magnetic (EM) Simulation for RF Module/LTCC is required and usage of Advanced Model Composer (AMC) for faster and effective RF Module/LTCC Design Flow.

研討會講義 2007-11-15

PDF PDF 3.07 MB
Advanced Design System 2009U1 Fundamentals 
This medium-paced, 3-day course provides detailed introduction to the application of Advanced Design System for communication systems and circuit designs. Click on link to view full course description and class dates and locations.

教室教育訓練

 
Agilent EEsof EDA Customer Education and Services 
Brief overview of Agilent EEsof EDA Customer Education and Services.

訓練教材 2010-08-11

 
Antenna Design Automation with Scripting and Parameterized EM Analysis Webcast 
Original broadcast February 7, 2013

網路廣播 -- 存檔

 
Beyond CMOS vs. GaAs – Finding the Best Technology Mix for a Handset PA Webcast 
Live broadcast June 13, 2013; 7am Pacific and 10am Pacific

網路廣播

 
Comprehensive mm-Wave Design Solutions for TSMC's 60-GHz CMOS RDK 
An introduction to the 60 GHz reference design kit (RDK) and complete RFIC design solutions with dedicated mm-Wave support.

研討會講義 2012-05-03

PDF PDF 4.44 MB
De-embedding Techniques in Advanced Design System 
A detailed Seminar on De-embedding technique used in Advanced Design System. This presentation covers the need of de-embedding, S-Parameters, TRL design, 2-Port and 4-Port de-embedding.

研討會講義 2006-06-01

PDF PDF 2.95 MB
Design of a 8 Watt, High efficiency X-band Power PHEMT Amplifier 
Originally broadcast March 16, 2010

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Detailed Presentation on Momentum - Part 1 of 3 
This Presentation (Part 1 of 3) focuses on Momentum versus Momentum RF, Creating substrate stack-ups and mapping layout layers as metallization layers, Placing and defining ports.

研討會講義 2003-05-19

PDF PDF 1.80 MB
Detailed Presentation on Momentum - Part 2 of 3 
This Presentation (Part 2 of 3) focuses on Defining mesh parameters, Low-frequency breakdown problem and Momentum accuracy.

研討會講義 2003-05-19

PDF PDF 1.01 MB
Detailed Presentation on Momentum - Part 3 of 3 
This Presentation (Part 3 of 3) focuses on Viewing and Using Momentum Results, Momentum Datasets, Momentum Visualization and ADS Data Display.

研討會講義 2003-05-19

PDF PDF 790 KB
Detailed Presentation on Momentum Advanced Topics - (Part 1 of 5) 
This Presentation (Part 1 of 5) focusses on Momentum Co-Simulation and Momentum Co-Optimization using Layout Components.

研討會講義 2003-05-19

PDF PDF 7.96 MB
Detailed Presentation on Momentum Advanced Topics - (Part 2 of 5) 
This Presentation (Part 2 of 5) focusses on Thick Conductor Simulation.

研討會講義 2003-05-19

PDF PDF 3.67 MB
Detailed Presentation on Momentum Advanced Topics - (Part 3 of 5) 
This Presentation (Part 3 of 5) focusses on Thick Conductor Simulations Coupled Lines examples and Spiral Inductor simulations.

研討會講義 2003-05-19

PDF PDF 6.18 MB
Detailed Presentation on Momentum Advanced Topics - (Part 4 of 5) 
This Presentation (Part 4 of 5) focusses on Advanced Model Composer (AMC) including Spiral Inductor Simulations.

研討會講義 2003-05-22

PDF PDF 8.64 MB
Detailed Presentation on Momentum Advanced Topics - (Part 5 of 5) 
This Presentation (Part 5 of 5) focusses on final wrap up, project files and other resources.

研討會講義 2003-05-19

PDF PDF 640 KB
EM Insights Series Episode #2: Single and Multiple Band Microstrip Planar Array Antenna 
An Agilent Technologies Presentation (EM Insights Series, Episode #2) decribes single (C Band) and multiple band (C and X band) microstrip planar array antenna in detail.

研討會講義 2009-03-30

PDF PDF 1.06 MB
EM Insights Series Episode #5: BGA Package Simulation 
An Agilent Technologies Presentation (EM Insights Series, Episode #5) describes BGA package simulation in detail.

研討會講義 2009-03-31

PDF PDF 620 KB
EMC 2013 - IEEE International Symposium on Electromagnetic Compatibility  
August 5- 9, 2013; Denver, CO

展覽會

 
End-to-End Design and Simulation of Handset Modules 
What goes into real-life PA design considerations? Dr. Peter Zampardi and Dr. Hongxiao Shao share Skyworks design methodology considering all components necessary for a handset power amplifier (PA) or Front-end Module (FEM) based on III-V HBT and BiFET technologies.

研討會講義 2012-02-27

PDF PDF 1.02 MB
Fast Characterization of Power Amplifier Performance with Modulated Signals 
Innovations in EDA Webcast Series: Part 3 of the RF Power Amplifier Design Series.

研討會講義 2012-04-05

PDF PDF 1.79 MB
Fast Characterization of Power Amplifier Performance with Modulated Signals 
Original broadcast Apr 5, 2012

網路廣播 -- 存檔

 
GaN on SiC: RFMD High Power Doherty Design, Modeling & Measurement Webcast 
Original broadcast March 7, 2013

網路廣播 -- 存檔

 

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