Premier Si/III-V Device Modeling and Characterization Solutions
Agilent provides premier solutions for characterization and modeling of cutting-edge CMOS and compound semiconductor devices. Agilent is the only vendor that provides complete end-to-end modeling solutions, from automated measurements, accurate device model extraction, comprehensive qualification to final process design kit (PDK) validation. Comprehensive modeling services are offered, supported by Agilent’s expert engineers and advanced labs. Some of our key device modeling and characterization EDA software solutions include:
- IC-CAP: Most powerful III-V/RF modeling platform
- IC-CAP WaferPro: Fast and accurate automated measurement platform
- Model Builder Program (MBP): Complete Silicon turnkey device modeling platform
- Model Quality Assurance (MQA): Industry standard SPICE model signoff and acceptance platform
Device modeling and characterization challenges
- As device geometries get smaller, the need to use accurate models and to control statistical variations in device processing performance becomes ever more important
- Circuit designers need models that can accurately predict DC behaviors, as well as RF and noise behaviors
- Different process technologies require a variety of models that can be quickly adapted to the unique processes
- With modeling measurements taking hours or even days, measurement control software must also work with probers and instruments to allow automated measurements across temperature
What's New
- Accurate Modeling of GaAs & GaN HEMT’s for Nonlinear Applications
- Agilent Ships Newest SPICE Model Extraction and Qualification Software
- Agilent embraces GaN modeling in IC-CAP upgrade
- MOS-AK/GSA Modeling Working Group Holds Winter Workshop in San Francisco
- Agilent Technologies Unveils New IC-CAP Platform for Device Characterization and Modeling
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Oscilloscopes, Analyzers, Meters
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Oscilloscopes, Analyzers, Meters
1-12 of 12
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Advanced Product Design & Test for High-Speed Digital Devices Webcast
Original broadcast Jan 18, 2012
Webcast - recorded |
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Agilent EEsof EDA Customer Education and Services
Brief overview of Agilent EEsof EDA Customer Education and Services.
Training Materials 2010-08-11 |
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Automating On-Wafer Measurements with the new Agilent IC-CAP WaferPro
Originally broadcast Jan 27, 2011
Webcast - recorded |
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Breakthrough in High Speed Interconnect Analysis and Compliance Testing
Originally broadcast April 27, 2011
Webcast - recorded |
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EMC 2013 - IEEE International Symposium on Electromagnetic Compatibility
August 5- 9, 2013; Denver, CO
Tradeshow |
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Hybrid-Active Load Pull with PNA-X and Maury Microwave
Original broadcast Jun 12, 2012
Webcast - recorded |
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New impedance measurement solutions & apps using 5 Hz to 3 GHz VNA
Originally broadcast April 19, 2011
Webcast - recorded |
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Nonlinear Characterization and Modeling Through Pulsed IV/S-Parameters
Original broadcast Mar 27, 2012
Webcast - recorded |
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Optimizing PXI Modular Functional Test System Throughput Webcast
Originally broadcast April 27, 2011
Webcast - recorded |
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PCI Express(R) 3.0 Strategies for Transmitter and Receiver Validation
Originally broadcast Feb 10, 2011
Webcast - recorded |
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Setting Up IC-CAP WaferPro For On-Wafer Measurements
originally broadcast June 22, 2011
Webcast - recorded |
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Test & Measurement events in Europe, Middle East & Africa
Test & Measurement events in Europe, the Middle East, and Africa - seminars, trade shows, user group meetings, webcasts, tutorials and conferences.
Seminar |
