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3070 Board Tests are Reliable, Repeatable and Transportable. Here's Why. 
It would take a very long paper to discuss all of the factors that make Agilent 3070 tests so reliable, repeatable, and transportable. This paper selects a few of the important ones.

Application Note 2001-08-15

PDF PDF 223 KB
3070 In System Programming (ISP) Family 
On Board Programming, Bottom Line Benefits

Application Note 2002-07-25

PDF PDF 200 KB
3070 Increasing Throughput 
There are decisions one can make that causes an Agilent 3070 test program to be slower or faster than what Test Consultant generates automatically. This paper offers many tips about how to optimize your system's performance.

Application Note 1997-03-03

PDF PDF 41 KB
3070 Series 3 Flash70 Programming Guide 
This guide contains information about the procedures, tasks, and syntax required to perform flash programming with HP 3070 test systems.

Application Note 2001-09-12

PDF PDF 1.85 MB
3D Inline Solder Paste Inspection - Benefit Realized 
100% solder paste inspection helps to reduce the contribution from the print process to solder joint defects.

Application Note 2003-06-01

PDF PDF 59 KB
5DX Virus Protection Software Policy 
Agilent recognizes that customers require data protection for their PC workstations and computer controlled manufacturing equipment such as the 5DX Test System and associated workstations.

Application Note 2004-08-26

 
A New Process for Measuring and Displaying Board Test Coverage 
Written by Kenneth P. Parker, Agilent Technologies. First presented at Apex 2003, Anaheim, California.

Application Note 2003-01-01

PDF PDF 116 KB
A Quality Test Demands A Quality Fixture 
A Check List for getting a quality board test fixture first time, every time.

Application Note 2001-05-16

PDF PDF 26 KB
Agilent 3070 Now Powered by Industrial PC Controllers 
The Agilent 3070 is now controlled by PCs similar to others used in your production and office environment lowering system administration and learning costs.

Application Note 2003-01-23

PDF PDF 207 KB
Agilent 3070 Outsource Series Pay-Per-Use Board Test System 
With an Agilent 3070 Outsource Pay-Per-Use System, you can define your system according to the products you have to test.

Application Note 2002-03-08

PDF PDF 247 KB
Agilent TestJet Technology White Paper 
This paper describes the Agilent TestJet technique, which makes use of a property of most digital ICs in use in the mid-1990s: the lead frame.

Application Note 2000-01-01

 
AOI - A Strategy for Closing the Loop 
This paper describes a set of defect prevention solutions centered on the availability of high-quality inspection and measurements data from an AOI system and a few carefully engineered software applications

Application Note 2006-04-16

PDF PDF 291 KB
AXI and Lead-Free Process Characterization 
How to use Automated X-ray Inspection as a tool to characterize new lead-free soldering processes.

Application Note 2005-06-21

 
Boundary Scan Ground Bounce Suppression 
Boundary-Scan circuitry, while in the process of testing interconnections, can set up and excite current surges on a board. This in turn can cause "ground bounce".

Application Note 1998-04-24

PDF PDF 14 KB
Boundary Scan Helps EMS Companies Cut Test Costs and Increase Revenues 
Electronics Manufacturing Services (EMS) providers can utilize boundary-scan to reduce test cost expenses and also generate additional revenue opportunities.

Application Note 2003-03-01

PDF PDF 242 KB
Boundary-Scan Technology, Justification, and Test Implementation for Designers 
This paper provides practical insight for designers on the merits, design, and test implementation of Boundary-Scan Technology.

Application Note 1998-05-27

PDF PDF 29 KB
Breakthrough Innovations: Agilent Automated Silicon Nails 
Automated Silicon Nails takes the popular IEEE 1149.1 Boundary-Scan standard even further by using Boundary-Scan chains to automatically test non-Boundary-Scan devices.

Application Note 2001-08-15

PDF PDF 460 KB
Comparing AOI and AXI 
Choosing the right technology requires looking at board mix, capital budget and other business considerations. But most of all, you need to understand the typical characteristics of each technology.

Application Note 2001-07-25

PDF PDF 42 KB
Connecting a UPS to a 3070 Controller 
This paper describes how to connect a UPS to the 3070 testhead controller. It uses the Advanced Power Conversion Smart-UPS with PowerChute Plus software.

Application Note 2003-01-07

PDF PDF 87 KB
Considerations for Surface Map Setup 
The concept of delta-Zs is perhaps the most difficult thing to understand about the surface map process.

Application Note 2006-08-08

 
Dealing with Board Thickness Variations 
The Agilent 5DX has the capability to be implemented such that it can accommodate thickness variations on a board-by-board basis. NOTE: Content described is in the 5DX Reference Guide but is no longer in Chapter 7 as mentioned herein.

Application Note 2001-05-16

PDF PDF 31 KB
Design Considerations for PC Board Carriers for Use in the Agilent 5DX 
There are several reasons why it may be necessary or desirable to use a carrier to transport printed circuit assemblies through the 5DX. This paper discusses these and some considerations for the design of suitable carriers.

Application Note 2005-07-13

PDF PDF 918 KB
Design for Testability - Test for Designability 
This paper addresses testability considerations, both physical and logical, and focuses on both the new constraints and the new freedoms of modern manufacturing test in the ever-changing challenge.

Application Note 2003-01-28

PDF PDF 852 KB
Discharge on Unpowered Agilent 3070 Systems 
This paper is applicable to both powered and unpowered Agilent 3070 systems, but does not explain how a discharge routine is created on an Unpowered system.

Application Note 2003-06-13

 
Discreet Analog Device Testing 
The Agilent 3070 series has quite a few built in features to make developing board tests easier, while protecting the operator, the board under test, and the 3070 itself from harm.

Application Note 1998-10-29

PDF PDF 26 KB

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