製造與生產測試
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以新型 Agilent 34410A/34411A 高性能數位萬用電錶來替代 Agilent 34401A
本應用手冊提供「Agilent 34401A 6 1/2 位數數位萬用電錶」及新型「Agilent 34410A 及 Agilent 34411A 6 1/2 位數高性能 DMM」間的高階差異概述。
應用手冊 2006-02-08 |
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如何以Agilent N67xxA模組化電源系統來取代Agilent 662xA
662Xa至N67xxA MPS轉換指南
應用手冊 2004-01-01 |
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提高汽車ECU的測試速度
提高汽車ECU的測試速度
應用手冊 2004-12-28 |
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簡化PC主機板測試時多重偏壓電壓的排序與變換
簡化PC主機板測試時多重偏壓電壓的排序與變換
應用手冊 2004-12-29 |
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讓直流輸入電池變壓器的測試速度提高好幾倍
讓直流輸入電池變壓器的測試速度提高好幾倍
應用手冊 2004-12-28 |
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10 Hints for Using Your Power Supply to Decrease Test Time
Learn how to get the most from your power products by reading this 12-page booklet. When you're trying to boost throughput in time-critical production test systems, a small change in the way you operate or program a supply can have a surprising impact on test speeds. Specifically, the booklet...
應用手冊 1999-10-12 |
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3070 Board Tests are Reliable, Repeatable and Transportable. Here's Why.
It would take a very long paper to discuss all of the factors that make Agilent 3070 tests so reliable, repeatable, and transportable. This paper selects a few of the important ones.
應用手冊 2001-08-15 |
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223 KB
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3070 In System Programming (ISP) Family
On Board Programming, Bottom Line Benefits
應用手冊 2002-07-25 |
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200 KB
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3070 Increasing Throughput
There are decisions one can make that causes an Agilent 3070 test program to be slower or faster than what Test Consultant generates automatically. This paper offers many tips about how to optimize your system's performance.
應用手冊 1997-03-03 |
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41 KB
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3070 Series 3 Flash70 Programming Guide
This guide contains information about the procedures, tasks, and syntax required to perform flash programming with HP 3070 test systems.
應用手冊 2001-09-12 |
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1.85 MB
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3D Inline Solder Paste Inspection - Benefit Realized
100% solder paste inspection helps to reduce the contribution from the print process to solder joint defects.
應用手冊 2003-06-01 |
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59 KB
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5DX Virus Protection Software Policy
Agilent recognizes that customers require data protection for their PC workstations and computer controlled manufacturing equipment such as the 5DX Test System and associated workstations.
應用手冊 2004-08-26 |
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A New Process for Measuring and Displaying Board Test Coverage
Written by Kenneth P. Parker, Agilent Technologies. First presented at Apex 2003, Anaheim, California.
應用手冊 2003-01-01 |
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116 KB
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A Quality Test Demands A Quality Fixture
A Check List for getting a quality board test fixture first time, every time.
應用手冊 2001-05-16 |
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26 KB
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Agilent 3070 Now Powered by Industrial PC Controllers
The Agilent 3070 is now controlled by PCs similar to others used in your production and office environment lowering system administration and learning costs.
應用手冊 2003-01-23 |
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207 KB
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Agilent 3070 Outsource Series Pay-Per-Use Board Test System
With an Agilent 3070 Outsource Pay-Per-Use System, you can define your system according to the products you have to test.
應用手冊 2002-03-08 |
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247 KB
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Agilent TestJet Technology White Paper
This paper describes the Agilent TestJet technique, which makes use of a property of most digital ICs in use in the mid-1990s: the lead frame.
應用手冊 2000-01-01 |
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AOI - A Strategy for Closing the Loop
This paper describes a set of defect prevention solutions centered on the availability of high-quality inspection and measurements data from an AOI system and a few carefully engineered software applications
應用手冊 2006-04-16 |
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291 KB
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Appliance Testing
In this Application Note following the description of the appliance testing application, measurement and control requirements for characterizing devices are discussed. Then, Agilent VXI-based data acquisition suitable for such an application is listed. Description Household and commercial...
應用手冊 1997-11-01 |
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110 KB
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AXI and Lead-Free Process Characterization
How to use Automated X-ray Inspection as a tool to characterize new lead-free soldering processes.
應用手冊 2005-06-21 |
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Boundary Scan Ground Bounce Suppression
Boundary-Scan circuitry, while in the process of testing interconnections, can set up and excite current surges on a board. This in turn can cause "ground bounce".
應用手冊 1998-04-24 |
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14 KB
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Boundary Scan Helps EMS Companies Cut Test Costs and Increase Revenues
Electronics Manufacturing Services (EMS) providers can utilize boundary-scan to reduce test cost expenses and also generate additional revenue opportunities.
應用手冊 2003-03-01 |
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242 KB
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Boundary-Scan Technology, Justification, and Test Implementation for Designers
This paper provides practical insight for designers on the merits, design, and test implementation of Boundary-Scan Technology.
應用手冊 1998-05-27 |
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29 KB
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Breakthrough Innovations: Agilent Automated Silicon Nails
Automated Silicon Nails takes the popular IEEE 1149.1 Boundary-Scan standard even further by using Boundary-Scan chains to automatically test non-Boundary-Scan devices.
應用手冊 2001-08-15 |
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460 KB
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Building Hybrid Test Systems. Ensuring success in two common development scenarios - Application Not
Application Note 1465-33. When you migrate to a hybrid system that includes LXI along with GPIB, VXI, PXI, or any other architecture, two scenarios are most typical, minimum development time and maximum overall performance
應用手冊 2008-10-15 |
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