전문가 상담

MMIC Design

MMICs are at the core of most high-frequency, high-speed electronic products, performing functions such as microwave mixing, power amplification, low noise amplification, and high frequency switching. Many design steps are required for the development and manufacture of MMICs. Learn more with the MMIC Design Seminar Materials.

MMIC in a Package

Agilent's Advanced Design System (ADS) EDA software enables designers to solve these difficult challenges with:

  • A unique and advanced set of tools to create robust designs with first pass success and high yield. Read about this in Microwave Journal. 
  • Complete and continuously updated process design kits (PDKs) from all major MMIC Foundries. Learn more about RFIC and MMIC Foundry Partners.
  • A complete set of advanced simulation tools, seamlessly integrated into one single environment, which flows from schematic entry through to production and packaging of the MMIC.
  • Designing high power RFIC / MMIC components for products such as power amplifier modules, circuit simulation accuracy is dependent on having accurate device temperatures. This is addressed with integration of a full Electro-Thermal solution in the ADS flow.
  • The ability to verify, prior to fabrication, that a MMIC meets all specifications in its final package, using seamlessly integrated Planar EM and 3D-EM tools.
  • The ability to provide True Circuit verification to all wireless standards, prior to and post fabrication, using a complete set of the most accurate wireless verification tools.

MMIC PA

Unique Value to your MMIC Design Success

Agilent EEsof EDA provides unique value to your MMIC design success, including:

MMIC Schematic Design

MMIC Layout - TriQuint Semiconductor Inc. - Used by permission.

Learn more about MMIC Design Flow.

관련 링크

1-25 / 32

정렬방식:
60 GHz Power Amplifier Design for Wireless HDMI 
Originally broadcast Oct 13, 2009 - Access the .pdf file of the presentation

웹캐스트 - recorded

 
Advanced Design System 2009U1 Fundamentals 
This medium-paced, 3-day course provides detailed introduction to the application of Advanced Design System for communication systems and circuit designs. Click on link to view full course description and class dates and locations.

교육

 
Agilent EEsof EDA Customer Education and Services 
Brief overview of Agilent EEsof EDA Customer Education and Services.

교육 자료 2010-08-11

 
Characterize and Correct for Cable, Switch and Test Fixture Loss Using Only a High-Bandwidth Scope 
Originally broadcast July 27, 2011

웹캐스트 - recorded

 
Design of a 8 Watt, High efficiency X-band Power PHEMT Amplifier 
Originally broadcast March 16, 2010

웹캐스트 - recorded

 
Detailed Presentation on Momentum - Part 1 of 3 
This Presentation (Part 1 of 3) focuses on Momentum versus Momentum RF, Creating substrate stack-ups and mapping layout layers as metallization layers, Placing and defining ports.

세미나 프리젠테이션 2003-05-19

PDF PDF 1.80 MB
Detailed Presentation on Momentum - Part 2 of 3 
This Presentation (Part 2 of 3) focuses on Defining mesh parameters, Low-frequency breakdown problem and Momentum accuracy.

세미나 프리젠테이션 2003-05-19

PDF PDF 1.01 MB
Detailed Presentation on Momentum - Part 3 of 3 
This Presentation (Part 3 of 3) focuses on Viewing and Using Momentum Results, Momentum Datasets, Momentum Visualization and ADS Data Display.

세미나 프리젠테이션 2003-05-19

PDF PDF 790 KB
Detailed Presentation on Momentum Advanced Topics - (Part 1 of 5) 
This Presentation (Part 1 of 5) focusses on Momentum Co-Simulation and Momentum Co-Optimization using Layout Components.

세미나 프리젠테이션 2003-05-19

PDF PDF 7.96 MB
Detailed Presentation on Momentum Advanced Topics - (Part 2 of 5) 
This Presentation (Part 2 of 5) focusses on Thick Conductor Simulation.

세미나 프리젠테이션 2003-05-19

PDF PDF 3.67 MB
Detailed Presentation on Momentum Advanced Topics - (Part 3 of 5) 
This Presentation (Part 3 of 5) focusses on Thick Conductor Simulations Coupled Lines examples and Spiral Inductor simulations.

세미나 프리젠테이션 2003-05-19

PDF PDF 6.18 MB
Detailed Presentation on Momentum Advanced Topics - (Part 4 of 5) 
This Presentation (Part 4 of 5) focusses on Advanced Model Composer (AMC) including Spiral Inductor Simulations.

세미나 프리젠테이션 2003-05-22

PDF PDF 8.64 MB
Detailed Presentation on Momentum Advanced Topics - (Part 5 of 5) 
This Presentation (Part 5 of 5) focusses on final wrap up, project files and other resources.

세미나 프리젠테이션 2003-05-19

PDF PDF 640 KB
Fast Characterization of Power Amplifier Performance with Modulated Signals 
Original broadcast Apr 5, 2012

웹캐스트 - recorded

 
Innovations in EDA: Applying the Latest Technologies to MMIC Design 
Originally broadcast Nov 11, 2010

웹캐스트 - recorded

 
Innovations in EDA: X-Parameter* Case Study: GaN High Power Amplifier (HPA) Design 
Originally broadcast Jan 11, 2011

웹캐스트 - recorded

 
Innovations in EDA: Accelerating Radar/EW System Design using Wideband Virtual Scenarios Webcast 
Original broadcast April 4, 2013

웹캐스트 - recorded

 
Innovations in EDA: Accurate Modeling of Packages and Interconnects 
Originally broadcast Dec 2, 2010

웹캐스트 - recorded

 
Innovations in EDA: Applying the Latest Technologies to MMIC Design 
This recorded Webcast uses an LTE RF power amplifier application to present the latest developments in design and simulation technologies.

세미나 프리젠테이션 2010-11-15

PDF PDF 627 KB
Innovations in EDA: IC, Laminate, Package Multi-Technology PA Module Design Methodology 
Original broadcast August 2, 2012

웹캐스트 - recorded

 
Innovations in EDA: Multi-Technology RF Design Using the New Advances in ADS 2011 
Originally broadcast March 1, 2011

웹캐스트 - recorded

 
Millimeter Signal Measurements: Best Practices, Solutions, and Accuracy Webcast 
Original broadcast Jan 26, 2012

웹캐스트 - recorded

 
MMIC - Design of Experiments (DOE) Tutorial 
A practical example that walks you through the basic ideas behind DOE.

교육 자료 2009-01-13

PDF PDF 325 KB
MMIC Design Seminar Materials 
Agilent EEsof EDA collection of MMIC Design Seminar Materials.

세미나 프리젠테이션 2010-03-11

 
MMIC/RFIC Packaging Challenges Slides 
These slides cover several applications including the Agilent custom TOPS package, Agilent QFN package, solder bumps for FC package, Balun & mixer IC module, and RFIC PA co-design.

세미나 프리젠테이션 2009-08-26

PDF PDF 3.79 MB

1 2 다음