RF & Microwave Design
Agilent design software provides proven RF and Microwave solutions with very accurate models and powerful simulation technologies ranging from circuit, electromagnetic (EM), and system level designs. With Agilent, you'll be equipped to pinpoint, optimize and deliver - on time.
RF and Microwave Design Challenges
- Ever increasing substrate layer counts, smaller form factors, complex packaging technologies, and closer design proximities continue to make designs ever more challenging
- Seamlessly integrated circuit and EM simulation tools that flow from schematic entry through to production and verification
- Continuous innovation of simulation technology performance to increase accuracy while dramatically reducing simulation speeds
What's New
- ClioSoft Announces the Integration of SOS Design Data Management with Advanced Design System
- Agilent to Demonstrate Latest RF Circuit, System and 3-D EM Design & Simulation Solutions at WAMICON
- Agilent Technologies Simulation Software Selected by Plextek RF Integration
- Designing Multiple-Throw Switches in a MMIC Configuration
- New W2349EP/ET ADS Electro-Thermal Simulator data sheet
Related Links
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- MMIC Design (32)
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- RF System-in-Package & RF Module Design (58)
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By Type of Content
- Seminar Materials (50)
- Training Materials (2)
- Classroom Training (2)
- Tradeshow (4)
- Webcast - recorded (53)
- Webcast (2)
By Product Category
26-50 of 113
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Detailed Presentation on Momentum Advanced Topics - (Part 4 of 5)
This Presentation (Part 4 of 5) focusses on Advanced Model Composer (AMC) including Spiral Inductor Simulations.
Seminar Materials 2003-05-22 |
PDF
8.64 MB
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Detailed Presentation on Momentum Advanced Topics - (Part 5 of 5)
This Presentation (Part 5 of 5) focusses on final wrap up, project files and other resources.
Seminar Materials 2003-05-19 |
PDF
640 KB
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Digitizer Design Fundamentals for Superior Measurements
Original broadcast Mar 21, 2012
Webcast - recorded |
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Discrete Oscillator Design Tools and Techniques
Originally broadcast Sept. 16, 2010
Webcast - recorded |
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EM Insights Series Episode #2: Single and Multiple Band Microstrip Planar Array Antenna
An Agilent Technologies Presentation (EM Insights Series, Episode #2) decribes single (C Band) and multiple band (C and X band) microstrip planar array antenna in detail.
Seminar Materials 2009-03-30 |
PDF
1.06 MB
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EM Insights Series Episode #3: Wireless Network Card Antenna Design
An Agilent Technologies Presentation (EM Insights Series, Episode #3) decribes wireless network card antenna design in detail.
Seminar Materials 2009-03-30 |
PDF
677 KB
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EM Insights Series Episode #5: BGA Package Simulation
An Agilent Technologies Presentation (EM Insights Series, Episode #5) describes BGA package simulation in detail.
Seminar Materials 2009-03-31 |
PDF
620 KB
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EMC 2013 - IEEE International Symposium on Electromagnetic Compatibility
August 5- 9, 2013; Denver, CO
Tradeshow |
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End-to-End Design and Simulation of Handset Modules
What goes into real-life PA design considerations? Dr. Peter Zampardi and Dr. Hongxiao Shao share Skyworks design methodology considering all components necessary for a handset power amplifier (PA) or Front-end Module (FEM) based on III-V HBT and BiFET technologies.
Seminar Materials 2012-02-27 |
PDF
1.02 MB
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Fast Characterization of Power Amplifier Performance with Modulated Signals
Original broadcast Apr 5, 2012
Webcast - recorded |
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Fast Characterization of Power Amplifier Performance with Modulated Signals
Innovations in EDA Webcast Series: Part 3 of the RF Power Amplifier Design Series.
Seminar Materials 2012-04-05 |
PDF
1.79 MB
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Filter Design for LTE
Genesys "How-To-Design" Part 2 of 6
Seminar Materials 2009-11-19 |
PDF
1.85 MB
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GaN on SiC: RFMD High Power Doherty Design, Modeling & Measurement Webcast
Original broadcast March 7, 2013
Webcast - recorded |
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Genesys Concepts
3-day, hands-on course based on Genesys version 2010.05 SP1.
Classroom Training |
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Genesys Webcasts - "How-To-Design" series
Originally broadcast in 2009. Access the 6 WebEX recordings
Webcast - recorded |
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Hands-on Workshop on RF SiP/Module Design
This Presentation serves as a workshop material detailing hand-on experience of ADS design tools, utilities in RF SiP/Module design and covers an overview on Electro-Magnetic Simulation Technologies.
Seminar Materials 2007-11-15 |
PDF
28.88 MB
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High-speed Oscilloscope Probing: Ensuring Maximum Performance and Signal Integrity
Originally broadcast March 10, 2011
Webcast - recorded |
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How To Verify the Data In Your LTE Uplink Signal
Originally broadcast Feb 2, 2011
Webcast - recorded |
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How to Verify Your LTE MAC and RF Interactions
Original broadcast Nov 16, 2011
Webcast - recorded |
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Hybrid-Active Load Pull with PNA-X and Maury Microwave
Original broadcast Jun 12, 2012
Webcast - recorded |
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Impedance Matching Techniques for VLSI Packaging
A detailed Seminar by Brock J. LaMeres, Rajesh Garg, Kanupriya Gulati, Sunil P. Khatri on Impedance matching techniques for VLSI packaging.
Seminar Materials 2006-05-25 |
PDF
1.40 MB
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Improved RF SiP/Module Design Productivity with New ADS 2008
This Presentation brings out details of new features in ADS 2008 that increase the productivity of RF SiP/Module designs.
Seminar Materials 2007-11-15 |
PDF
2.59 MB
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IMS 2011 (IEEE MTT-S) – Connect, Expert to Expert, at Agilent Avenue
2011 show, last June, 2011; Baltimore Convention Center
Tradeshow |
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IMS 2012 (IEEE MTT-S) – Connect, Expert to Expert, at Agilent Avenue
June 17-22, 2012 in Montréal, Canada
Tradeshow |
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IMS 2013 (IEEE MTT-S) – Connect, Expert to Expert, at Agilent Avenue
June 2 - 7, 2013 in Seattle, WA
Tradeshow |
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