聯絡安捷倫專家

射頻與微波設計

安捷倫設計軟體提供已驗證的射頻和微波解決方案,這些解決方案具有極其準確的模型和功能強大的模擬技術,以便進行電路、電磁場 (EM) 和系統級設計的模擬。 使用安捷倫產品,您可準確查明問題所在,將設計最佳化,並按時完成設計。

射頻和微波設計挑戰

不斷增加的基板層數目、更小巧的外型、複雜的封裝技術,以及更優異的設計接近性等因素,使得射頻和微波設計更具挑戰性。
無縫積體電路和電磁模擬工具涵蓋從電路圖輸入,一直到生產、驗證的整個過程。
模擬技術效能的不斷創新,不但可提高準確度,同時還可大幅加快模擬。

觀看YouTube影片 

26-50 / 113

排序:
Detailed Presentation on Momentum Advanced Topics - (Part 2 of 5) 
This Presentation (Part 2 of 5) focusses on Thick Conductor Simulation.

研討會講義 2003-05-19

PDF PDF 3.67 MB
Detailed Presentation on Momentum Advanced Topics - (Part 3 of 5) 
This Presentation (Part 3 of 5) focusses on Thick Conductor Simulations Coupled Lines examples and Spiral Inductor simulations.

研討會講義 2003-05-19

PDF PDF 6.18 MB
Detailed Presentation on Momentum Advanced Topics - (Part 4 of 5) 
This Presentation (Part 4 of 5) focusses on Advanced Model Composer (AMC) including Spiral Inductor Simulations.

研討會講義 2003-05-22

PDF PDF 8.64 MB
Detailed Presentation on Momentum Advanced Topics - (Part 5 of 5) 
This Presentation (Part 5 of 5) focusses on final wrap up, project files and other resources.

研討會講義 2003-05-19

PDF PDF 640 KB
Digitizer Design Fundamentals for Superior Measurements 
Original broadcast Mar 21, 2012

網路廣播 -- 存檔

 
Discrete Oscillator Design Tools and Techniques 
Originally broadcast Sept. 16, 2010

網路廣播 -- 存檔

 
EM Insights Series Episode #2: Single and Multiple Band Microstrip Planar Array Antenna 
An Agilent Technologies Presentation (EM Insights Series, Episode #2) decribes single (C Band) and multiple band (C and X band) microstrip planar array antenna in detail.

研討會講義 2009-03-30

PDF PDF 1.06 MB
EM Insights Series Episode #3: Wireless Network Card Antenna Design 
An Agilent Technologies Presentation (EM Insights Series, Episode #3) decribes wireless network card antenna design in detail.

研討會講義 2009-03-30

PDF PDF 677 KB
EM Insights Series Episode #5: BGA Package Simulation 
An Agilent Technologies Presentation (EM Insights Series, Episode #5) describes BGA package simulation in detail.

研討會講義 2009-03-31

PDF PDF 620 KB
EMC 2013 - IEEE International Symposium on Electromagnetic Compatibility  
August 5- 9, 2013; Denver, CO

展覽會

 
End-to-End Design and Simulation of Handset Modules 
What goes into real-life PA design considerations? Dr. Peter Zampardi and Dr. Hongxiao Shao share Skyworks design methodology considering all components necessary for a handset power amplifier (PA) or Front-end Module (FEM) based on III-V HBT and BiFET technologies.

研討會講義 2012-02-27

PDF PDF 1.02 MB
Fast Characterization of Power Amplifier Performance with Modulated Signals 
Original broadcast Apr 5, 2012

網路廣播 -- 存檔

 
Fast Characterization of Power Amplifier Performance with Modulated Signals 
Innovations in EDA Webcast Series: Part 3 of the RF Power Amplifier Design Series.

研討會講義 2012-04-05

PDF PDF 1.79 MB
Filter Design for LTE 
Genesys "How-To-Design" Part 2 of 6

研討會講義 2009-11-19

PDF PDF 1.85 MB
GaN on SiC: RFMD High Power Doherty Design, Modeling & Measurement Webcast 
Original broadcast March 7, 2013

網路廣播 -- 存檔

 
Genesys Concepts 
3-day, hands-on course based on Genesys version 2010.05 SP1.

教室教育訓練

 
Genesys Webcasts - "How-To-Design" series  
Originally broadcast in 2009. Access the 6 WebEX recordings

網路廣播 -- 存檔

 
Hands-on Workshop on RF SiP/Module Design 
This Presentation serves as a workshop material detailing hand-on experience of ADS design tools, utilities in RF SiP/Module design and covers an overview on Electro-Magnetic Simulation Technologies.

研討會講義 2007-11-15

PDF PDF 28.88 MB
High-speed Oscilloscope Probing: Ensuring Maximum Performance and Signal Integrity 
Originally broadcast March 10, 2011

網路廣播 -- 存檔

 
How To Verify the Data In Your LTE Uplink Signal 
Originally broadcast Feb 2, 2011

網路廣播 -- 存檔

 
How to Verify Your LTE MAC and RF Interactions 
Original broadcast Nov 16, 2011

網路廣播 -- 存檔

 
Hybrid-Active Load Pull with PNA-X and Maury Microwave 
Original broadcast Jun 12, 2012

網路廣播 -- 存檔

 
Impedance Matching Techniques for VLSI Packaging 
A detailed Seminar by Brock J. LaMeres, Rajesh Garg, Kanupriya Gulati, Sunil P. Khatri on Impedance matching techniques for VLSI packaging.

研討會講義 2006-05-25

PDF PDF 1.40 MB
Improved RF SiP/Module Design Productivity with New ADS 2008 
This Presentation brings out details of new features in ADS 2008 that increase the productivity of RF SiP/Module designs.

研討會講義 2007-11-15

PDF PDF 2.59 MB
IMS 2011 (IEEE MTT-S) – Connect, Expert to Expert, at Agilent Avenue 
2011 show, last June, 2011; Baltimore Convention Center

展覽會

 

上一個 1 2 3 4 5 下一頁