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3070 Board Tests are Reliable, Repeatable and Transportable. Here's Why. 
It would take a very long paper to discuss all of the factors that make Agilent 3070 tests so reliable, repeatable, and transportable. This paper selects a few of the important ones.

应用说明 2001-08-15

PDF PDF 223 KB
3070 In System Programming (ISP) Family 
On Board Programming, Bottom Line Benefits

应用说明 2002-07-25

PDF PDF 200 KB
3070 Increasing Throughput 
There are decisions one can make that causes an Agilent 3070 test program to be slower or faster than what Test Consultant generates automatically. This paper offers many tips about how to optimize your system's performance.

应用说明 1997-03-03

PDF PDF 41 KB
3070 Series 3 Flash70 Programming Guide 
This guide contains information about the procedures, tasks, and syntax required to perform flash programming with HP 3070 test systems.

应用说明 2001-09-12

PDF PDF 1.85 MB
A New Process for Measuring and Displaying Board Test Coverage 
Written by Kenneth P. Parker, Agilent Technologies. First presented at Apex 2003, Anaheim, California.

应用说明 2003-01-01

PDF PDF 116 KB
A Quality Test Demands A Quality Fixture 
A Check List for getting a quality board test fixture first time, every time.

应用说明 2001-05-16

PDF PDF 26 KB
Boundary Scan Helps EMS Companies Cut Test Costs and Increase Revenues 
Electronics Manufacturing Services (EMS) providers can utilize boundary-scan to reduce test cost expenses and also generate additional revenue opportunities.

应用说明 2003-03-01

PDF PDF 242 KB
Boundary-Scan Technology, Justification, and Test Implementation for Designers 
This paper provides practical insight for designers on the merits, design, and test implementation of Boundary-Scan Technology.

应用说明 1998-05-27

PDF PDF 29 KB
Breakthrough Innovations: Agilent Automated Silicon Nails 
Automated Silicon Nails takes the popular IEEE 1149.1 Boundary-Scan standard even further by using Boundary-Scan chains to automatically test non-Boundary-Scan devices.

应用说明 2001-08-15

PDF PDF 460 KB
Design for Testability - Test for Designability 
This paper addresses testability considerations, both physical and logical, and focuses on both the new constraints and the new freedoms of modern manufacturing test in the ever-changing challenge.

应用说明 2003-01-28

PDF PDF 852 KB
Electrical In-circuit Test Methods for Limited-access Boards 
This paper surveys the various electrical test methods and tools available to address testing boards that lack full electrical access.

应用说明 2001-02-27

PDF PDF 47 KB
Ground Bounce Basics and Best Practices 
This article offers a description of the physical properties that result in ground bounce during board test.

应用说明 2003-01-28

PDF PDF 138 KB
High Node Count Fixturing Solutions for Agilent Short-Wire Test Fixtures 
This paper discusses problems encountered in building large, high node count vacuum actuated test fixtures for the Agilent 3070 family of board test systems.

应用说明 2008-04-30

PDF PDF 67 KB
How to build a fixture for use with the Agilent Cover-Extend Technology 
Cover-Extend Technology is Agilent’s latest limited access solution for in-circuit test. This paper documents the necessary information for a fixture vendor to build a Cover-Extend fixture.

应用说明 2011-06-24

PDF PDF 1.09 MB
How To Float, or Series, Agilent 3070 DUT Supplies 
The Agilent 3070 development software does an amazing job of calculating the wiring needed to build fixtures. Even so there are occasionally cases which require wiring that the standard Agilent 3070 software can not handle.

应用说明 1997-01-23

PDF PDF 34 KB
Improved Fault Coverage in a Combined X-ray and In-Circuit Test Environment 
Cutting functional test failures in half and doubling the faults detected at process test! These are some of the case study results observed in combined X-ray and in-circuit test environments.

应用说明 2001-02-27

PDF PDF 575 KB
In-circuit Testing of Low Voltage Devices 
Core technical document summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.

应用说明 2005-05-25

PDF PDF 172 KB
In-System Programming on the Agilent 3070 
In-System Programmable devices are more widely used on today's boards to provide flexibility to design engineers and to reduce the cost of a product.

应用说明 2001-07-02

PDF PDF 205 KB
Maintaining Power with Dual Stage Fixtures 
Occasionally there is a need to do dual stage fixturing where power must be maintained during parts of both stages.

应用说明 2002-06-07

PDF PDF 48 KB
Making the Most of Agilent Throughput Multiplier on Medalist In-Circuit Test Systems 
Agilent Throughput Multiplier reduces test time on in-circuit test systems by testing up to four boards of a single-board-type panel simultaneously. The tips in this application note will help users make the most of this valuable tool.

应用说明 2007-10-12

 
Maximising Test Coverage with Agilent Medalist VTEP v2.0 
This paper describes how to get the most from Agilent Technologies’ industry-leading vectorless test innovation, the Medalist VTEP v2.0 which is a suite of solution comprising VTEP, iVTEP and NPM.

应用说明 2007-04-17

PDF PDF 227 KB
语言 
Medalist i3070 In Circuit Test – Utilizing the most comprehensive Limited Access 
This article introduces the seven most prominent and effective limited access tools on the Agilent Medalist i3070 ICT, collectively known Super 7 suite.

应用说明 2009-03-06

PDF PDF 342 KB
Network Parameter Measurement: Best Practices using the Agilent Medalist i3070 
This paper describes how to maximize benefits from the Network Parameter Measurement capability on the Agilent Medalist i3070 in-circuit test system using enhancements in software version 7.20p.

应用说明 2009-04-02

PDF PDF 55 KB
PLD Programming on the Agilent 3070 Using the PLD ISP Product 
In-System Programmable PLDs are more widely used on today's boards to provide flexibility to design engineers and to reduce the cost of a product.

应用说明 2002-02-26

PDF PDF 242 KB
Printed Circuit Board Split-Pad Test Method and Design 
This application note describes the split-pad concept for use with a bed of nails style test fixture.

应用说明 1999-06-01

PDF PDF 50 KB

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