Cellular
Agilent Technologies, the world’s premier measurement company, offers a full range of design, test, and management solutions that span the range of cellular technologies—from legacy 1G systems through 3G systems such as HSPA to 3GPP Long Term Evolution (LTE) and 1xEV-DO. Agilent products cover the lifecycle from early design and development, through volume manufacturing, to network deployment and service assurance. See the Quick Guide to Agilent’s Solutions for High-Speed Cellular for an overview of all technologies and supporting product families. To learn more about related technologies consult MIMO Test and Wireless Connectivity. Greater insight. Greater confidence. Accelerate next-generation wireless.
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8960 in Wireless Device Design News
Issue 2 Series 2
Newsletter 2010-08-30 |
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8960 in Wireless Device Design News
Issue 5 Series 2
Newsletter 2010-08-30 |
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8960 in Wireless Device Design News article archive
Previous Issues
Newsletter 2008-01-30 |
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Efficient Design Exploration and Verification in HSUPA Transceivers
An Article by Hong Zhou (WiPHY Technologies, Inc.) & Afshin Amini (Agilent Technologies) on efficient design exploration and verification in High-Speed Uplink Packet Access (HSUPA) transceivers.
Article 2006-05-09 |
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2.36 MB
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Evaluating data transfer in HSDPA/W-CDMA nets
Published with permission from Global Sources October 2007
Article 2007-10-15 |
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2.84 MB
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High-Speed Data Throughput Test
Ensure a quality user experience by fully testing the packet data performance of your wireless device early in the design cycle. The 8960 offers the highest 2G/3G/3.5G data rates and real-world testing to find issues sooner and resolve them faster!
Feature Story 2011-11-29 |
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Systematic Troubleshooting of HSDPA Mobile Data Throughput
The aim of this paper is to introduce mobile development engineers to factors impacting data throughput caused by actual customer connections of the mobile device.
Article 2006-09-28 |
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27 KB
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Testing HSUPA devices
By: Jeanne Fightmaster, Agilent Technologies
Published with permissions of EETimes Asia
Article 2007-11-16 |
PDF
404 KB
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