元件建模與特性分析
安捷倫提供完整的硬體和軟體解決方案，可用於半導體元件特性分析與建模。 現在大多數半導體大廠和整合式元件製造商 (IDM) 都採用安捷倫工具來建構元件建模解決方案，以便針對晶片 CMOS、Bipolar、混合砷化鎵 (GaAs)、氮化鎵 (GaN) 和許多其他元件技術進行測試。 準確的元件特性分析、精確先進的模型、有效的擷取及詳盡的驗證，是建立準確及強大模型庫的關鍵，也是設計成功的重要因素。
元件建模與特性分析挑戰
- 隨著元件尺寸越來越小，使用準確的模型並控制元件處理效能之統計變數，已變得越來越重要。
- 電路設計工程師需要能夠直流以及射頻和微波頻率範圍內，準確預測元件行為的模型。
- 不同的處理技術需要可因應不同處理程序，迅速進行調適的各種模型。
- 建模量測通常耗時數小時甚至幾天的時間，量測控制軟體也必須與探測器和儀器協同運作，以便在不同溫度條件下執行自動量測。
最新消息
- Accurate Modeling of GaAs & GaN HEMT’s for Nonlinear Applications
- Agilent Ships Newest SPICE Model Extraction and Qualification Software
- Agilent embraces GaN modeling in IC-CAP upgrade
- MOS-AK/GSA Modeling Working Group Holds Winter Workshop in San Francisco
- Agilent Technologies Unveils New IC-CAP Platform for Device Characterization and Modeling
移除所有細分1-16 / 16
|
ACCO Semiconductor chooses Agilent RFIC Solutions Software for Next-Generation CMOS Power Amplifier
GoldenGate is the most trusted simulation, verification and analysis solution available for integrated RF circuit design within the Cadence Virtuoso design flow.
新聞資料 2010-01-11 |
|
|
Agilent Announces Industry's First HiSIM2.4 Model Extraction Package for DC, RF Parameters
New IC-CAP Software Package Offers Improved CMOS Modeling Efficiency, Accuracy
新聞資料 2008-07-14 |
|
|
Agilent Announces Shipment of the IC-CAP 2012 Platform for Device Characterization and Modeling
Agilent announces shipment of the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP) for 2012.
新聞資料 2012-03-02 |
|
|
Agilent Completes Acquisition of Accelicon Technologies’ Solutions for Semiconductor Device Modeling
Agilent Technologies announced that Accelicon Technologies’ software solutions and technology for device-level modeling and validation in the electronics industry are now part of Agilent.
新聞資料 2012-02-21 |
|
|
Agilent Extends Partnership with AMCAD to Include Nonlinear Modeling and Measurement Services
Agilent announces that its long-term relationship with AMCAD Engineering has been extended to include a technology partnership for services related to nonlinear design and measurement of new electronic devices.
新聞資料 2012-06-19 |
|
|
Agilent Introduces IC-CAP WaferPro Software for Automating Complex Device Modeling Applications
IC-CAP WaferPro provides a multi-site, multi-wafer, automated DC and RF measurement solution for semiconductor device modeling applications.
新聞資料 2010-08-19 |
|
|
Agilent Ships Newest SPICE Model Extraction and Qualification Software
Agilent announces shipment of the latest release of its industry-leading SPICE model extraction tool, Model Builder Program, and SPICE qualification tool, Model Quality Assurance.
新聞資料 2013-03-13 |
|
|
Agilent Software Enables Successful Development of Hua Hong NEC's RF Device Modeling Platform
新聞資料 2010-06-11 |
|
|
Agilent Technologies Announces YouTube Channel for Agilent EEsof EDA
Channel Features More than 100 Videos with Subtitles in 50 Languages.
新聞資料 2010-01-19 |
|
|
Agilent Technologies Launches Recognition Program for EDA Experts
Agilent launches its Agilent Certified Expert recognition program for EDA experts. Eligible participants include individuals demonstrating a high level of expertise-both theoretical and practical-in applying Agilent EEsof EDA tools for product design and modeling.
新聞資料 2013-03-12 |
|
|
Agilent Technologies Ships Latest IC-CAP Platform for DC and RF Device Characterization and Modeling
Software improves modeling flow with link between measurement and extraction
新聞資料 2011-05-10 |
|
|
Agilent Technologies Ships New Software for Generating and Qualifying SPICE Models
Agilent today announced shipment of its first release of the industry-leading SPICE modeling tools it obtained through the acquisition of Accelicon Technologies in February.
新聞資料 2012-08-23 |
|
|
Agilent Technologies Unveils New IC-CAP Platform for Device Characterization and Modeling
Agilent announces the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP).
新聞資料 2012-12-18 |
|
|
Agilent to Demonstrate Its Newest RF/Microwave Design and Test Products at IMS
Agilent will demonstrate its newest design and test products for advanced RF and microwave research, development and manufacturing at the 2012 IEEE MTT-S International Microwave Symposium (Booth 1015), June 17-22, at the Palais des congrès de Montréal.
新聞資料 2012-06-04 |
|
|
Agilent's ADS for RF and Microwave High-Power Device Models Receives AMCAD Engineering Endorsement
新聞資料 2009-06-24 |
|
|
MOS-AK/GSA Modeling Working Group Holds Winter Workshop in San Francisco
Experts Share Insight on Compact Device Modeling with Emphasis on Simulation-Aware Models.
新聞資料 2012-12-12 |
註冊myAgilent
註冊您的產品
為何選擇向安捷倫採購