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Enhanced Log Records for the Agilent Medalist In-Circuit Test System 
Track changes made to your i3070 test programs to improve success.

應用手冊 2009-03-04

PDF PDF 801 KB
Medalist i3070 Test Throughput Optimization 
This application note explores some factors which cause test time to increase on the Medalist i3070 In-Circuit Test system, and methods which users can employ to reduce the test time and increase throughput on the Medalist i3070 ICT system.

應用手冊 2008-11-24

PDF PDF 163 KB
語言 
IEEE 1149.6 Standard Boundary Scan Testing on Agilent Medalist i3070 ICT Systems 
This paper introduces the latest advancements in Boundary Scan test capabilities on the Agilent Medalist i3070 In-Circuit Test platform that supports the testing of IEEE 1149.6-compliant devices.

應用手冊 2008-11-24

PDF PDF 297 KB
First pass Yield (FPY) and Alarm Triggers on the Agilent Medalist i3070 In-circuit Test System 
This application note will explain some customizations and how to create alarm triggers.

應用手冊 2008-09-26

PDF PDF 131 KB
Procedure to backup ITF3.1.1 Database and DataStore and Restore Them in a New ITF Server with SQL200 
This document is targeted at users who are archiving historical data or migrating to a more powerful server utilized to run Agilent’s ITF.

應用手冊 2008-07-28

PDF PDF 512 KB
Troubleshooting Medalist Intelligent Test Framework Port Problems 
This document serves as a guide/reference to do preliminary analysis and troubleshooting when network/communication problems occur with the ITF server of the tester agent.

應用手冊 2008-05-22

PDF PDF 813 KB
Using the Auto Optimizer on the Agilent Medalist In-Circuit Test Systems  
Learn how to optimize throughput by using the auto optimizer tool.

應用手冊 2008-05-03

PDF PDF 237 KB
Using the Graphical Pin Locator on Agilent Medalist In-Circuit Test Systems 
Enhancing productivity is the end result when the graphical version of "find pins" is utilized. This tool is called pin locator and is part of the Operator GUI Browser in version 7.0.

應用手冊 2008-05-03

PDF PDF 203 KB
The Future of In-Circuit Testing in the High-speed, Complex Electronics Environment 
As board complexity and node counts continue to rise and high speed differential signaling continues to grow in popularity, In-Circuit Test needs to move quickly beyond the traditional realms. This article explores this in detail.

應用手冊 2007-10-31

PDF PDF 176 KB
語言 
Making the Most of Agilent Throughput Multiplier on Medalist In-Circuit Test Systems 
Agilent Throughput Multiplier reduces test time on in-circuit test systems by testing up to four boards of a single-board-type panel simultaneously. The tips in this application note will help users make the most of this valuable tool.

應用手冊 2007-10-12

 
Medalist 3070 and Medalist i5000 System Recovery using Retrospect Express 
This app note describes how to perform backups of the system hard disk for the Agilent Medalist 3070 and Agilent Medalist i5000 In-circuit Test systems that have been shipped with Retrospect Express 7.0 and Roxio Digital Media Plus 7.2 software.

應用手冊 2007-07-10

PDF PDF 628 KB
Maximising Test Coverage with Agilent Medalist VTEP v2.0 
This paper describes how to get the most from Agilent Technologies’ industry-leading vectorless test innovation, the Medalist VTEP v2.0 which is a suite of solution comprising VTEP, iVTEP and NPM.

應用手冊 2007-04-17

PDF PDF 227 KB
語言 
Applying a New In-Circuit Probing Technique for High-Speed/High Density Printed Circuit Boards 
Bead probes were used to obtain additional test access on a high-density production printed circuit board. This case study includes practical information and key bead-specific learnings discovered during the process of outsourcing.

應用手冊 2006-10-24

PDF PDF 723 KB
語言 
“Shotgunning”, a Bad Fit for Lead-Free Test 
Shotgunning, a common repair technique in functional test, will be negatively affected by lead-free processes. This article explores the technique and draws broad conclusions regarding the impact of lead-free on electronics manufacturing test

應用手冊 2006-02-07

PDF PDF 44 KB
In-circuit Testing of Low Voltage Devices 
Core technical document summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.

應用手冊 2005-05-25

PDF PDF 172 KB
Test and Inspection as Part of the Lead-free Manufacturing Process 
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.

應用手冊 2005-02-22

PDF PDF 421 KB
The Importance of Test and Inspection When Implementing Lead-Free Manufacturing 
Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free.

應用手冊 2004-08-20

PDF PDF 260 KB
Using Lead-Free PCB Finishes at Manufacturing In-circuit Test Stage 
The purpose of this document is to share experiences and educate engineers regarding different PCB surface finishes and the specific changes required in the PCB build process to allow for ICT.

應用手冊 2004-08-08

PDF PDF 102 KB
Test Coverage: What Does It Mean when a Board Test Passes? 
Originally presented at the 2002 International Test Conference -- Characterizing board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage, especially in a limited access testing environment.

應用手冊 2003-07-28

PDF PDF 266 KB
Testing Transformers on Unpowered Systems 
This paper explains how to test basic analog parts, using unpowered systems.

應用手冊 2003-03-21

PDF PDF 10 KB
Boundary Scan Helps EMS Companies Cut Test Costs and Increase Revenues 
Electronics Manufacturing Services (EMS) providers can utilize boundary-scan to reduce test cost expenses and also generate additional revenue opportunities.

應用手冊 2003-03-01

PDF PDF 242 KB
What to Consider When Selecting the Optimal Test Strategy 
This paper addresses several issues for selecting the optimal inspection strategy, presenting data from many studies that Agilent has performed in the quest to find the optimal test / inspection strategy.

應用手冊 2003-03-01

PDF PDF 175 KB
Using Boundary Scan to Link Design and Manufacturing Test 
By leveraging boundary-scan tests generated in Design and re-using them at Manufacturing Test, manufacturers can produce long-term benefits in terms of lower costs, greater efficiencies and higher quality products.

應用手冊 2003-03-01

PDF PDF 502 KB
System Issues in Boundary-Scan Board Test 
While Boundary-Scan is a powerful test tool, test engineers are finding out that yesterday's DFT rules and test approaches may actually be detrimental to successfully testing systems on a board.

應用手冊 2003-01-28

PDF PDF 37 KB
Design for Testability - Test for Designability 
This paper addresses testability considerations, both physical and logical, and focuses on both the new constraints and the new freedoms of modern manufacturing test in the ever-changing challenge.

應用手冊 2003-01-28

PDF PDF 852 KB

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