器件建模
安捷伦为直流和射频半导体器件表征及建模提供硬件和软件解决方案。当前大多数领先的半导体制造商和集成器件制造商（IDMs）都采用安捷伦工具来获得器件建模方案，以便用于芯片 CMOS、Bipolar、混合砷化镓（GaAs）、氮化镓（GaN）和许多其它器件技术。
器件建模挑战
- 随着器件几何尺寸越来越小，使用精确模型并控制器件处理性能中的统计变量这种需求显得越来越重要。
- 电路设计人员需要在直流以及射频和微波频率范围内可以精确预测器件行为的模型。
- 不同的处理技术需要大量的可以迅速适应独特程序的模型。
- 建模测量通常耗时数个小时甚至数天，测量控制软件也必须与探测器和仪器协同工作，以便在不同温度条件下执行自动测量。
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Agilent EEsof EDA Newsletter - Product and Application News
Keep tabs on the latest product and application news and review the archives of the Agilent EEsof EDA Newsletter.
内部通讯 2013-05-14 |
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Model Quality Assurance (MQA)
MQA provides the complete solution and framework to fabless design companies, IDMs, and foundries for SPICE model library validation, comparison, and documentation.
手册 2013-04-10 |
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1.40 MB
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Model Builder Program (MBP)
MBP is a one-stop solution that provides both automation and flexibility for silicon device modeling.
手册 2013-04-10 |
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1.76 MB
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EDA Support Services
Agilent Support Services for EDA Products offers customers several benefits otherwise not available. This service is designed to help you get the most out of your software purchases.
手册 2013-04-09 |
PDF
128 KB
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Agilent Ships Newest SPICE Model Extraction and Qualification Software
Agilent announces shipment of the latest release of its industry-leading SPICE model extraction tool, Model Builder Program, and SPICE qualification tool, Model Quality Assurance.
新闻资料 2013-03-13 |
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Agilent Technologies Launches Recognition Program for EDA Experts
Agilent launches its Agilent Certified Expert recognition program for EDA experts. Eligible participants include individuals demonstrating a high level of expertise-both theoretical and practical-in applying Agilent EEsof EDA tools for product design and modeling.
新闻资料 2013-03-12 |
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Agilent embraces GaN modeling in IC-CAP upgrade
EETimes Design Article highlights new capabilities in IC-CAP 2013.01.
文章 2013-01-09 |
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IC-CAP Device Modeling Software
Technical overview of Agilent's Integrated Circuit Characterization and Analysis Program (IC-CAP), complete and accurate parameter extraction for semiconductor device modeling
技术总览 2012-12-20 |
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Agilent Technologies Unveils New IC-CAP Platform for Device Characterization and Modeling
Agilent announces the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP).
新闻资料 2012-12-18 |
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MOS-AK/GSA Modeling Working Group Holds Winter Workshop in San Francisco
Experts Share Insight on Compact Device Modeling with Emphasis on Simulation-Aware Models.
新闻资料 2012-12-12 |
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Future Device Modeling Trends
Modeling the nonlinear device (basic nonlinear component) for circuit and system simulation downstream.
文章 2012-11-28 |
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6.08 MB
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X-Parameter Design Simulation Models - Modelithics
X-Parameter Design Simulation Models from Modelithics and Agilent.
Solution Brief 2012-10-02 |
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Agilent Technologies Ships New Software for Generating and Qualifying SPICE Models
Agilent today announced shipment of its first release of the industry-leading SPICE modeling tools it obtained through the acquisition of Accelicon Technologies in February.
新闻资料 2012-08-23 |
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Agilent Extends Partnership with AMCAD to Include Nonlinear Modeling and Measurement Services
Agilent announces that its long-term relationship with AMCAD Engineering has been extended to include a technology partnership for services related to nonlinear design and measurement of new electronic devices.
新闻资料 2012-06-19 |
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Agilent to Demonstrate Its Newest RF/Microwave Design and Test Products at IMS
Agilent will demonstrate its newest design and test products for advanced RF and microwave research, development and manufacturing at the 2012 IEEE MTT-S International Microwave Symposium (Booth 1015), June 17-22, at the Palais des congrès de Montréal.
新闻资料 2012-06-04 |
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Agilent Announces Shipment of the IC-CAP 2012 Platform for Device Characterization and Modeling
Agilent announces shipment of the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP) for 2012.
新闻资料 2012-03-02 |
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Agilent Completes Acquisition of Accelicon Technologies’ Solutions for Semiconductor Device Modeling
Agilent Technologies announced that Accelicon Technologies’ software solutions and technology for device-level modeling and validation in the electronics industry are now part of Agilent.
新闻资料 2012-02-21 |
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安捷伦与领先的半导体器件建模软件供应商 Accelicon 公司签订协议
Agilent Technologies Signs Acquisition Agreement with Accelicon Technologies, a Leading Provider of Semiconductor Device-Modeling Software
新闻资料 2011-12-01 |
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Agilent EEsof EDA 最佳通信设计软件
Agilent EEsof EDA premier communications design software product overview brochure.
手册 2011-08-03 |
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1.92 MB
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Agilent EEsof EDA Premier Communications Design Software
Agilent EEsof EDA premier communications design software product overview brochure.
手册 2011-08-03 |
PDF
1.92 MB
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Agilent Technologies Ships Latest IC-CAP Platform for DC and RF Device Characterization and Modeling
Software improves modeling flow with link between measurement and extraction
新闻资料 2011-05-10 |
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安捷伦科技公司为用于直流和射频器件表征及建模的最新的 IC-CPA 平台发货
Software improves modeling flow with link between measurement and extraction
新闻资料 2011-05-10 |
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脉冲 IV 和脉冲 S 参数测量
Pulsed Measurement of Active Device IV Characteristics and S-Parameters from Maury Microwave and Agilent
Solution Brief 2011-03-20 |
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使用 IC-CAP 进行自动测量
This application note describes a seamless solution for automated measurement and parameter extraction with Agilent IC-CAP
应用说明 2011-01-10 |
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Recommended Modeling Configurations for Device Modeling
IC-CAP Recommended Modeling Configurations for Device Modeling
配置指南 2010-09-23 |
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