Manufacturing & Production Test
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26-50 of 116
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Design Considerations for PC Board Carriers for Use in the Agilent 5DX
There are several reasons why it may be necessary or desirable to use a carrier to transport printed circuit assemblies through the 5DX. This paper discusses these and some considerations for the design of suitable carriers.
Application Note 2005-07-13 |
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Design for Testability - Test for Designability
This paper addresses testability considerations, both physical and logical, and focuses on both the new constraints and the new freedoms of modern manufacturing test in the ever-changing challenge.
Application Note 2003-01-28 |
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Discharge on Unpowered Agilent 3070 Systems
This paper is applicable to both powered and unpowered Agilent 3070 systems, but does not explain how a discharge routine is created on an Unpowered system.
Application Note 2003-06-13 |
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Discreet Analog Device Testing
The Agilent 3070 series has quite a few built in features to make developing board tests easier, while protecting the operator, the board under test, and the 3070 itself from harm.
Application Note 1998-10-29 |
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Effective Multitap Transformer Testing Using a Scanner (AN 1224-5)
This Application Note shows an effective multi-tap transformer measurement using a scanner and the Agilent 4263B LCR Meter.
Application Note 2001-11-05 |
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Effects of Lead Free Solders on Imaging Characteristics of the Agilent 5DX Laminographic X-ray Test
The electronics industry is under pressure to migrate solder processes away from the usage of eutectic tin-lead solder and towards utilization of lead-free compounds.
Application Note 1998-05-01 |
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Electrical In-circuit Test Methods for Limited-access Boards
This paper surveys the various electrical test methods and tools available to address testing boards that lack full electrical access.
Application Note 2001-02-27 |
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Electronic Heater Valves Testing (AN 1270-4)
Production testing of heater/air conditioning system valves is performed on high speed HP automatic test systems with minimum operator interface.
This Application Note describes a typical HP VXI system configuration for testing automotive
heater/air-conditioning system valves.
Application Note 1995-06-01 |
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Essential Testability Guidelines for Current Technology
This paper addresses essential testability considerations, both electrical and mechanical, and focuses on new requirements of current technologies.
Application Note 1993-04-22 |
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Fixture Interface Pin (MINT Pin) Maintenance
Fixture Interface Pins (MINT Pins) used in production testing will eventually get dirty enough to cause contact problems.
Application Note 1998-03-01 |
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Gauge Repeatability on 5DX X-ray System
Summary of 5DX repeatability capability, factors that influence the repeatability capabilities of the 5DX, impacts to gauge repeatability and reproducibility (GR&R) results.
Application Note 2005-03-09 |
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Ground Bounce Basics and Best Practices
This article offers a description of the physical properties that result in ground bounce during board test.
Application Note 2003-01-28 |
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Handling Surface Mapping with Varying Board Construction
This paper describes a method for dealing with lot-to-lot or supplier-to-supplier variations in board construction. Often the variations in board construction result in different color boards which otherwise cause problems with surface mapping.
Application Note 2004-12-02 |
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High Node Count Fixturing Solutions for Agilent Short-Wire Test Fixtures
This paper discusses problems encountered in building large, high node count vacuum actuated test fixtures for the Agilent 3070 family of board test systems.
Application Note 2008-04-30 |
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How and Why: Confirmation and Adjustments
This paper describes the process of and reason for periodic adjustment of a 5DX system using the confirmation and adjustment panel.
Application Note 2004-12-01 |
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How To Float, or Series, Agilent 3070 DUT Supplies
The Agilent 3070 development software does an amazing job of calculating the wiring needed to build fixtures. Even so there are occasionally cases which require wiring that the standard Agilent 3070 software can not handle.
Application Note 1997-01-23 |
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How to Get the Most from Agilent's Intelligent Yield Enhancement Test (IYET)
This paper describes how to get the most from IYET for Agilent board test systems.
Application Note 2005-07-15 |
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How to use the Agilent N6700 Modular Power System to replace an Agilent 662xA (AN 1467)
This is a high-level overview to help current 662xA owners easily convert to an Agilent N6700.
Application Note 2004-08-02 |
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Hybrid32 Migration
This document is provided to help users of HybridPlus Pin Cards more easily incorporate the
Hybrid32 technology into their existing systems.
Application Note 2000-11-01 |
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Improved Fault Coverage in a Combined X-ray and In-Circuit Test Environment
Cutting functional test failures in half and doubling the faults detected at process test! These are some of the case study results observed in combined X-ray and in-circuit test environments.
Application Note 2001-02-27 |
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In-circuit Testing of Low Voltage Devices
Core technical document summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.
Application Note 2005-05-25 |
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In-System Programming on the Agilent 3070
In-System Programmable devices are more widely used on today's boards to provide flexibility to design engineers and to reduce the cost of a product.
Application Note 2001-07-02 |
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Increase Automotive ECU Test Throughput (AN 1505)
Application Note 2004-10-22 |
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Increase DC-input Battery Adapter Test Throughput by Several-fold (AN 1506)
Application Note 2004-10-22 |
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Increasing dc Power Supply Test System Throughput
This Product Note describes some of the ways this new family of electronic loads can be used to achieve maximum throughput for your dc power supply test system.
Application Note 2000-05-01 |
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