制造与生产测试
1-25 / 125
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Burn-In Test - LXinstruments
Burn-in Testing Solutions from LXinstruments and Agilent.
Solution Brief 2012-12-04 |
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PXI Functional Test - TTCI
PXI Functional Test Solution from TTCI and Agilent
Solution Brief 2012-08-03 |
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Functional Test - TTCI
Functional Test Solutions from TTCI and Agilent.
Solution Brief 2012-07-24 |
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LXI Functional Test - LXinstruments
LXI Functional Test Solutions from LXinstruments and Agilent.
Solution Brief 2012-06-22 |
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Automotive Radar Test - Konrad
Automotive Radar Test Solution from Konrad and Agilent.
Solution Brief 2012-06-12 |
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Modular Functional Test – Circuit Check
Modular Functional Test Solutions from Circuit Check and Agilent
Solution Brief 2012-06-09 |
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Test Instrument Emulator - WinSoft
Test Instrument Emulation Solution from WinSoft and Agilent.
Solution Brief 2012-05-11 |
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Power Supply Test – FineTest
Power Supply Test Solutions from FineTest and Agilent
Solution Brief 2012-03-14 |
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构建混合测试系统,确保在两个公共开发情景中取得成功
应用说明 2008-10-15 |
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High Node Count Fixturing Solutions for Agilent Short-Wire Test Fixtures
This paper discusses problems encountered in building large, high node count vacuum actuated test fixtures for the Agilent 3070 family of board test systems.
应用说明 2008-04-30 |
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Using LXI to Boost Throughput in Semiconductor Manufacturing
This document is a case study that discusses the successful customer implementation of an Agilent LXI solution for a multinational semiconductor manufacturer
应用说明 2007-04-25 |
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Maximising Test Coverage with Agilent Medalist VTEP v2.0
This paper describes how to get the most from Agilent Technologies’ industry-leading vectorless test innovation, the Medalist VTEP v2.0 which is a suite of solution comprising VTEP, iVTEP and NPM.
应用说明 2007-04-17 |
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Life and Stability of the Agilent 5DX Sealed X-ray Tube
Agilent has developed a sealed ultra-high vacuum X-ray tube that provides stable output throughout a significantly long life.
应用说明 2007-01-22 |
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Considerations for Surface Map Setup
The concept of delta-Zs is perhaps the most difficult thing to understand about the surface map process.
应用说明 2006-08-08 |
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N6700电源系统AN1560
N6700电源系统AN1560
应用说明 2006-08-01 |
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SEMI S2 Standard Modifications for Agilent 3070 and Related Equipment
This document describes three items pertaining to the Agilent 3070 and the SEMI S2 standard. Each of them is related to a variance with the SEMI standard.
应用说明 2006-06-15 |
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AOI - A Strategy for Closing the Loop
This paper describes a set of defect prevention solutions centered on the availability of high-quality inspection and measurements data from an AOI system and a few carefully engineered software applications
应用说明 2006-04-16 |
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“Shotgunning”, a Bad Fit for Lead-Free Test
Shotgunning, a common repair technique in functional test, will be negatively affected by lead-free processes. This article explores the technique and draws broad conclusions regarding the impact of lead-free on electronics manufacturing test
应用说明 2006-02-07 |
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用新的Agilent 34410A 和34411A 高性能数字万用表代替Agilent 34401A
该应用指南对 Agilent 34401A 6 1/2 位数字万用表与新型 Agilent 34410A 及 34411A 6 1/2 位高性能数字万用表之间的差异进行了简要而透彻的说明。
应用说明 2005-12-01 |
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How to Get the Most from Agilent's Intelligent Yield Enhancement Test (IYET)
This paper describes how to get the most from IYET for Agilent board test systems.
应用说明 2005-07-15 |
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Design Considerations for PC Board Carriers for Use in the Agilent 5DX
There are several reasons why it may be necessary or desirable to use a carrier to transport printed circuit assemblies through the 5DX. This paper discusses these and some considerations for the design of suitable carriers.
应用说明 2005-07-13 |
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AXI and Lead-Free Process Characterization
How to use Automated X-ray Inspection as a tool to characterize new lead-free soldering processes.
应用说明 2005-06-21 |
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In-circuit Testing of Low Voltage Devices
Core technical document summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.
应用说明 2005-05-25 |
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改进直流适配器测试方案,以成倍提高测试速度
应用说明 2005-04-01 |
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提高汽车ECU(引擎控制单元)测试的吞吐率
应用说明 2005-04-01 |
