Parla con un Esperto

Premier Si/III-V Device Modeling and Characterization Solutions

Agilent provides premier solutions for characterization and modeling of cutting-edge CMOS and compound semiconductor devices. Agilent is the only vendor that provides complete end-to-end modeling solutions, from automated measurements, accurate device model extraction, comprehensive qualification to final process design kit (PDK) validation. Comprehensive modeling services are offered, supported by Agilent’s expert engineers and advanced labs. Some of our key device modeling and characterization EDA software solutions include:

  • IC-CAP: A versatile and user programmable industry standard for semiconductor device modeling
  • IC-CAP WaferPro: Fast and accurate automated measurement software
  • Model Builder Program (MBP): Complete Silicon turnkey device modeling software
  • Model Quality Assurance (MQA): Industry standard SPICE model signoff and acceptance software

Device modeling and characterization challenges

  • As device geometries get smaller, the need to use accurate models and to control statistical variations in device processing performance becomes ever more important
  • Circuit designers need models that can accurately predict DC behaviors, as well as RF and noise behaviors
  • Different process technologies require a variety of models that can be quickly adapted to the unique processes
  • With modeling measurements taking hours or even days, measurement control software must also work with probers and instruments to allow automated measurements across temperature

Explore YouTube Videos 

1-25 of 42

Sort:
Agilent EEsof EDA Newsletter - Product and Application News 
Keep tabs on the latest product and application news and review the archives of the Agilent EEsof EDA Newsletter.

Newsletter 2014-04-10

 
Pulsed Measurement of Active Device IV Characteristics and S-Parameters - Maury Microwave 
Pulsed Measurement of Active Device IV Characteristics and S-Parameters from Maury Microwave and Agilent

Soluzioni 2014-04-02

 
Pulsed Measurement of IV Characteristics and RF Parameters – Auriga Microwave 
Pulsed Measurement of IV Characteristics and RF Parameters from Auriga Microwave and Agilent

Soluzioni 2014-04-01

 
Agilent Technologies Announces Next-Generation System for Measuring Flicker Noise 
Agilent introduces the Agilent EEsof EDA E4727A Advanced Low-Frequency Noise Analyzer—a next-generation hardware and software system for measurement and analysis of flicker noise and random telegraph noise (RTN).

Press Materials 2014-03-13

 
Agilent Technologies Simulation and Modeling Software Selected by Nitronex for High-Power GaN Design 
Agilent announces that Nitronex, a GaAs labs company and leading producer of GaN-on-silicon RF power devices, has selected Agilent to provide a complete GaN design flow that spans both device modeling and circuit simulation.

Press Materials 2014-02-11

 
MBP and MQA Adopted by Microchip Technology for PDK Creation, Modification, Validation 
Agilent Technologies announces that Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, has adopted Agilent EEsof EDA's Model Builder Program and Model Quality Assurance software. Microchip Technology will use the software to create internal fabrication device model libraries or process design kits, modify external foundry libraries, and validate supported devices from internal and external sources.

Press Materials 2013-12-09

 
EDA Support Services 
Agilent Support Services for EDA Products offers customers several benefits otherwise not available. This service is designed to help you get the most out of your software purchases.

Brochure 2013-11-09

PDF PDF 128 KB
Agilent RF and Microwave Industry-Ready Student Certification Program 
This program confirms a student’s technical knowledge, design expertise, and hands-on measurement proficiency in the use of Agilent EEsof software design tools and Agilent instruments.

Brochure 2013-10-16

PDF PDF 640 KB
Agilent EEsof EDA Premier Communications Design Software 
The Agilent EEsof EDA catalog provides an excellent overview of all of Agilent's Electronic Design Automation (EDA) tools.

Catalog 2013-10-07

PDF PDF 8.61 MB
Agilent EEsof EDA Product Overview 
Agilent EEsof EDA premier communications design software product overview brochure.

Brochure 2013-09-30

PDF PDF 1.68 MB
Agilent EEsof EDA Software and Modular Solutions for Universities 
Agilent works in collaboration with universities to provide tools that enable education and research for the engineers of tomorrow. The brochure outlines available programs, software and hardware.

Brochure 2013-08-16

PDF PDF 3.80 MB
Agilent's MBP and MQA Software Adopted by Shanghai Consortia for Advanced Device Modeling 
Agilent announces that the Shanghai Integrated Circuit Research and Development Center, a nonprofit research consortia dedicated to advancing the microelectronics industry in China, is using Agilent's Model Builder Program and Model Quality Assurance software for model extraction and verification at 45-nm process nodes.

Press Materials 2013-07-09

 
Agilent Technologies Introduces Industry’s First Solution for Modeling Power Devices 
Agilent announces that IC-CAP has been enhanced to provide full support for the B1505A Power Device Analyzer/Curve Tracer, including the instrument’s new high-power, high-current source monitor unit modules.

Press Materials 2013-06-24

 
Agilent EEsof EDA Customer Support Brochure 
Whether you are a novice or an experienced user, Agilent EEsof EDA’s customer support offerings are designed to help you every step of the way.

Brochure 2013-05-28

PDF PDF 681 KB
Model Quality Assurance (MQA) 
MQA provides the complete solution and framework to fabless design companies, IDMs, and foundries for SPICE model library validation, comparison, and documentation.

Brochure 2013-04-10

PDF PDF 1.40 MB
Model Builder Program (MBP) 
MBP is a one-stop solution that provides both automation and flexibility for silicon device modeling.

Brochure 2013-04-10

PDF PDF 1.76 MB
Agilent Ships Newest SPICE Model Extraction and Qualification Software 
Agilent announces shipment of the latest release of its industry-leading SPICE model extraction tool, Model Builder Program, and SPICE qualification tool, Model Quality Assurance.

Press Materials 2013-03-13

 
Agilent Technologies Launches Recognition Program for EDA Experts 
Agilent launches its Agilent Certified Expert recognition program for EDA experts. Eligible participants include individuals demonstrating a high level of expertise-both theoretical and practical-in applying Agilent EEsof EDA tools for product design and modeling.

Press Materials 2013-03-12

 
Agilent embraces GaN modeling in IC-CAP upgrade 
EETimes Design Article highlights new capabilities in IC-CAP 2013.01.

Article 2013-01-09

 
IC-CAP Device Modeling Software 
Technical overview of Agilent's Integrated Circuit Characterization and Analysis Program (IC-CAP), complete and accurate parameter extraction for semiconductor device modeling

Technical Overview 2012-12-20

Agilent Technologies Unveils New IC-CAP Platform for Device Characterization and Modeling 
Agilent announces the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP).

Press Materials 2012-12-18

 
MOS-AK/GSA Modeling Working Group Holds Winter Workshop in San Francisco 
Experts Share Insight on Compact Device Modeling with Emphasis on Simulation-Aware Models.

Press Materials 2012-12-12

 
Future Device Modeling Trends 
Modeling the nonlinear device (basic nonlinear component) for circuit and system simulation downstream.

Article 2012-11-28

PDF PDF 6.08 MB
X-Parameter Design Simulation Models - Modelithics 
X-Parameter Design Simulation Models from Modelithics and Agilent.

Soluzioni 2012-10-02

 
Agilent Technologies Ships New Software for Generating and Qualifying SPICE Models 
Agilent today announced shipment of its first release of the industry-leading SPICE modeling tools it obtained through the acquisition of Accelicon Technologies in February.

Press Materials 2012-08-23

 

1 2 Next