USB (2.0/3.0/Wireless) Design & Test Information Resource Center
USB 2.0 provides the 480 Mb/s data rate to accommodate data transfers between peripherals and computers. USB 2.0 devices are backwards compatible with USB 1.1 devices. USB 2.0 is also known as Hi-Speed USB.
USB 3.0 is a dual-bus architecture that incorporates USB 2.0 and a SuperSpeed bus (nominal data rate is 5 Gb/s).
Wireless USB is the wireless extension to USB that combines the speed and security of wired technology with the ease-of-use of wireless technology. Wireless USB supports robust high-speed wireless connectivity by utilizing the common WiMedia MB-OFDM Ultra-wideband (UWB) radio platform as developed by the WiMedia Alliance.
Specifications and compliance tests are defined by the USB Implementers Forum. The resources you find here will provide you with an overview of USB design, understand the latest measurement techniques, and illustrate design and debug approaches. Agilent – achieve your best design.
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Crossing the Digital-Analog Divide - White Paper
This white paper helps to better understand how to cope with the physical nature of signals that we might prefer to think of as bits, nibbles and bytes, let's start with an ideal digital waveform.
Application Note 2012-05-02 |
PDF
6.46 MB
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Debugging USB 2.0: It's Not Just A Digital World (AN 1382-3)
Debugging USB 2.0 Systems
Application Note 2006-10-05 |
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Strategies for Debugging Serial Bus Systems with Infiniium Oscilloscopes
This application note discusses the challenges associated with and new solutions for debugging serial bus designs including PCI-Express Generation 1, Inter Integrated Circuit (I2C), Serial Peripheral Interface (SPI), or Universal Serial Bus (USB)
Application Note 2009-06-01 |
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USB 2.0 Compliance Testing with Infiniium Oscilloscopes - Application Note
This Application Note discusses the Agilent solution for the USB 2.0 test suite. The Agilent solution is the only one-box solution that uses the official USB-IF scripts for precompliance ans compliance testing.
Application Note 2013-05-10 |
PDF
2.02 MB
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