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EMC 2010 Symposium Wrap Up 
Read the article and watch the demo to learn more about the N6141A/W6141A EMC measurement application for X-Series signal analyzers.

特集記事 2010-08-09

 
Enabling Fast Characterization of PA Performance with Modulated Signals 
Microwave Product Digest (MPD) featured article written by Agilent Technologies' Andy Howard.

雑誌記事 2012-10-15

 
Enabling Simulation and Test of Custom OFDM Signals 
Orthogonal frequency division multiplexing (OFDM) has become attractive for many current and emerging commercial applications because it provides a combination of data throughput, scalability, and robustness.

記事 2013-04-01

 
Envelope Transient Analysis: Successful Wireless Systems and IC Designs 
This Article highlights the Envelope Transient Analysis required for Wireless Systems and IC Designs by Dr. Alex Passinsky and Dr. Vladimir Veremey (Xpedion Design Systems, Inc.).

記事 2000-02-22

PDF PDF 752 KB
ESL Design Notebook Blog 
The blog home of Electronic System-Level Design at Agilent highlighting applications, news, and opinions from a cross-discipline, system-level approach to design and verification in communications and defense.

雑誌記事 2013-04-02

 
Fast Multitone Analysis of RF Transceivers 
This Article written by George Estep, Pete Johnson and Vladimir Veremey describes Fast Multitone analysis of RF Transceivers in detail.

記事 2009-03-24

PDF PDF 1.74 MB
Flexible Software-Defined Test Instruments 
This Article by Greg Jue presents the next generation of software defined test instruments; a key element in cost control, time to market, design flexibility and standards evolution.

記事 2006-11-01

PDF PDF 1.95 MB
Follow Agilent EEsof EDA on Twitter! 
Twitter enables you to keep current on news and updates with Agilent EEsof through the exchange of quick, frequent answers to one simple question: What are you doing?

ニュースレター 2010-03-04

 
How to Build EM-Accurate Parameterized Passive Models? 
An Article by Mounir Adada (Agilent Technology) highlights how modern EM parametric modeling tools can contribute in getting the products out the door right the first time.

記事 2002-05-30

PDF PDF 165 KB
How to design a high-performance scope: One team’s approach 
EE Times Design Article on how an Agilent Technologies design team discovers some valuable lessons that could prove useful for any designer or design team looking for success on their next project.

記事 2012-06-07

 
Inphi Delivers Memory Interface Chip for DDR3-1600 Using Advanced Design System 
This Success Story details how Inphi delivered memory interface chip for DDR3-1600 using Agilent’s Advance Design System (ADS).

事例紹介 2009-03-12

PDF PDF 196 KB
Integrated Solutions for Testing Wireless Communication Systems 
IEEE Communications Magazine, Topics in Radio Communications article on SystemVue test solutions, June 2011.

記事 2011-06-02

PDF PDF 1.04 MB
Linearizing PAs using Digital Predistortion, EDA Tools and Test Hardware 
This Article describes the process for developing and implementing an effective power amplifier linearization scheme using baseband adaptive digital pre-distortion.

記事 2004-04-01

PDF PDF 490 KB
LTE Layer 1 Verification using SystemVue, Xilinx/SystemVue Case Study 
Xilinx, a leading FPGA provider for wireless communications, uses Agilent SystemVue to bring measurement-grade verification to the inside of the baseband design process

事例紹介 2010-02-02

PDF PDF 104 KB
Microwave Journal Cover Article: X-parameters Fundamentally Changing Nonlinear Microwave Design 
Provides an overview of the invention and need for x-parameters to model the behavior of non-linear devices. This is an article reprint from Microwave Journal, Issue March 2010, Vol.53. No.3

記事 2010-03-25

PDF PDF 771 KB
Mindspeed Technologies, Inc. "LTE and WiMAX™ Layer 1 Compliance using SystemVue" 
Mindspeed, a leading IC provider to the wireless communications infrastructure market, uses Agilent SystemVue to bring measurement-grade verification inside the baseband design process.

事例紹介 2010-04-14

PDF PDF 44 KB
MMIC Design: Speed to Market with the Lowest Cost and Highest Yield 
This Article by Jack Sifri (Agilent Tech.) brings out the five important steps that are key elements of a successful MMIC Design process, in order to satisfy the speed to market at the lowest cost.

記事 2008-05-15

PDF PDF 1.58 MB
Multichannel scopes enable MIMO RF testing 
This article discusses troubleshooting techniques with time-coherent multichannel scopes and 89600 VSA software to gain insight into error mechanisms affecting their hardware EVM performance and system-level RF transmitter performance budgets.

記事 2011-04-12

 
New LDMOS Model Delivers Powerful Transistor Library - Part 1 
This Article presents a new CMC LDMOS model that can accurately predicts both small-signal and nonlinear performance, and is scalable for devices of different sizes and power output capabilities.

記事 2004-10-01

PDF PDF 530 KB
New LDMOS Model Delivers Powerful Transistor Library - Part 2 
This Article presents that the CMC (LDMOS FET) model can be scaled for a larger device, with a good fit for signal, power and distortion performance as illustrated by a 60W Doherty PA design example.

記事 2004-11-01

PDF PDF 684 KB
Overview: Applying Nonlinear RF Device Modeling to Verify S-Parameter Linearity 
This Article is intended to explain the basics of “what’s behind S-parameters” from a modeling engineer's standpoint & on how to apply Harmonic Balance simulators to check the validity of device models.

記事 2001-09-01

PDF PDF 460 KB
Power Amplifier Design Speed-Up Techniques 
This Article presents how to speed up Power Amplifier Design by fast source-pull, real-time load-pull and accurate measurement-based behavioural models.

記事 2005-11-01

PDF PDF 1.71 MB
Product How To: Design a polar frequency discriminator 
Polar frequency discriminators (PFD) are widely used in radar and direction-finding applications to determine the unknown frequency of incoming pulses. This article explains how to design the RF portion of a PFD, over a frequency range of 2 to 8 GHz, using Agilent’s ADS software.

記事 2012-06-08

 
RF SiP Design Verification Flow with Quadruple LO Down Converter SiP  
This Article by HeeSoo Lee and Dean Nicholson outlines the design flow used for a System-in-Package component, using multiple die integrated into a single packaged device.

記事 2007-05-01

PDF PDF 490 KB
Solving the RFIC Design for Yield and Verification Dilemma 
Microave Journal article on the role and evolution of simulation-based performance verification and yield for today’s highly integrated RFICs for digital wireless communications.

雑誌記事 2010-07-15

 

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