元件建模與特性分析
安捷倫提供完整的硬體和軟體解決方案,可用於半導體元件特性分析與建模。 現在大多數半導體大廠和整合式元件製造商 (IDM) 都採用安捷倫工具來建構元件建模解決方案,以便針對晶片 CMOS、Bipolar、混合砷化鎵 (GaAs)、氮化鎵 (GaN) 和許多其他元件技術進行測試。 準確的元件特性分析、精確先進的模型、有效的擷取及詳盡的驗證,是建立準確及強大模型庫的關鍵,也是設計成功的重要因素。
元件建模與特性分析挑戰
- 隨著元件尺寸越來越小,使用準確的模型並控制元件處理效能之統計變數,已變得越來越重要。
- 電路設計工程師需要能夠直流以及射頻和微波頻率範圍內,準確預測元件行為的模型。
- 不同的處理技術需要可因應不同處理程序,迅速進行調適的各種模型。
- 建模量測通常耗時數小時甚至幾天的時間,量測控制軟體也必須與探測器和儀器協同運作,以便在不同溫度條件下執行自動量測。
最新消息
- Accurate Modeling of GaAs & GaN HEMT’s for Nonlinear Applications
- Agilent Ships Newest SPICE Model Extraction and Qualification Software
- Agilent embraces GaN modeling in IC-CAP upgrade
- Agilent ships new software for generating and qualifying SPICE models
- Agilent Technologies Unveils New IC-CAP Platform for Device Characterization and Modeling
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Agilent EEsof EDA Newsletter - Product and Application News
Keep tabs on the latest product and application news and review the archives of the Agilent EEsof EDA Newsletter.
新聞簡訊 2013-05-14 |
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Model Builder Program (MBP)
MBP is a one-stop solution that provides both automation and flexibility for silicon device modeling.
型錄 2013-04-10 |
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Model Quality Assurance (MQA)
MQA provides the complete solution and framework to fabless design companies, IDMs, and foundries for SPICE model library validation, comparison, and documentation.
型錄 2013-04-10 |
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EDA Support Services
Agilent Support Services for EDA Products offers customers several benefits otherwise not available. This service is designed to help you get the most out of your software purchases.
型錄 2013-04-09 |
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Agilent Ships Newest SPICE Model Extraction and Qualification Software
Agilent announces shipment of the latest release of its industry-leading SPICE model extraction tool, Model Builder Program, and SPICE qualification tool, Model Quality Assurance.
新聞資料 2013-03-13 |
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Agilent Technologies Launches Recognition Program for EDA Experts
Agilent launches its Agilent Certified Expert recognition program for EDA experts. Eligible participants include individuals demonstrating a high level of expertise-both theoretical and practical-in applying Agilent EEsof EDA tools for product design and modeling.
新聞資料 2013-03-12 |
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Agilent embraces GaN modeling in IC-CAP upgrade
EETimes Design Article highlights new capabilities in IC-CAP 2013.01.
專文 2013-01-09 |
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IC-CAP Device Modeling Software
Technical overview of Agilent's Integrated Circuit Characterization and Analysis Program (IC-CAP), complete and accurate parameter extraction for semiconductor device modeling
技術總覽 2012-12-20 |
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Agilent Technologies Unveils New IC-CAP Platform for Device Characterization and Modeling
Agilent announces the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP).
新聞資料 2012-12-18 |
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MOS-AK/GSA Modeling Working Group Holds Winter Workshop in San Francisco
Experts Share Insight on Compact Device Modeling with Emphasis on Simulation-Aware Models.
新聞資料 2012-12-12 |
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Future Device Modeling Trends
Modeling the nonlinear device (basic nonlinear component) for circuit and system simulation downstream.
專文 2012-11-28 |
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X-Parameter Design Simulation Models - Modelithics
X-Parameter Design Simulation Models from Modelithics and Agilent.
解決方案簡介 2012-10-02 |
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Agilent Technologies Ships New Software for Generating and Qualifying SPICE Models
Agilent today announced shipment of its first release of the industry-leading SPICE modeling tools it obtained through the acquisition of Accelicon Technologies in February.
新聞資料 2012-08-23 |
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Agilent Extends Partnership with AMCAD to Include Nonlinear Modeling and Measurement Services
Agilent announces that its long-term relationship with AMCAD Engineering has been extended to include a technology partnership for services related to nonlinear design and measurement of new electronic devices.
新聞資料 2012-06-19 |
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Agilent to Demonstrate Its Newest RF/Microwave Design and Test Products at IMS
Agilent will demonstrate its newest design and test products for advanced RF and microwave research, development and manufacturing at the 2012 IEEE MTT-S International Microwave Symposium (Booth 1015), June 17-22, at the Palais des congrès de Montréal.
新聞資料 2012-06-04 |
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Agilent Announces Shipment of the IC-CAP 2012 Platform for Device Characterization and Modeling
Agilent announces shipment of the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP) for 2012.
新聞資料 2012-03-02 |
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Agilent Completes Acquisition of Accelicon Technologies’ Solutions for Semiconductor Device Modeling
Agilent Technologies announced that Accelicon Technologies’ software solutions and technology for device-level modeling and validation in the electronics industry are now part of Agilent.
新聞資料 2012-02-21 |
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脈衝式電流電壓和 S 參數量測
脈衝式電流電壓和 S 參數量測
解決方案簡介 2011-09-26 |
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脈衝式 IV/RF 量測解決方案
Auriga 脈衝式 IV/RF 量測解決方案簡介
解決方案簡介 2011-09-26 |
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Agilent EEsof EDA Premier Communications Design Software
Agilent EEsof EDA premier communications design software product overview brochure.
型錄 2011-08-03 |
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Agilent Technologies Ships Latest IC-CAP Platform for DC and RF Device Characterization and Modeling
Software improves modeling flow with link between measurement and extraction
新聞資料 2011-05-10 |
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Automated Measurement with IC-CAP
This application note describes a seamless solution for automated measurement and parameter extraction with Agilent IC-CAP
應用手冊 2011-01-10 |
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Recommended Modeling Configurations for Device Modeling
IC-CAP Recommended Modeling Configurations for Device Modeling
配置設定指南 2010-09-23 |
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Agilent Introduces IC-CAP WaferPro Software for Automating Complex Device Modeling Applications
IC-CAP WaferPro provides a multi-site, multi-wafer, automated DC and RF measurement solution for semiconductor device modeling applications.
新聞資料 2010-08-19 |
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Compact Hierarchical Bipolar Transistor Modeling with HiCUM
An international series on advances in solid state electronics and technology by Michael Schroter and Anjan Chakravorty.
促銷資料 2010-08-01 |
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