Fundamentals of Electronic Test & Measurement
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126-150 of 168
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Quad Flat No Lead (QFN) Best Practices
The purpose of this application note and best practices guide is to describer the QFN-type component and provide testing methods to ensure robust testing on the Medalist 5DX Automated X-ray Inspection (AXI) System.
Application Note 2008-08-26 |
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Realizing the Benefits of 3D Inline Solder Paste Inspection
Published in SMT Magazine/Germany, August 2003
Application Note 2003-08-01 |
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Running Rocky Mountain Basic from Board Test Basic
Many of you have existing programs written in Rocky Mountain Basic (RM-Basic), or have found the RM-Basic program examples given in Agilent manuals, and wish to use them to do external instrumentation control using the Agilent 3070 Board Test Family.
Application Note 2001-05-17 |
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S-Parameter Techniques for Faster, More Accurate Network Design (AN 95-1)
This Application Note is for information only. Agilent no longer sells or supports these products.
Application Note 1967-02-01 |
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Setting Up HotKeys for AXI products on the Agilent Medalist Repair Tool
Users of the Agilent Medalist Repair Tool, also known as the Agilent Repair Tool (ART), can setup hot keys to increase the efficiency of image viewing in RT4.0 for their X-ray inspection products.
Application Note 2008-09-26 |
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Simplified Filter Tuning Using Time Domain (AN 1287-8)
This Application Note describes a method of tuning a filter using the time-domain
response of its return loss, which makes filter tuning vastly easier.
Application Note 2000-07-01 |
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Solder Paste Inspection - Organize the Pieces
Published in Global SMT & Packaging, November 2003
Application Note 2003-11-01 |
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Solder Paste Inspection for the SMT line: 3D In-line Systems Come of Age
Published in Electronic Production & Test, May 2003.
Application Note 2003-05-01 |
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Specifying Calibration Standards and Kits for Agilent Vector Network Analyzers (AN 1287-11)
This paper discusses calibration standard definitions, calibration kit content, and its structure requirements for Agilent's vector network analyzers. Also provided are set up examples and how to modify an existing calibration kit definition file.
Application Note 2011-03-28 |
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Spectrum Analysis Basics: From 1997 Back to Basics Seminar
This paper covers everything from a definition of spectrum to the types of instruments used to make the measurements. Topics include resolution, amplitude measurements sensitivity, dynamic range, LO stability, and the use of spectrum analyzers....
Application Note 1997-04-01 |
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Spectrum Analyzer Basics (AN 150)
Fundamentals of spectrum analyzer measurements
Application Note 2006-08-02 |
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Swept Frequency Techniques (AN 65)
This Application Note is for information only. Agilent no longer sells or supports these products.
Application Note 1965-08-01 |
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Swept-Frequency Group Delay Measurements (AN 77-4)
Application Note 77-4
Application Note 1968-09-01 |
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System Developer Guide Using LAN in Test Systems - PC Configuration (AN 1465-11) - Application Note
Using LAN in Test Systems: PC
Configuration,the third note in
the series, describes the additional
capabilities required to enable communication between a PC and LAN-enabled instrumentation. This note is a companion to Application Notes 1465-9 and 1465-10.
Application Note 2004-10-19 |
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TDR Fundamentals for Use With the 54120T Digitizing Oscilloscope and TDR (AN 62)
This Application Note is for information only. Agilent no longer sells or supports these products.
Application Note 1964-01-01 |
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TDR Techniques for Differential Systems (AN 62-2)
This Application Note is for information only. Agilent no longer sells or supports these products.
Application Note 1990-10-01 |
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Techniques & Applications for High Throughput & Stable Characterization (AN 356-1)
This Application Note is for information only. Agilent no longer sells or supports these products.
Application Note 1988-08-01 |
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Techniques for Programming the 892X Family of Instruments (PN 892X)
This Product Note describes some key programming techniques for the Agilent 892X family of products. This Note can be used as a training tool for users that are new to programming test equipment, or it can be used by experienced programmers that need to know about unique programming required for...
Application Note 2000-09-01 |
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Test and Inspection as Part of the Lead-free Manufacturing Process
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.
Application Note 2005-02-22 |
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Test Coverage: What Does It Mean when a Board Test Passes?
Originally presented at the 2002 International Test Conference -- Characterizing board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage, especially in a limited access testing environment.
Application Note 2003-07-28 |
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Test Strategy for Complex Printed Circuit Board Assemblies
This paper proposes a new test strategy for complex boards since the trend in Printed Circuit Board Assembly (PCBA) technology is towards higher complexity.
Application Note 1999-02-22 |
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Test-System Computer I/O Considerations (AN 1465-2) - Application Note
The first application note in the series, Introduction to Test-System Design, covers test-system philosophy and planning and discusses how test is used in three sectors: R&D, design validation and manufacturing
Application Note 2004-12-09 |
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Test-System Development Guide: Operational Maintenance (AN 1465-8)
Application Note 2004-12-21 |
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Test-System Understanding Drivers and Direct I/O (AN 1465-3) - Application Note
This application note answers common questions
about the use of drivers and direct I/O to send commands from a PC application to the test instrument.
Application Note 2004-12-21 |
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The Importance of Test and Inspection When Implementing Lead-Free Manufacturing
Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free.
Application Note 2004-08-20 |
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