印制电路板测试和检验
去除所有优化1-25 / 104
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使用网络和阻抗分析仪评测13.56 MHz RFID 标签和阅读器/记录器
本应用指南面向从事 RFID 天线设计和测试的工程师，探讨了如何使用网络分析仪和阻抗分析仪测试 RFID 天线特征，例如阻抗和谐振频率。
应用说明 2012-06-08 |
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3070 Board Tests are Reliable, Repeatable and Transportable. Here's Why.
It would take a very long paper to discuss all of the factors that make Agilent 3070 tests so reliable, repeatable, and transportable. This paper selects a few of the important ones.
应用说明 2001-08-15 |
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223 KB
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3070 In System Programming (ISP) Family
On Board Programming, Bottom Line Benefits
应用说明 2002-07-25 |
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200 KB
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3070 Increasing Throughput
There are decisions one can make that causes an Agilent 3070 test program to be slower or faster than what Test Consultant generates automatically. This paper offers many tips about how to optimize your system's performance.
应用说明 1997-03-03 |
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41 KB
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3070 Series 3 Flash70 Programming Guide
This guide contains information about the procedures, tasks, and syntax required to perform flash programming with HP 3070 test systems.
应用说明 2001-09-12 |
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1.85 MB
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3D Inline Solder Paste Inspection - Benefit Realized
100% solder paste inspection helps to reduce the contribution from the print process to solder joint defects.
应用说明 2003-06-01 |
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59 KB
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5DX Virus Protection Software Policy
Agilent recognizes that customers require data protection for their PC workstations and computer controlled manufacturing equipment such as the 5DX Test System and associated workstations.
应用说明 2004-08-26 |
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A New Process for Measuring and Displaying Board Test Coverage
Written by Kenneth P. Parker, Agilent Technologies. First presented at Apex 2003, Anaheim, California.
应用说明 2003-01-01 |
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116 KB
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A Quality Test Demands A Quality Fixture
A Check List for getting a quality board test fixture first time, every time.
应用说明 2001-05-16 |
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26 KB
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Agilent 3070 Now Powered by Industrial PC Controllers
The Agilent 3070 is now controlled by PCs similar to others used in your production and office environment lowering system administration and learning costs.
应用说明 2003-01-23 |
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207 KB
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Agilent 3070 Outsource Series Pay-Per-Use Board Test System
With an Agilent 3070 Outsource Pay-Per-Use System, you can define your system according to the products you have to test.
应用说明 2002-03-08 |
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247 KB
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Agilent TestJet Technology White Paper
This paper describes the Agilent TestJet technique, which makes use of a property of most digital ICs in use in the mid-1990s: the lead frame.
应用说明 2000-01-01 |
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AOI - A Strategy for Closing the Loop
This paper describes a set of defect prevention solutions centered on the availability of high-quality inspection and measurements data from an AOI system and a few carefully engineered software applications
应用说明 2006-04-16 |
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291 KB
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AXI and Lead-Free Process Characterization
How to use Automated X-ray Inspection as a tool to characterize new lead-free soldering processes.
应用说明 2005-06-21 |
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Boundary Scan Ground Bounce Suppression
Boundary-Scan circuitry, while in the process of testing interconnections, can set up and excite current surges on a board. This in turn can cause "ground bounce".
应用说明 1998-04-24 |
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14 KB
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Boundary Scan Helps EMS Companies Cut Test Costs and Increase Revenues
Electronics Manufacturing Services (EMS) providers can utilize boundary-scan to reduce test cost expenses and also generate additional revenue opportunities.
应用说明 2003-03-01 |
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242 KB
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Boundary-Scan Technology, Justification, and Test Implementation for Designers
This paper provides practical insight for designers on the merits, design, and test implementation of Boundary-Scan Technology.
应用说明 1998-05-27 |
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29 KB
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Breakthrough Innovations: Agilent Automated Silicon Nails
Automated Silicon Nails takes the popular IEEE 1149.1 Boundary-Scan standard even further by using Boundary-Scan chains to automatically test non-Boundary-Scan devices.
应用说明 2001-08-15 |
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460 KB
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Comparing AOI and AXI
Choosing the right technology requires looking at board mix, capital budget and other business considerations. But most of all, you need to understand the typical characteristics of each technology.
应用说明 2001-07-25 |
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42 KB
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Connecting a UPS to a 3070 Controller
This paper describes how to connect a UPS to the 3070 testhead controller. It uses the Advanced Power Conversion Smart-UPS with PowerChute Plus software.
应用说明 2003-01-07 |
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87 KB
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Considerations for Surface Map Setup
The concept of delta-Zs is perhaps the most difficult thing to understand about the surface map process.
应用说明 2006-08-08 |
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Dealing with Board Thickness Variations
The Agilent 5DX has the capability to be implemented such that it can accommodate thickness variations on a board-by-board basis. NOTE: Content described is in the 5DX Reference Guide but is no longer in Chapter 7 as mentioned herein.
应用说明 2001-05-16 |
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31 KB
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Design Considerations for PC Board Carriers for Use in the Agilent 5DX
There are several reasons why it may be necessary or desirable to use a carrier to transport printed circuit assemblies through the 5DX. This paper discusses these and some considerations for the design of suitable carriers.
应用说明 2005-07-13 |
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918 KB
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Design for Testability - Test for Designability
This paper addresses testability considerations, both physical and logical, and focuses on both the new constraints and the new freedoms of modern manufacturing test in the ever-changing challenge.
应用说明 2003-01-28 |
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852 KB
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Discharge on Unpowered Agilent 3070 Systems
This paper is applicable to both powered and unpowered Agilent 3070 systems, but does not explain how a discharge routine is created on an Unpowered system.
应用说明 2003-06-13 |
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