제조 및 생산 테스트
1-25 / 125
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Burn-In Test - LXinstruments
Burn-in Testing Solutions from LXinstruments and Agilent.
솔루션 개요 2012-12-04 |
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PXI Functional Test - TTCI
PXI Functional Test Solution from TTCI and Agilent
솔루션 개요 2012-08-03 |
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Functional Test - TTCI
Functional Test Solutions from TTCI and Agilent.
솔루션 개요 2012-07-24 |
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LXI Functional Test - LXinstruments
LXI Functional Test Solutions from LXinstruments and Agilent.
솔루션 개요 2012-06-22 |
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Automotive Radar Test - Konrad
Automotive Radar Test Solution from Konrad and Agilent.
솔루션 개요 2012-06-12 |
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Modular Functional Test – Circuit Check
Modular Functional Test Solutions from Circuit Check and Agilent
솔루션 개요 2012-06-09 |
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Test Instrument Emulator - WinSoft
Test Instrument Emulation Solution from WinSoft and Agilent.
솔루션 개요 2012-05-11 |
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Power Supply Test – FineTest
Power Supply Test Solutions from FineTest and Agilent
솔루션 개요 2012-03-14 |
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Building Hybrid Test Systems. Ensuring success in two common development scenarios - Application Not
Application Note 1465-33. When you migrate to a hybrid system that includes LXI along with GPIB, VXI, PXI, or any other architecture, two scenarios are most typical, minimum development time and maximum overall performance
어플리케이션 노트 2008-10-15 |
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High Node Count Fixturing Solutions for Agilent Short-Wire Test Fixtures
This paper discusses problems encountered in building large, high node count vacuum actuated test fixtures for the Agilent 3070 family of board test systems.
어플리케이션 노트 2008-04-30 |
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67 KB
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Using LXI to Boost Throughput in Semiconductor Manufacturing
This document is a case study that discusses the successful customer implementation of an Agilent LXI solution for a multinational semiconductor manufacturer
어플리케이션 노트 2007-04-25 |
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234 KB
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Maximising Test Coverage with Agilent Medalist VTEP v2.0
This paper describes how to get the most from Agilent Technologies’ industry-leading vectorless test innovation, the Medalist VTEP v2.0 which is a suite of solution comprising VTEP, iVTEP and NPM.
어플리케이션 노트 2007-04-17 |
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Life and Stability of the Agilent 5DX Sealed X-ray Tube
Agilent has developed a sealed ultra-high vacuum X-ray tube that provides stable output throughout a significantly long life.
어플리케이션 노트 2007-01-22 |
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78 KB
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Considerations for Surface Map Setup
The concept of delta-Zs is perhaps the most difficult thing to understand about the surface map process.
어플리케이션 노트 2006-08-08 |
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SEMI S2 Standard Modifications for Agilent 3070 and Related Equipment
This document describes three items pertaining to the Agilent 3070 and the SEMI S2 standard. Each of them is related to a variance with the SEMI standard.
어플리케이션 노트 2006-06-15 |
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52 KB
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AOI - A Strategy for Closing the Loop
This paper describes a set of defect prevention solutions centered on the availability of high-quality inspection and measurements data from an AOI system and a few carefully engineered software applications
어플리케이션 노트 2006-04-16 |
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291 KB
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“Shotgunning”, a Bad Fit for Lead-Free Test
Shotgunning, a common repair technique in functional test, will be negatively affected by lead-free processes. This article explores the technique and draws broad conclusions regarding the impact of lead-free on electronics manufacturing test
어플리케이션 노트 2006-02-07 |
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44 KB
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애질런트 34401A를 신형 34410A/34411A 고성능 디지털 멀티미터로 교체
본 어플리케이션 노트는 애질런트 34401A 6.5 디지털 멀티미터와 신형 34410A 및 34411A 6.5디지트 고성능 DMM의 차이에 대한 높은 수준의 개요를 제공합니다.
어플리케이션 노트 2005-11-15 |
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N6700 Modular Power System: Determining Specifications when Paralleling Outputs (AN 1560)
어플리케이션 노트 2005-07-27 |
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How to Get the Most from Agilent's Intelligent Yield Enhancement Test (IYET)
This paper describes how to get the most from IYET for Agilent board test systems.
어플리케이션 노트 2005-07-15 |
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Design Considerations for PC Board Carriers for Use in the Agilent 5DX
There are several reasons why it may be necessary or desirable to use a carrier to transport printed circuit assemblies through the 5DX. This paper discusses these and some considerations for the design of suitable carriers.
어플리케이션 노트 2005-07-13 |
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918 KB
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AXI and Lead-Free Process Characterization
How to use Automated X-ray Inspection as a tool to characterize new lead-free soldering processes.
어플리케이션 노트 2005-06-21 |
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In-circuit Testing of Low Voltage Devices
Core technical document summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.
어플리케이션 노트 2005-05-25 |
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172 KB
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Gauge Repeatability on 5DX X-ray System
Summary of 5DX repeatability capability, factors that influence the repeatability capabilities of the 5DX, impacts to gauge repeatability and reproducibility (GR&R) results.
어플리케이션 노트 2005-03-09 |
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102 KB
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Test and Inspection as Part of the Lead-free Manufacturing Process
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.
어플리케이션 노트 2005-02-22 |
PDF
421 KB
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