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MMIC Design

MMICs are at the core of most high-frequency, high-speed electronic products, performing functions such as microwave mixing, power amplification, low noise amplification, and high frequency switching. Many design steps are required for the development and manufacture of MMICs. Learn more with the MMIC Design Seminar Materials.

MMIC in a Package

Agilent's Advanced Design System (ADS) EDA software enables designers to solve these difficult challenges with:

  • A unique and advanced set of tools to create robust designs with first pass success and high yield. Read about this in Microwave Journal. 
  • Complete and continuously updated process design kits (PDKs) from all major MMIC Foundries. Learn more about RFIC and MMIC Foundry Partners.
  • A complete set of advanced simulation tools, seamlessly integrated into one single environment, which flows from schematic entry through to production and packaging of the MMIC.
  • Designing high power RFIC / MMIC components for products such as power amplifier modules, circuit simulation accuracy is dependent on having accurate device temperatures. This is addressed with integration of a full Electro-Thermal solution in the ADS flow.
  • The ability to verify, prior to fabrication, that a MMIC meets all specifications in its final package, using seamlessly integrated Planar EM and 3D-EM tools.
  • The ability to provide True Circuit verification to all wireless standards, prior to and post fabrication, using a complete set of the most accurate wireless verification tools.

MMIC PA

Unique Value to your MMIC Design Success

Agilent EEsof EDA provides unique value to your MMIC design success, including:

MMIC Schematic Design

MMIC Layout - TriQuint Semiconductor Inc. - Used by permission.

Learn more about MMIC Design Flow.

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Detailed Presentation on Momentum - Part 1 of 3 
This Presentation (Part 1 of 3) focuses on Momentum versus Momentum RF, Creating substrate stack-ups and mapping layout layers as metallization layers, Placing and defining ports.

Seminar Materials 2003-05-19

PDF PDF 1.80 MB
Detailed Presentation on Momentum - Part 2 of 3 
This Presentation (Part 2 of 3) focuses on Defining mesh parameters, Low-frequency breakdown problem and Momentum accuracy.

Seminar Materials 2003-05-19

PDF PDF 1.01 MB
Detailed Presentation on Momentum - Part 3 of 3 
This Presentation (Part 3 of 3) focuses on Viewing and Using Momentum Results, Momentum Datasets, Momentum Visualization and ADS Data Display.

Seminar Materials 2003-05-19

PDF PDF 790 KB
Detailed Presentation on Momentum Advanced Topics - (Part 1 of 5) 
This Presentation (Part 1 of 5) focusses on Momentum Co-Simulation and Momentum Co-Optimization using Layout Components.

Seminar Materials 2003-05-19

PDF PDF 7.96 MB
Detailed Presentation on Momentum Advanced Topics - (Part 2 of 5) 
This Presentation (Part 2 of 5) focusses on Thick Conductor Simulation.

Seminar Materials 2003-05-19

PDF PDF 3.67 MB
Detailed Presentation on Momentum Advanced Topics - (Part 3 of 5) 
This Presentation (Part 3 of 5) focusses on Thick Conductor Simulations Coupled Lines examples and Spiral Inductor simulations.

Seminar Materials 2003-05-19

PDF PDF 6.18 MB
Detailed Presentation on Momentum Advanced Topics - (Part 4 of 5) 
This Presentation (Part 4 of 5) focusses on Advanced Model Composer (AMC) including Spiral Inductor Simulations.

Seminar Materials 2003-05-22

PDF PDF 8.64 MB
Detailed Presentation on Momentum Advanced Topics - (Part 5 of 5) 
This Presentation (Part 5 of 5) focusses on final wrap up, project files and other resources.

Seminar Materials 2003-05-19

PDF PDF 640 KB
Innovations in EDA: Applying the Latest Technologies to MMIC Design 
This recorded Webcast uses an LTE RF power amplifier application to present the latest developments in design and simulation technologies.

Seminar Materials 2010-11-15

PDF PDF 627 KB
MMIC Design Seminar Materials 
Agilent EEsof EDA collection of MMIC Design Seminar Materials.

Seminar Materials 2010-03-11

 
MMIC/RFIC Packaging Challenges Slides 
These slides cover several applications including the Agilent custom TOPS package, Agilent QFN package, solder bumps for FC package, Balun & mixer IC module, and RFIC PA co-design.

Seminar Materials 2009-08-26

PDF PDF 3.79 MB
Presentation on High Yield MMIC Front-To-Back Design with ADS 2008 
This Presentation by J Sifri discusses how to take advantage of the latest productivity enhancements in ADS 2008 to implement a robust methodology for high yield MMIC designs.

Seminar Materials 2008-02-19

PDF PDF 4.28 MB
Presentation on Improved MMIC Design productivity with New ADS 2008 
A Technical Presentation on new features supported by ADS 2008 for MMIC designers by J Sifri (Agilent Technologies).

Seminar Materials 2007-10-01

PDF PDF 2.01 MB
Presentation on Momentum Optimization 
This Presentation illustrates the use of momentum and momentum optimization as part of design flow to design a 3.2 GHz radial stub filter.

Seminar Materials 2000-11-01

PDF PDF 912 KB