RF & Microwave Design
Agilent design software provides proven RF and Microwave solutions with very accurate models and powerful simulation technologies ranging from circuit, electromagnetic (EM), and system level designs. With Agilent, you'll be equipped to pinpoint, optimize and deliver - on time.
RF and Microwave Design Challenges
- Ever increasing substrate layer counts, smaller form factors, complex packaging technologies, and closer design proximities continue to make designs ever more challenging
- Seamlessly integrated circuit and EM simulation tools that flow from schematic entry through to production and verification
- Continuous innovation of simulation technology performance to increase accuracy while dramatically reducing simulation speeds
What's New
- EdXact provides new integration of Jivaro with Agilent Technologies’ GoldenGate simulator
- Agilent's Newest 3-D Electromagnetic Simulation Software Release Targets EMI Compliance
- Agilent Technologies to Demonstrate Leading-Edge RF/MW Design and Test Solutions at IMS
- ClioSoft Announces the Integration of SOS Design Data Management with Advanced Design System
- Agilent to Demonstrate Latest RF Circuit, System and 3-D EM Design & Simulation Solutions at WAMICON
Related Links
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- MMIC Design (14)
- RF & Microwave Board Design (25)
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Training & Events
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1-25 of 50
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A Faster and Effective RF Module/LTCC Design Flow with AMC
This Presentation details why Electro-Magnetic (EM) Simulation for RF Module/LTCC is required and usage of Advanced Model Composer (AMC) for faster and effective RF Module/LTCC Design Flow.
Seminar Materials 2007-11-15 |
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3.07 MB
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A Model-Based Approach for System-Level RFIC Verification
A new approach for verifying system-level behavior of a modern RFIC.
Seminar Materials 2011-07-07 |
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1.70 MB
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A New Circuit Design Methodology for CMOS Transceiver LSI Designs, using Agilent GoldenGate
A Toshiba Case Study from the Agilent EDA Forum 2008.
Seminar Materials 2008-12-18 |
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1.89 MB
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Comprehensive mm-Wave Design Solutions for TSMC's 60-GHz CMOS RDK
An introduction to the 60 GHz reference design kit (RDK) and complete RFIC design solutions with dedicated mm-Wave support.
Seminar Materials 2012-05-03 |
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4.44 MB
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De-embedding Techniques in Advanced Design System
A detailed Seminar on De-embedding technique used in Advanced Design System. This presentation covers the need of de-embedding, S-Parameters, TRL design, 2-Port and 4-Port de-embedding.
Seminar Materials 2006-06-01 |
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2.95 MB
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Detailed Presentation on Momentum - Part 1 of 3
This Presentation (Part 1 of 3) focuses on Momentum versus Momentum RF, Creating substrate stack-ups and mapping layout layers as metallization layers, Placing and defining ports.
Seminar Materials 2003-05-19 |
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1.80 MB
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Detailed Presentation on Momentum - Part 2 of 3
This Presentation (Part 2 of 3) focuses on Defining mesh parameters, Low-frequency breakdown problem and Momentum accuracy.
Seminar Materials 2003-05-19 |
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1.01 MB
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Detailed Presentation on Momentum - Part 3 of 3
This Presentation (Part 3 of 3) focuses on Viewing and Using Momentum Results, Momentum Datasets, Momentum Visualization and ADS Data Display.
Seminar Materials 2003-05-19 |
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790 KB
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Detailed Presentation on Momentum Advanced Topics - (Part 1 of 5)
This Presentation (Part 1 of 5) focusses on Momentum Co-Simulation and Momentum Co-Optimization using Layout Components.
Seminar Materials 2003-05-19 |
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7.96 MB
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Detailed Presentation on Momentum Advanced Topics - (Part 2 of 5)
This Presentation (Part 2 of 5) focusses on Thick Conductor Simulation.
