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3070 Board Tests are Reliable, Repeatable and Transportable. Here's Why.
It would take a very long paper to discuss all of the factors that make Agilent 3070 tests so reliable, repeatable, and transportable. This paper selects a few of the important ones.
應用手冊 2001-08-15 |
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223 KB
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3070 In System Programming (ISP) Family
On Board Programming, Bottom Line Benefits
應用手冊 2002-07-25 |
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200 KB
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3070 Increasing Throughput
There are decisions one can make that causes an Agilent 3070 test program to be slower or faster than what Test Consultant generates automatically. This paper offers many tips about how to optimize your system's performance.
應用手冊 1997-03-03 |
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41 KB
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3070 Series 3 Flash70 Programming Guide
This guide contains information about the procedures, tasks, and syntax required to perform flash programming with HP 3070 test systems.
應用手冊 2001-09-12 |
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1.85 MB
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3D Inline Solder Paste Inspection - Benefit Realized
100% solder paste inspection helps to reduce the contribution from the print process to solder joint defects.
應用手冊 2003-06-01 |
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59 KB
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5DX Virus Protection Software Policy
Agilent recognizes that customers require data protection for their PC workstations and computer controlled manufacturing equipment such as the 5DX Test System and associated workstations.
應用手冊 2004-08-26 |
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A New Process for Measuring and Displaying Board Test Coverage
Written by Kenneth P. Parker, Agilent Technologies. First presented at Apex 2003, Anaheim, California.
應用手冊 2003-01-01 |
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116 KB
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A Quality Test Demands A Quality Fixture
A Check List for getting a quality board test fixture first time, every time.
應用手冊 2001-05-16 |
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26 KB
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Agilent 3070 Now Powered by Industrial PC Controllers
The Agilent 3070 is now controlled by PCs similar to others used in your production and office environment lowering system administration and learning costs.
應用手冊 2003-01-23 |
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207 KB
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Agilent 3070 Outsource Series Pay-Per-Use Board Test System
With an Agilent 3070 Outsource Pay-Per-Use System, you can define your system according to the products you have to test.
應用手冊 2002-03-08 |
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247 KB
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Agilent TestJet Technology White Paper
This paper describes the Agilent TestJet technique, which makes use of a property of most digital ICs in use in the mid-1990s: the lead frame.
應用手冊 2000-01-01 |
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AOI - A Strategy for Closing the Loop
This paper describes a set of defect prevention solutions centered on the availability of high-quality inspection and measurements data from an AOI system and a few carefully engineered software applications
應用手冊 2006-04-16 |
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291 KB
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AXI and Lead-Free Process Characterization
How to use Automated X-ray Inspection as a tool to characterize new lead-free soldering processes.
應用手冊 2005-06-21 |
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Boundary Scan Ground Bounce Suppression
Boundary-Scan circuitry, while in the process of testing interconnections, can set up and excite current surges on a board. This in turn can cause "ground bounce".
應用手冊 1998-04-24 |
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14 KB
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Boundary Scan Helps EMS Companies Cut Test Costs and Increase Revenues
Electronics Manufacturing Services (EMS) providers can utilize boundary-scan to reduce test cost expenses and also generate additional revenue opportunities.
應用手冊 2003-03-01 |
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242 KB
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Boundary-Scan Technology, Justification, and Test Implementation for Designers
This paper provides practical insight for designers on the merits, design, and test implementation of Boundary-Scan Technology.
應用手冊 1998-05-27 |
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29 KB
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Breakthrough Innovations: Agilent Automated Silicon Nails
Automated Silicon Nails takes the popular IEEE 1149.1 Boundary-Scan standard even further by using Boundary-Scan chains to automatically test non-Boundary-Scan devices.
應用手冊 2001-08-15 |
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460 KB
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Comparing AOI and AXI
Choosing the right technology requires looking at board mix, capital budget and other business considerations. But most of all, you need to understand the typical characteristics of each technology.
應用手冊 2001-07-25 |
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42 KB
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Connecting a UPS to a 3070 Controller
This paper describes how to connect a UPS to the 3070 testhead controller. It uses the Advanced Power Conversion Smart-UPS with PowerChute Plus software.
應用手冊 2003-01-07 |
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87 KB
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Considerations for Surface Map Setup
The concept of delta-Zs is perhaps the most difficult thing to understand about the surface map process.
應用手冊 2006-08-08 |
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Dealing with Board Thickness Variations
The Agilent 5DX has the capability to be implemented such that it can accommodate thickness variations on a board-by-board basis. NOTE: Content described is in the 5DX Reference Guide but is no longer in Chapter 7 as mentioned herein.
應用手冊 2001-05-16 |
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31 KB
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Design Considerations for PC Board Carriers for Use in the Agilent 5DX
There are several reasons why it may be necessary or desirable to use a carrier to transport printed circuit assemblies through the 5DX. This paper discusses these and some considerations for the design of suitable carriers.
應用手冊 2005-07-13 |
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918 KB
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Design for Testability - Test for Designability
This paper addresses testability considerations, both physical and logical, and focuses on both the new constraints and the new freedoms of modern manufacturing test in the ever-changing challenge.
應用手冊 2003-01-28 |
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852 KB
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Discharge on Unpowered Agilent 3070 Systems
This paper is applicable to both powered and unpowered Agilent 3070 systems, but does not explain how a discharge routine is created on an Unpowered system.
應用手冊 2003-06-13 |
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Discreet Analog Device Testing
The Agilent 3070 series has quite a few built in features to make developing board tests easier, while protecting the operator, the board under test, and the 3070 itself from harm.
應用手冊 1998-10-29 |
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26 KB
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