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3070 Board Tests are Reliable, Repeatable and Transportable. Here's Why. 
It would take a very long paper to discuss all of the factors that make Agilent 3070 tests so reliable, repeatable, and transportable. This paper selects a few of the important ones.

Application Note 2001-08-15

PDF PDF 223 KB
3070 In System Programming (ISP) Family 
On Board Programming, Bottom Line Benefits

Application Note 2002-07-25

PDF PDF 200 KB
3070 Increasing Throughput 
There are decisions one can make that causes an Agilent 3070 test program to be slower or faster than what Test Consultant generates automatically. This paper offers many tips about how to optimize your system's performance.

Application Note 1997-03-03

PDF PDF 41 KB
3070 Series 3 Flash70 Programming Guide 
This guide contains information about the procedures, tasks, and syntax required to perform flash programming with HP 3070 test systems.

Application Note 2001-09-12

PDF PDF 1.85 MB
3D Inline Solder Paste Inspection - Benefit Realized 
100% solder paste inspection helps to reduce the contribution from the print process to solder joint defects.

Application Note 2003-06-01

PDF PDF 59 KB
A New Process for Measuring and Displaying Board Test Coverage 
Written by Kenneth P. Parker, Agilent Technologies. First presented at Apex 2003, Anaheim, California.

Application Note 2003-01-01

PDF PDF 116 KB
A Quality Test Demands A Quality Fixture 
A Check List for getting a quality board test fixture first time, every time.

Application Note 2001-05-16

PDF PDF 26 KB
AOI - A Strategy for Closing the Loop 
This paper describes a set of defect prevention solutions centered on the availability of high-quality inspection and measurements data from an AOI system and a few carefully engineered software applications

Application Note 2006-04-16

PDF PDF 291 KB
Appliance Testing 
In this Application Note following the description of the appliance testing application, measurement and control requirements for characterizing devices are discussed. Then, Agilent VXI-based data acquisition suitable for such an application is listed. Description Household and commercial...

Application Note 1997-11-01

PDF PDF 110 KB
Boundary Scan Helps EMS Companies Cut Test Costs and Increase Revenues 
Electronics Manufacturing Services (EMS) providers can utilize boundary-scan to reduce test cost expenses and also generate additional revenue opportunities.

Application Note 2003-03-01

PDF PDF 242 KB
Boundary-Scan Technology, Justification, and Test Implementation for Designers 
This paper provides practical insight for designers on the merits, design, and test implementation of Boundary-Scan Technology.

Application Note 1998-05-27

PDF PDF 29 KB
Breakthrough Innovations: Agilent Automated Silicon Nails 
Automated Silicon Nails takes the popular IEEE 1149.1 Boundary-Scan standard even further by using Boundary-Scan chains to automatically test non-Boundary-Scan devices.

Application Note 2001-08-15

PDF PDF 460 KB
Building Hybrid Test Systems. Ensuring success in two common development scenarios - Application Not 
Application Note 1465-33. When you migrate to a hybrid system that includes LXI along with GPIB, VXI, PXI, or any other architecture, two scenarios are most typical, minimum development time and maximum overall performance

Application Note 2008-10-15

PDF PDF 281 KB
Languages 
Canning Process Characterization 
Following the description of the canning process application, measurement and control requirements for characterizing the process are discussed, then in this Application Note, Agilent data acquisition equipment suitable for such an application is listed. Description In the canning industry...

Application Note 1997-11-01

PDF PDF 94 KB
Comparing AOI and AXI 
Choosing the right technology requires looking at board mix, capital budget and other business considerations. But most of all, you need to understand the typical characteristics of each technology.

Application Note 2001-07-25

PDF PDF 42 KB
Considerations for Surface Map Setup 
The concept of delta-Zs is perhaps the most difficult thing to understand about the surface map process.

Application Note 2006-08-08

 
Dealing with Board Thickness Variations 
The Agilent 5DX has the capability to be implemented such that it can accommodate thickness variations on a board-by-board basis. NOTE: Content described is in the 5DX Reference Guide but is no longer in Chapter 7 as mentioned herein.

Application Note 2001-05-16

PDF PDF 31 KB
Design for Testability - Test for Designability 
This paper addresses testability considerations, both physical and logical, and focuses on both the new constraints and the new freedoms of modern manufacturing test in the ever-changing challenge.

Application Note 2003-01-28

PDF PDF 852 KB
Electrical In-circuit Test Methods for Limited-access Boards 
This paper surveys the various electrical test methods and tools available to address testing boards that lack full electrical access.

Application Note 2001-02-27

PDF PDF 47 KB
Ground Bounce Basics and Best Practices 
This article offers a description of the physical properties that result in ground bounce during board test.

Application Note 2003-01-28

PDF PDF 138 KB
High Node Count Fixturing Solutions for Agilent Short-Wire Test Fixtures 
This paper discusses problems encountered in building large, high node count vacuum actuated test fixtures for the Agilent 3070 family of board test systems.

Application Note 2008-04-30

PDF PDF 67 KB
How To Float, or Series, Agilent 3070 DUT Supplies 
The Agilent 3070 development software does an amazing job of calculating the wiring needed to build fixtures. Even so there are occasionally cases which require wiring that the standard Agilent 3070 software can not handle.

Application Note 1997-01-23

PDF PDF 34 KB
Improved Fault Coverage in a Combined X-ray and In-Circuit Test Environment 
Cutting functional test failures in half and doubling the faults detected at process test! These are some of the case study results observed in combined X-ray and in-circuit test environments.

Application Note 2001-02-27

PDF PDF 575 KB
In-circuit Testing of Low Voltage Devices 
Core technical document summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.

Application Note 2005-05-25

PDF PDF 172 KB
In-System Programming on the Agilent 3070 
In-System Programmable devices are more widely used on today's boards to provide flexibility to design engineers and to reduce the cost of a product.

Application Note 2001-07-02

PDF PDF 205 KB

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