Contact an Expert

Manufacturing & Production Test

Refine the List

remove all refinements

By Type of Content

By Product Category

101-116 of 116

Sort:
Understanding the PCAP Polarity Reject Signal 
This paper describes the algorithm used to determine if polarized capacitors are properly oriented.

Application Note 2004-12-02

PDF PDF 1.09 MB
UNIX vs. Windows Differences for 3070 Users 
This documentation serves as a PC transition guide to help existing 3070 customers migrate from the Unix platform to the PC platform.

Application Note 2002-09-19

 
Up-and-Down Programming DUT Power Supplies 
There seems to be some confusion on what the current limits are when using the DUT supplies in the Agilent 3070 system. While this article is not meant to be an exhaustive treatise on the subject, a little clarification might help.

Application Note 2001-05-17

PDF PDF 23 KB
Use of the Test Results Command Processor 
TRCMDPRO processes the results from the Agilent 5DX in a way that is specified by a command file. This file is TRCMDPRO.CMD. In addition to the software revisions named, the document applies to all 5DX software versions.

Application Note 1998-01-12

PDF PDF 20 KB
Use of Wrong Thickness Technique Gives Bad Test Results 
Beginning with release 6.0, there are two techniques for measurement of solder thickness on the Agilent 5DX, each based on use of a different Confirmation & Adjustment panel.

Application Note 2000-12-31

 
Using Boundary Scan to Link Design and Manufacturing Test 
By leveraging boundary-scan tests generated in Design and re-using them at Manufacturing Test, manufacturers can produce long-term benefits in terms of lower costs, greater efficiencies and higher quality products.

Application Note 2003-03-01

PDF PDF 502 KB
Using Lead-Free PCB Finishes at Manufacturing In-circuit Test Stage 
The purpose of this document is to share experiences and educate engineers regarding different PCB surface finishes and the specific changes required in the PCB build process to allow for ICT.

Application Note 2004-08-08

PDF PDF 102 KB
Using LXI to Boost Throughput in Semiconductor Manufacturing 
This document is a case study that discusses the successful customer implementation of an Agilent LXI solution for a multinational semiconductor manufacturer

Application Note 2007-04-25

PDF PDF 234 KB
Using NDFCOL.EXE, the NDF "Line Up the Columns" Utility 
NDFCOL.EXE is a handy little utility that will form neat columns of data in NDF files.

Application Note 2002-06-06

 
Using Pop-up Windows 
There are occasions where the use of a pop-up window would be advantageous while testing boards on the Agilent 3070. This article is meant to highlight one method that can be used to obtain that end.

Application Note 1996-01-01

PDF PDF 18 KB
Version 7.x ASAP Best Practices  
In an effort to standardize programming practices for the Agilent 5DX, Agilent has created a set of procedures representing 5DX "best practices" that address various aspects of the programming process.

Application Note 2001-07-25

 
What to Consider When Selecting the Optimal Test Strategy 
This paper addresses several issues for selecting the optimal inspection strategy, presenting data from many studies that Agilent has performed in the quest to find the optimal test / inspection strategy.

Application Note 2003-03-01

PDF PDF 175 KB
When to Use AOI, When to Use AXI, and When to Use Both 
by Stig Oresjo, senior test strategy consultant at Agilent Technologies.

Application Note 2002-12-01

PDF PDF 70 KB
Windows & Unix Feature Comparison 
The Windows & Unix 3070 Feature Comparison document provides a detailed listing of features translated to the Windows based 3070 from the Unix based 3070.

Application Note 2002-07-31

PDF PDF 71 KB
Writing Flash Memory with Agilent 3070 Systems 
Flash memory is traditionally programmed on PROM programmers, but some manufacturers report a one percent damage rate due to the extra handling steps required!

Application Note 2001-05-18

PDF PDF 31 KB
“Shotgunning”, a Bad Fit for Lead-Free Test 
Shotgunning, a common repair technique in functional test, will be negatively affected by lead-free processes. This article explores the technique and draws broad conclusions regarding the impact of lead-free on electronics manufacturing test

Application Note 2006-02-07

PDF PDF 44 KB

Previous 1 2 3 4 5