Contact an Expert

Premier Si/III-V Device Modeling and Characterization Solutions

Agilent provides premier solutions for characterization and modeling of cutting-edge CMOS and compound semiconductor devices. Agilent is the only vendor that provides complete end-to-end modeling solutions, from automated measurements, accurate device model extraction, comprehensive qualification to final process design kit (PDK) validation. Comprehensive modeling services are offered, supported by Agilent’s expert engineers and advanced labs. Some of our key device modeling and characterization EDA software solutions include:

  • IC-CAP: Most powerful III-V/RF modeling platform
  • IC-CAP WaferPro: Fast and accurate automated measurement platform
  • Model Builder Program (MBP): Complete Silicon turnkey device modeling platform
  • Model Quality Assurance (MQA): Industry standard SPICE model signoff and acceptance platform

Device modeling and characterization challenges

  • As device geometries get smaller, the need to use accurate models and to control statistical variations in device processing performance becomes ever more important
  • Circuit designers need models that can accurately predict DC behaviors, as well as RF and noise behaviors
  • Different process technologies require a variety of models that can be quickly adapted to the unique processes
  • With modeling measurements taking hours or even days, measurement control software must also work with probers and instruments to allow automated measurements across temperature

Explore YouTube Videos 

1-22 of 22

Sort:
Advanced Product Design & Test for High-Speed Digital Devices Webcast 
Original broadcast Jan 18, 2012

Webcast - recorded

 
Agilent EEsof EDA Training Course Calendar - 2013 
Scheduled courses for the United States and Canada

Classroom Training

 
Agilent EEsof EDA Customer Education and Services 
Brief overview of Agilent EEsof EDA Customer Education and Services.

Training Materials 2010-08-11

 
Automating On-Wafer Measurements with the new Agilent IC-CAP WaferPro 
Originally broadcast Jan 27, 2011

Webcast - recorded

 
Breakthrough in High Speed Interconnect Analysis and Compliance Testing  
Originally broadcast April 27, 2011

Webcast - recorded

 
DesignCon 2011 CD of Agilent Education Forum Workshops and Presentations 
Order free CD of the 2011 Agilent Education Forum Workshops and Presentations

Tradeshow

 
EMC 2013 - IEEE International Symposium on Electromagnetic Compatibility  
August 5- 9, 2013; Denver, CO

Tradeshow

 
Genesys Webcasts - "How-To-Design" series  
Originally broadcast in 2009. Access the 6 WebEX recordings

Webcast - recorded

 
Hybrid-Active Load Pull with PNA-X and Maury Microwave 
Original broadcast Jun 12, 2012

Webcast - recorded

 
IC-CAP User Training 
This 3-day course will show device modelers how to use Agilent EEsof EDA's IC-CAP software. Click on link to view full course description and class dates and locations.

Classroom Training

 
IMS 2011 (IEEE MTT-S) – Connect, Expert to Expert, at Agilent Avenue 
2011 show, last June, 2011; Baltimore Convention Center

Tradeshow

 
Innovations in EDA: Accurate Modeling of GaAs & GaN HEMT’s for Nonlinear Applications Webcast 
Original broadcast May 7, 2013

Webcast - recorded

 
Measurement Based FET Modeling using Artifical Neural Networks (ANN) 
This presentation was given by Jianjun Xu with introduction by David Root as part of the Innovations in EDA Webcast Series.

Seminar Materials 2012-02-07

PDF PDF 2.51 MB
New impedance measurement solutions & apps using 5 Hz to 3 GHz VNA  
Originally broadcast April 19, 2011

Webcast - recorded

 
Nonlinear Characterization and Modeling Through Pulsed IV/S-Parameters  
Original broadcast Mar 27, 2012

Webcast - recorded

 
Optimizing PXI Modular Functional Test System Throughput Webcast 
Originally broadcast April 27, 2011

Webcast - recorded

 
PCI Express(R) 3.0 Strategies for Transmitter and Receiver Validation 
Originally broadcast Feb 10, 2011

Webcast - recorded

 
Presentation on BSIM4, BSIM3v3 and BSIMSOI RF MOS Modeling 
This Presentation by Dr. Thomas Gneiting (Advanced Modeling Solution) was presented at Agilent EEsof EDA Seminar, April 04, 2001 details the structure of BSIM3v3, BSIMSOI and BSIM4 RF models.

Seminar Materials 2001-04-04

PDF PDF 1.49 MB
Presentation on DC & AC Characterization of Semiconductors 
This Presentation focuses on basics of device measurement and modeling techniques from DC to RF, special aspects of network analyzer calibration, de-embedding and required dummy structures.

Seminar Materials 2003-01-28

PDF PDF 893 KB
RF Back to Basics Seminar- 2013 
Various cities in the US

Seminar

 
Setting Up IC-CAP WaferPro For On-Wafer Measurements 
originally broadcast June 22, 2011

Webcast - recorded

 
Setting up IC-CAP WaferPro for On-Wafer Measurements 
IC-CAP WaferProIs is an extremely powerful test plan suite, for on-Wafer DC/CV and RF device modeling measurements.

Seminar Materials 2011-06-22

PDF PDF 3.07 MB