Seminar Materials 2003-05-19 |
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3.67 MB
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Detailed Presentation on Momentum Advanced Topics - (Part 3 of 5)
This Presentation (Part 3 of 5) focusses on Thick Conductor Simulations Coupled Lines examples and Spiral Inductor simulations.
Seminar Materials 2003-05-19 |
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6.18 MB
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Detailed Presentation on Momentum Advanced Topics - (Part 4 of 5)
This Presentation (Part 4 of 5) focusses on Advanced Model Composer (AMC) including Spiral Inductor Simulations.
Seminar Materials 2003-05-22 |
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8.64 MB
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Detailed Presentation on Momentum Advanced Topics - (Part 5 of 5)
This Presentation (Part 5 of 5) focusses on final wrap up, project files and other resources.
Seminar Materials 2003-05-19 |
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640 KB
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EM Insights Series Episode #2: Single and Multiple Band Microstrip Planar Array Antenna
An Agilent Technologies Presentation (EM Insights Series, Episode #2) decribes single (C Band) and multiple band (C and X band) microstrip planar array antenna in detail.
Seminar Materials 2009-03-30 |
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1.06 MB
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EM Insights Series Episode #3: Wireless Network Card Antenna Design
An Agilent Technologies Presentation (EM Insights Series, Episode #3) decribes wireless network card antenna design in detail.
Seminar Materials 2009-03-30 |
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677 KB
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EM Insights Series Episode #5: BGA Package Simulation
An Agilent Technologies Presentation (EM Insights Series, Episode #5) describes BGA package simulation in detail.
Seminar Materials 2009-03-31 |
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620 KB
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End-to-End Design and Simulation of Handset Modules
What goes into real-life PA design considerations? Dr. Peter Zampardi and Dr. Hongxiao Shao share Skyworks design methodology considering all components necessary for a handset power amplifier (PA) or Front-end Module (FEM) based on III-V HBT and BiFET technologies.
Seminar Materials 2012-02-27 |
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1.02 MB
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Fast Characterization of Power Amplifier Performance with Modulated Signals
Innovations in EDA Webcast Series: Part 3 of the RF Power Amplifier Design Series.
Seminar Materials 2012-04-05 |
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1.79 MB
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Filter Design for LTE
Genesys "How-To-Design" Part 2 of 6
Seminar Materials 2009-11-19 |
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1.85 MB
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Hands-on Workshop on RF SiP/Module Design
This Presentation serves as a workshop material detailing hand-on experience of ADS design tools, utilities in RF SiP/Module design and covers an overview on Electro-Magnetic Simulation Technologies.
Seminar Materials 2007-11-15 |
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28.88 MB
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Impedance Matching Techniques for VLSI Packaging
A detailed Seminar by Brock J. LaMeres, Rajesh Garg, Kanupriya Gulati, Sunil P. Khatri on Impedance matching techniques for VLSI packaging.
Seminar Materials 2006-05-25 |
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1.40 MB
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Improved RF SiP/Module Design Productivity with New ADS 2008
This Presentation brings out details of new features in ADS 2008 that increase the productivity of RF SiP/Module designs.
Seminar Materials 2007-11-15 |
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2.59 MB
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Innovations in EDA: A Practical Approach to Verifying RFICs with Fast Mismatch Analysis
A new fast mismatch analysis that delivers the same level of accuracy with the benefit of significantly reducing overall cost, verification time and increased computed resource availability.
Seminar Materials 2010-10-29 |
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626 KB
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Innovations in EDA: Applying the Latest Technologies to MMIC Design
This recorded Webcast uses an LTE RF power amplifier application to present the latest developments in design and simulation technologies.
Seminar Materials 2010-11-15 |
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627 KB
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Integrated CMOS Power Amplifier for GSM/GPRS Mobile Handsets - AXIOM Presentation
A Presentation by Rahul Magoon (AXIOM Microdevices) presents the Industry’s first fully Integrated CMOS Power Amplifier for GSM/GPRS Mobile Handsets.
Seminar Materials 2007-07-24 |
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958 KB
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