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USB (2.0/3.0/Wireless) Design & Test Information Resource Center

USB 2.0 provides the 480 Mb/s data rate to accommodate data transfers between peripherals and computers. USB 2.0 devices are backwards compatible with USB 1.1 devices. USB 2.0 is also known as Hi-Speed USB.

USB 3.0 is a dual-bus architecture that incorporates USB 2.0 and a SuperSpeed bus (nominal data rate is 5 Gb/s).

Wireless USB is the wireless extension to USB that combines the speed and security of wired technology with the ease-of-use of wireless technology. Wireless USB supports robust high-speed wireless connectivity by utilizing the common WiMedia MB-OFDM Ultra-wideband (UWB) radio platform as developed by the WiMedia Alliance.

Specifications and compliance tests are defined by the USB Implementers Forum. The resources you find here will provide you with an overview of USB design, understand the latest measurement techniques, and illustrate design and debug approaches. Agilent – achieve your best design.

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정렬방식:
Accelerating USB 3.0 Protocol Development 
Original broadcast June 27, 2012

웹캐스트 - recorded

 
ADMF: Facing the challenges of Super speed USB 3.0 Product Development  
Agilent Digital Measurement Forum (ADMF): Facing the challenges of Super speed USB Product Development

세미나 프리젠테이션 2008-11-12

PDF PDF 1.78 MB
View the recorded webcast - How to handle USB 3.0 physical layer test requirements 
How to handle USB 3.0 physical layer test requirements.

교육 자료 2011-11-08