RF 與微波
101-125 / 203
|
Innovations in EDA: Freescale’s Power Amplifier Design Methodology Innovations Webcast
Original broadcast January 10, 2013
網路廣播 -- 存檔 |
|
|
Innovations in EDA: High Performance Digital Pre-Distortion (DPD) for Wideband Systems
Original broadcast Sept 1, 2011
網路廣播 -- 存檔 |
|
|
Innovations in EDA: How to Make Your Designs More Robust
Original broadcast July 28, 2011
網路廣播 -- 存檔 |
|
|
Innovations in EDA: IC, Laminate, Package Multi-Technology PA Module Design Methodology
Original broadcast August 2, 2012
網路廣播 -- 存檔 |
|
|
Innovations in EDA: LTE-Advanced: Overcoming Design Challenges for 4G PHY Architectures
Originally broadcast June 2, 2011
網路廣播 -- 存檔 |
|
|
Innovations in EDA: Memory Effects in RF Circuits: Manifestations and Simulation
Originally broadcast Feb 3, 2011
網路廣播 -- 存檔 |
|
|
Innovations in EDA: Multi-Technology RF Design Using the New Advances in ADS 2011
Originally broadcast March 1, 2011
網路廣播 -- 存檔 |
|
|
Innovations in EDA: Opto-Electronic Signal Integrity on Optical Fiber Chip-to-Chip Link
Originally broadcast April 7, 2011
網路廣播 -- 存檔 |
|
|
Innovations in EDA: System-Level Design & Verification for Advanced Satellite Comms
Original broadcast Jun 7, 2012
網路廣播 -- 存檔 |
|
|
Integrated CMOS Power Amplifier for GSM/GPRS Mobile Handsets - AXIOM Presentation
A Presentation by Rahul Magoon (AXIOM Microdevices) presents the Industry’s first fully Integrated CMOS Power Amplifier for GSM/GPRS Mobile Handsets.
研討會講義 2007-07-24 |
PDF
958 KB
|
|
Integrated Electro-Thermal Solution Delivers Thermally Aware Circuit Simulation
Original broadcast October 4, 2012
網路廣播 -- 存檔 |
|
|
Integrated RF Design Flow Part 1 - New Budget Analysis
This part (1 of 5) of the Presentation on Integrated RF Design Flow (Concept to Fabrication) focuses on top level system design using ADS New Budget analysis.
研討會講義 2005-02-24 |
PDF
2.47 MB
|
|
Integrated RF Design Flow Part 2 - Modeling of Off the Shelf Components
This part (2 of 5) of the Presentation on Integrated RF Design Flow (Concept to Fabrication) focuses on modeling of off the shelf components in terms of data based models or parametric models.
研討會講義 2005-02-24 |
PDF
875 KB
|
|
Integrated RF Design Flow Part 3 - Layout Libraries
This part (3 of 5) of the Presentation on Integrated RF Design Flow (Concept to Fabrication) focuses on creating Layout libraries for off the shelf components.
研討會講義 2005-02-14 |
PDF
275 KB
|
|
Integrated RF Design Flow Part 5 - Release for Manufacturing
This part (5 of 5) of the Presentation on Integrated RF Design Flow (Concept to Fabrication) focuses on ADS graphics export options, Gerber artwork export, and IFF export options.
研討會講義 2005-02-14 |
PDF
270 KB
|
|
Interference Analysis Using Handheld Spectrum Analyzers Webcast
Original broadcast Sept 21, 2011
網路廣播 |
|
|
Is Simulation a Requirement for Memory Designs Webcast
Live broadcast February 20, 2013; 10am Pacific / 1pm Eastern
網路廣播 |
|
|
LTE Throughput Test Using SystemVue
SystemVue integrated solutions and receiver throughput test solutions for LTE FDD, LTE TDD and WiMAX.
研討會講義 2010-10-19 |
PDF
714 KB
|
|
Making 900 MHz Wideband Measurements Using PXA SA and VSA Software
Original broadcast October 19, 2011
網路廣播 -- 存檔 |
|
|
Making Early Design Tradeoffs using Advanced Measurement Based Behavioral Models
This Presentation (Connecting Design and Test Seminar, paper #2) decribes early design tradeoffs using advanced measurement based behavioral models in detail.
研討會講義 2003-05-29 |
PDF
2.22 MB
|
|
Making Your Most Accurate DDR4 Compliance Measurements Webcast
Originally broadcast January 23, 2013
網路廣播 -- 存檔 |
|
|
Millimeter Signal Measurements: Best Practices, Solutions, and Accuracy Webcast
Original broadcast Jan 26, 2012
網路廣播 -- 存檔 |
|
|
MMIC - Design of Experiments (DOE) Tutorial
A practical example that walks you through the basic ideas behind DOE.
訓練教材 2009-01-13 |
PDF
325 KB
|
|
MMIC Design Seminar Materials
Agilent EEsof EDA collection of MMIC Design Seminar Materials.
研討會講義 2010-03-11 |
|
|
MMIC/RFIC Packaging Challenges Slides
These slides cover several applications including the Agilent custom TOPS package, Agilent QFN package, solder bumps for FC package, Balun & mixer IC module, and RFIC PA co-design.
研討會講義 2009-08-26 |
PDF
3.79 MB
|
註冊myAgilent
註冊您的產品
為何選擇向安捷倫採購