RF & Microwave
For most of your RF & Microwave measurement needs, you can find application & solution information here.
Be sure to check the library of application notes for detailed information on using your equipment and successfully completing the measurements you need.
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- RF & Microwave Design (63)
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- Press Materials (102)
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76-100 of 102
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Agilent's Newest SystemVue Software Release Accelerates MIMO Radar and Wireless/4G Design
Agilent announces the newest release of SystemVue, its premier platform for designing communications and defense systems.
Press Materials 2013-02-14 |
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Agilent's SystemVue Software Selected by Télécom ParisTech for 3G/4G Transmitter Research
Agilent announced that Télécom ParisTech, one of France's leading graduate engineering schools, has selected the company's SystemVue software for use in analog and mixed integrated systems research.
Press Materials 2012-02-28 |
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Aldec and Agilent Technologies Bridge the Gap Between ESL and RTL by Linking Simulation Environments
This new solution enables users to efficiently integrate algorithm and system-level designs with hardware implementations.
Press Materials 2012-07-10 |
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ClioSoft Announces the Integration of SOS Design Data Management with Advanced Design System
ClioSoft's integrated solution offers ADS users seamlessly integrated revision control and enterprise design data management
Press Materials 2013-05-07 |
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Cyntec Expands its Libraries Offering for Use with Advanced Design System 2011 Software Release
Cyntec Co., LTD, Hsinchu, announced the availability of an Advanced Design System (ADS) model library for Cyntec’s RF Chip inductors, CML0510 & CML0306 Series.
Press Materials 2012-05-15 |
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GLOBALFOUNDRIES Qualifying GoldenGate and Momentum Simulators for its RF CMOS Processes
GLOBALFOUNDRIES announces support for Agilent's GoldenGate RFIC circuit and Momentum 3D planar electromagnetic (EM) simulators for its 65nm Low Power enhanced (LPe) RF CMOS process.
Press Materials 2012-06-04 |
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IBM adds back-end PDK support for Agilent Technologies’ Advanced Design System Software
IBM announces the availability of a full front-to-back PDK for its popular SiGe BiCMOS 8HP technology. The PDK was developed for use with ADS 2011 and enables both IBM and Agilent customers to take full advantage of the industry’s most comprehensive RF and microwave design platform.
Press Materials 2012-06-18 |
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IHP Announces SiGe Process Design Kit (SG25H3) for Use with Agilent's ADS
Innovations for High Performance Microelectronics (IHP), Frankfurt (Oder), Germany, today announced the availability of a leading-edge ADS process design kit (PDK) for IHP’s 0.25µm SiGe process (SG25H3).
Press Materials 2008-10-27 |
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IHP Expands its SiGe Process Design Kit Offerings for Use with ADS 2011 Software Release
Innovations for High Performance Microelectronics (IHP) announces the availability of leading-edge ADS PDKs for its 0.25 μm SiGe process (SG25H3) and 0.13 μm SiGe process (SG13S).
Press Materials 2011-09-20 |
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Industry-First Approach to Measure and Simulate Nonlinear Component Behavior at All Load Impedances
Press Materials 2009-04-15 |
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Murata Component Library released for Agilent Technologies' Genesys
Murata Manufacturing Co. Ltd. announces their release of a component library for Agilent's Genesys software.
Press Materials 2012-10-10 |
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New ESL EDA Platform Helps Algorithm Developers, System Architects Cut Design Time in Half
Sept. 15, 2008 Press Release: Agilent Technologies' New Electronic System-Level EDA Platform Helps Algorithm Developers, System Architects Cut Design Time in Half
Press Materials 2008-09-15 |
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OMMIC Design Kits Offer Complete Front-to-Back Flow Support for ADS 2011
OMMIC announces the availability of their process design kits (PDKs) for use with Advanced Design System (ADS) 2011 EDA software.
Press Materials 2011-06-08 |
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ON Semiconductor Offers High-Q™ IPD Process Design Kit for Advanced Design System Software
ON Semiconductor Corporation, a premier supplier of high performance silicon solutions for energy efficient electronics, announces the availability of a full front-to-back process design kit (PDK) for its High-Q™ Integrated Passive Device process. The PDK was developed for use with Agilent Technologies’ Advanced Design System (ADS) 2011 EDA software and enables both ON Semiconductor and Agilent customers to take full advantage of the industry’s most comprehensive RF and microwave design platform.
Press Materials 2012-06-18 |
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Parasitic Reduction Tool Enhances RFIC Simulation Speed, Capacity While Preserving Accuracy
Agilent announces Jivaro-for-GoldenGate, a parasitic model order-reduction tool designed for GoldenGate.
Press Materials 2008-11-04 |
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Setting a New Standard for Flexible Network Analyzers
Press Materials 2009-06-01 |
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STATS ChipPAC Launches QFN Package Design Kit for Agilent Technologies’ Advanced Design System
STATS ChipPAC announces the launch of its Quad Flat No-Lead (QFN) package design kit for ADS.
Press Materials 2012-09-12 |
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SystemVue Selected by Yamagata University for OFDM for Optical Fiber Communications Research
Press Materials 2010-01-13 |
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TDK RF Solutions Announces Integration of Agilent MXE EMI Receiver
Press Materials 2011-03-18 |
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TILE! Software Supports New Agilent MXE EMI Receiver
Press Materials 2011-03-18 |
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Time-domain Simulations of High-speed Links with X parameters
Press Materials 2011-03-24 |
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TriQuint Semiconductor, Agilent Technologies Collaborate on Next-Generation Wireless Design Flow
Work Leads to Enhanced PDKs, Integrated RFIC/MMIC and RF Module Design Flows and Development of RF Module PDK
Press Materials 2011-05-18 |
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WIN Semiconductors Announces New Foundry Process Design Kit (PH50-00) for Use with Agilent’s ADS
February 24, 2009.
Press Materials 2009-03-04 |
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WIN Semiconductors Releases 0.25um Design Kits for use with ADS
Press Materials 2009-05-25 |
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X-FAB Qualifies GoldenGate and Momentum Simulators for its 0.35 Micrometer CMOS Process Family
X-FAB Silicon Foundries, a leading foundry group for analog/mixed-signal semiconductor applications, announces support for GoldenGate RFIC circuit and Momentum 3D planar EM simulators for X-FAB's 0.35 micrometer modular analog/mixed-signal technology with RF capability and high-voltage extensions.
Press Materials 2012-06-04 |
