Premier Si/III-V Device Modeling and Characterization Solutions
Agilent provides premier solutions for characterization and modeling of cutting-edge CMOS and compound semiconductor devices. Agilent is the only vendor that provides complete end-to-end modeling solutions, from automated measurements, accurate device model extraction, comprehensive qualification to final process design kit (PDK) validation. Comprehensive modeling services are offered, supported by Agilent’s expert engineers and advanced labs. Some of our key device modeling and characterization EDA software solutions include:
- IC-CAP: Most powerful III-V/RF modeling platform
- IC-CAP WaferPro: Fast and accurate automated measurement platform
- Model Builder Program (MBP): Complete Silicon turnkey device modeling platform
- Model Quality Assurance (MQA): Industry standard SPICE model signoff and acceptance platform
Device modeling and characterization challenges
- As device geometries get smaller, the need to use accurate models and to control statistical variations in device processing performance becomes ever more important
- Circuit designers need models that can accurately predict DC behaviors, as well as RF and noise behaviors
- Different process technologies require a variety of models that can be quickly adapted to the unique processes
- With modeling measurements taking hours or even days, measurement control software must also work with probers and instruments to allow automated measurements across temperature
What's New
- Accurate Modeling of GaAs & GaN HEMT’s for Nonlinear Applications
- Agilent Ships Newest SPICE Model Extraction and Qualification Software
- Agilent embraces GaN modeling in IC-CAP upgrade
- MOS-AK/GSA Modeling Working Group Holds Winter Workshop in San Francisco
- Agilent Technologies Unveils New IC-CAP Platform for Device Characterization and Modeling
Related Links
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- Seminar Materials (4)
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Software
1-17 of 17
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Evénements Agilent en France
Bienvenue sur la page des événements auxquels participe Agilent en France
Seminar |
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Advanced Product Design & Test for High-Speed Digital Devices Webcast
Original broadcast Jan 18, 2012
Webcast - recorded |
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Agilent EEsof EDA Customer Education and Services
Brief overview of Agilent EEsof EDA Customer Education and Services.
Training Materials 2010-08-11 |
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Automating On-Wafer Measurements with the new Agilent IC-CAP WaferPro
Originally broadcast Jan 27, 2011
Webcast - recorded |
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Breakthrough in High Speed Interconnect Analysis and Compliance Testing
Originally broadcast April 27, 2011
Webcast - recorded |
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EMC 2013 - IEEE International Symposium on Electromagnetic Compatibility
August 5- 9, 2013; Denver, CO
Tradeshow |
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Genesys Webcasts - "How-To-Design" series
Originally broadcast in 2009. Access the 6 WebEX recordings
Webcast - recorded |
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IC-CAP User Training
This 3-day course will show device modelers how to use Agilent EEsof EDA's IC-CAP software. Click on link to view full course description and class dates and locations.
Classroom Training |
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IMS 2011 (IEEE MTT-S) – Connect, Expert to Expert, at Agilent Avenue
2011 show, last June, 2011; Baltimore Convention Center
Tradeshow |
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Innovations in EDA: Accurate Modeling of GaAs & GaN HEMT’s for Nonlinear Applications Webcast
Original broadcast May 7, 2013
Webcast - recorded |
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Measurement Based FET Modeling using Artifical Neural Networks (ANN)
This presentation was given by Jianjun Xu with introduction by David Root as part of the Innovations in EDA Webcast Series.
Seminar Materials 2012-02-07 |
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PCI Express(R) 3.0 Strategies for Transmitter and Receiver Validation
Originally broadcast Feb 10, 2011
Webcast - recorded |
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Presentation on BSIM4, BSIM3v3 and BSIMSOI RF MOS Modeling
This Presentation by Dr. Thomas Gneiting (Advanced Modeling Solution) was presented at Agilent EEsof EDA Seminar, April 04, 2001 details the structure of BSIM3v3, BSIMSOI and BSIM4 RF models.
Seminar Materials 2001-04-04 |
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Presentation on DC & AC Characterization of Semiconductors
This Presentation focuses on basics of device measurement and modeling techniques from DC to RF, special aspects of network analyzer calibration, de-embedding and required dummy structures.
Seminar Materials 2003-01-28 |
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Setting Up IC-CAP WaferPro For On-Wafer Measurements
originally broadcast June 22, 2011
Webcast - recorded |
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Setting up IC-CAP WaferPro for On-Wafer Measurements
IC-CAP WaferProIs is an extremely powerful test plan suite, for on-Wafer DC/CV and RF device modeling measurements.
Seminar Materials 2011-06-22 |
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Test & Measurement events in Europe, Middle East & Africa
Test & Measurement events in Europe, the Middle East, and Africa - seminars, trade shows, user group meetings, webcasts, tutorials and conferences.
Seminar |
