製造テスト&自動検査
絞込みのリセット26-50 / 116
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AOI - A Strategy for Closing the Loop
This paper describes a set of defect prevention solutions centered on the availability of high-quality inspection and measurements data from an AOI system and a few carefully engineered software applications
アプリケーション・ノート 2006-04-16 |
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291 KB
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Appliance Testing
In this Application Note following the description of the appliance testing application, measurement and control requirements for characterizing devices are discussed. Then, Agilent VXI-based data acquisition suitable for such an application is listed. Description Household and commercial...
アプリケーション・ノート 1997-11-01 |
PDF
110 KB
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AXI and Lead-Free Process Characterization
How to use Automated X-ray Inspection as a tool to characterize new lead-free soldering processes.
アプリケーション・ノート 2005-06-21 |
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Boundary Scan Ground Bounce Suppression
Boundary-Scan circuitry, while in the process of testing interconnections, can set up and excite current surges on a board. This in turn can cause "ground bounce".
アプリケーション・ノート 1998-04-24 |
PDF
14 KB
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Boundary Scan Helps EMS Companies Cut Test Costs and Increase Revenues
Electronics Manufacturing Services (EMS) providers can utilize boundary-scan to reduce test cost expenses and also generate additional revenue opportunities.
アプリケーション・ノート 2003-03-01 |
PDF
242 KB
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Boundary-Scan Technology, Justification, and Test Implementation for Designers
This paper provides practical insight for designers on the merits, design, and test implementation of Boundary-Scan Technology.
アプリケーション・ノート 1998-05-27 |
PDF
29 KB
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Breakthrough Innovations: Agilent Automated Silicon Nails
Automated Silicon Nails takes the popular IEEE 1149.1 Boundary-Scan standard even further by using Boundary-Scan chains to automatically test non-Boundary-Scan devices.
アプリケーション・ノート 2001-08-15 |
PDF
460 KB
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Canning Process Characterization
Following the description of the canning process application, measurement and control requirements for characterizing the process are discussed, then in this Application Note, Agilent data acquisition equipment suitable for such an application is listed.
Description In the canning industry...
アプリケーション・ノート 1997-11-01 |
PDF
94 KB
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Comparing AOI and AXI
Choosing the right technology requires looking at board mix, capital budget and other business considerations. But most of all, you need to understand the typical characteristics of each technology.
アプリケーション・ノート 2001-07-25 |
PDF
42 KB
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Connecting a UPS to a 3070 Controller
This paper describes how to connect a UPS to the 3070 testhead controller. It uses the Advanced Power Conversion Smart-UPS with PowerChute Plus software.
アプリケーション・ノート 2003-01-07 |
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87 KB
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Considerations for Surface Map Setup
The concept of delta-Zs is perhaps the most difficult thing to understand about the surface map process.
アプリケーション・ノート 2006-08-08 |
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Dealing with Board Thickness Variations
The Agilent 5DX has the capability to be implemented such that it can accommodate thickness variations on a board-by-board basis. NOTE: Content described is in the 5DX Reference Guide but is no longer in Chapter 7 as mentioned herein.
アプリケーション・ノート 2001-05-16 |
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31 KB
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Design Considerations for PC Board Carriers for Use in the Agilent 5DX
There are several reasons why it may be necessary or desirable to use a carrier to transport printed circuit assemblies through the 5DX. This paper discusses these and some considerations for the design of suitable carriers.
アプリケーション・ノート 2005-07-13 |
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918 KB
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Design for Testability - Test for Designability
This paper addresses testability considerations, both physical and logical, and focuses on both the new constraints and the new freedoms of modern manufacturing test in the ever-changing challenge.
アプリケーション・ノート 2003-01-28 |
PDF
852 KB
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Discharge on Unpowered Agilent 3070 Systems
This paper is applicable to both powered and unpowered Agilent 3070 systems, but does not explain how a discharge routine is created on an Unpowered system.
アプリケーション・ノート 2003-06-13 |
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Discreet Analog Device Testing
The Agilent 3070 series has quite a few built in features to make developing board tests easier, while protecting the operator, the board under test, and the 3070 itself from harm.
アプリケーション・ノート 1998-10-29 |
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26 KB
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Effects of Lead Free Solders on Imaging Characteristics of the Agilent 5DX Laminographic X-ray Test
The electronics industry is under pressure to migrate solder processes away from the usage of eutectic tin-lead solder and towards utilization of lead-free compounds.
アプリケーション・ノート 1998-05-01 |
PDF
83 KB
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Electrical In-circuit Test Methods for Limited-access Boards
This paper surveys the various electrical test methods and tools available to address testing boards that lack full electrical access.
アプリケーション・ノート 2001-02-27 |
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47 KB
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Electronic Heater Valves Testing (AN 1270-4)
Production testing of heater/air conditioning system valves is performed on high speed HP automatic test systems with minimum operator interface.
This Application Note describes a typical HP VXI system configuration for testing automotive
heater/air-conditioning system valves.
アプリケーション・ノート 1995-06-01 |
PDF
39 KB
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Essential Testability Guidelines for Current Technology
This paper addresses essential testability considerations, both electrical and mechanical, and focuses on new requirements of current technologies.
アプリケーション・ノート 1993-04-22 |
PDF
55 KB
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Fixture Interface Pin (MINT Pin) Maintenance
Fixture Interface Pins (MINT Pins) used in production testing will eventually get dirty enough to cause contact problems.
アプリケーション・ノート 1998-03-01 |
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20 KB
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Gauge Repeatability on 5DX X-ray System
Summary of 5DX repeatability capability, factors that influence the repeatability capabilities of the 5DX, impacts to gauge repeatability and reproducibility (GR&R) results.
アプリケーション・ノート 2005-03-09 |
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102 KB
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Ground Bounce Basics and Best Practices
This article offers a description of the physical properties that result in ground bounce during board test.
アプリケーション・ノート 2003-01-28 |
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138 KB
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Handling Surface Mapping with Varying Board Construction
This paper describes a method for dealing with lot-to-lot or supplier-to-supplier variations in board construction. Often the variations in board construction result in different color boards which otherwise cause problems with surface mapping.
アプリケーション・ノート 2004-12-02 |
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1.02 MB
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High Node Count Fixturing Solutions for Agilent Short-Wire Test Fixtures
This paper discusses problems encountered in building large, high node count vacuum actuated test fixtures for the Agilent 3070 family of board test systems.
アプリケーション・ノート 2008-04-30 |
PDF
67 KB
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