RF & Microwave Design
Agilent design software provides proven RF and Microwave solutions with very accurate models and powerful simulation technologies ranging from circuit, electromagnetic (EM), and system level designs. With Agilent, you'll be equipped to pinpoint, optimize and deliver - on time.
RF and Microwave Design Challenges
- Ever increasing substrate layer counts, smaller form factors, complex packaging technologies, and closer design proximities continue to make designs ever more challenging
- Seamlessly integrated circuit and EM simulation tools that flow from schematic entry through to production and verification
- Continuous innovation of simulation technology performance to increase accuracy while dramatically reducing simulation speeds
What's New
- ClioSoft Announces the Integration of SOS Design Data Management with Advanced Design System
- Agilent to Demonstrate Latest RF Circuit, System and 3-D EM Design & Simulation Solutions at WAMICON
- Agilent Technologies Simulation Software Selected by Plextek RF Integration
- Designing Multiple-Throw Switches in a MMIC Configuration
- New W2349EP/ET ADS Electro-Thermal Simulator data sheet
Related Links
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- Seminar Materials (50)
- Training Materials (2)
- Classroom Training (2)
- Tradeshow (4)
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- Webcast - recorded (53)
- Webcast (2)
Par catégorie de produit
26-50 of 115
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Integrated CMOS Power Amplifier for GSM/GPRS Mobile Handsets - AXIOM Presentation
A Presentation by Rahul Magoon (AXIOM Microdevices) presents the Industry’s first fully Integrated CMOS Power Amplifier for GSM/GPRS Mobile Handsets.
Seminar Materials 2007-07-24 |
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958 KB
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Presentation on Yield Analysis of a Full Transceiver
The presentation examines the practical verification and design for the yield analysis of a full transceiver.
Seminar Materials 2007-07-01 |
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2.11 MB
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Noise in Mixers, Oscillators, Samplers & Logic - Intro to Cyclostationary Noise
A detailed Presentation on Cyclostationary Noise presented by Ken Kundert at CICC 2000; covers Noise in Mixers, Oscillators, Samplers and Logic in detail.
Seminar Materials 2007-07-01 |
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1.02 MB
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Presentation on Cross Modulation in a Full Duplex Transceiver
A detailed Presentation on Cross Modulation in a Full Duplex Transceiver presented by Jack Roan, a Senior Applications Engineer (July 2007) detailing its causes, effects and simulation requirements.
Seminar Materials 2007-07-01 |
PDF
421 KB
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De-embedding Techniques in Advanced Design System
A detailed Seminar on De-embedding technique used in Advanced Design System. This presentation covers the need of de-embedding, S-Parameters, TRL design, 2-Port and 4-Port de-embedding.
Seminar Materials 2006-06-01 |
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2.95 MB
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Impedance Matching Techniques for VLSI Packaging
A detailed Seminar by Brock J. LaMeres, Rajesh Garg, Kanupriya Gulati, Sunil P. Khatri on Impedance matching techniques for VLSI packaging.
Seminar Materials 2006-05-25 |
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1.40 MB
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Presentation on Agilent Technologies ADS/Genesys
This Presentation presents the features of ADS and Genesys highlighting integration of ADS with Genesys and vice versa.
Seminar Materials 2006-03-01 |
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2.65 MB
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Integrated RF Design Flow Part 2 - Modeling of Off the Shelf Components
This part (2 of 5) of the Presentation on Integrated RF Design Flow (Concept to Fabrication) focuses on modeling of off the shelf components in terms of data based models or parametric models.
Seminar Materials 2005-02-24 |
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875 KB
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Integrated RF Design Flow Part 1 - New Budget Analysis
This part (1 of 5) of the Presentation on Integrated RF Design Flow (Concept to Fabrication) focuses on top level system design using ADS New Budget analysis.
Seminar Materials 2005-02-24 |
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2.47 MB
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Integrated RF Design Flow Part 5 - Release for Manufacturing
This part (5 of 5) of the Presentation on Integrated RF Design Flow (Concept to Fabrication) focuses on ADS graphics export options, Gerber artwork export, and IFF export options.
Seminar Materials 2005-02-14 |
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270 KB
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Integrated RF Design Flow Part 3 - Layout Libraries
This part (3 of 5) of the Presentation on Integrated RF Design Flow (Concept to Fabrication) focuses on creating Layout libraries for off the shelf components.
Seminar Materials 2005-02-14 |
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275 KB
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Presentation on Power Amplifier Design using ADS
This Presentation presented by Wilfredo Rivas-Torres (Agilent Technologies) explains the need of a Power Amplifier and PA design requirements using ADS in detail.
Seminar Materials 2004-10-12 |
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2.27 MB
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RF System-in-Package Design: A Dupont Presentation
This Presentation by Glenn Oliver (DuPont Technologies) was presented during Agilent EEsof Seminar, April 2004 focusing on LTCC in RF System-in-Package 3D design flow and 943 green tape design kit.
Seminar Materials 2004-04-01 |
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18.16 MB
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Presentation: System-Level Design and Verification using ADS Behavioral Modeling
This Presentation presents a complete end-to-end system Verification flow reducing integration risks from design to the end products.
Seminar Materials 2004-04-01 |
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1.33 MB
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Presentation on RF System-in-Package Design in ADS
This Presentation by HeeSoo LEE (Agilent EEsof) presents an overview of RF System-in-Package (SiP) technology and also demonstrates ADS simulation capabilities for RF module applications.
Seminar Materials 2004-03-12 |
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5.65 MB
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Detailed Presentation on Momentum Advanced Topics - (Part 4 of 5)
This Presentation (Part 4 of 5) focusses on Advanced Model Composer (AMC) including Spiral Inductor Simulations.
Seminar Materials 2003-05-22 |
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8.64 MB
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Detailed Presentation on Momentum Advanced Topics - (Part 5 of 5)
This Presentation (Part 5 of 5) focusses on final wrap up, project files and other resources.
Seminar Materials 2003-05-19 |
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640 KB
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Detailed Presentation on Momentum Advanced Topics - (Part 1 of 5)
This Presentation (Part 1 of 5) focusses on Momentum Co-Simulation and Momentum Co-Optimization using Layout Components.
Seminar Materials 2003-05-19 |
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7.96 MB
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Presentation on ADS Momentum
A brief Presentation on ADS Momentum presented by Keefe Bohannan (Agilent EEsof Applications Engineer) covers an overview on Momentum, creating/importing Artwork in ADS layout.
Seminar Materials 2003-05-19 |
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2.87 MB
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Detailed Presentation on Momentum - Part 2 of 3
This Presentation (Part 2 of 3) focuses on Defining mesh parameters, Low-frequency breakdown problem and Momentum accuracy.
Seminar Materials 2003-05-19 |
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1.01 MB
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Detailed Presentation on Momentum Advanced Topics - (Part 3 of 5)
This Presentation (Part 3 of 5) focusses on Thick Conductor Simulations Coupled Lines examples and Spiral Inductor simulations.
Seminar Materials 2003-05-19 |
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6.18 MB
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Detailed Presentation on Momentum - Part 1 of 3
This Presentation (Part 1 of 3) focuses on Momentum versus Momentum RF, Creating substrate stack-ups and mapping layout layers as metallization layers, Placing and defining ports.
Seminar Materials 2003-05-19 |
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1.80 MB
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Detailed Presentation on Momentum - Part 3 of 3
This Presentation (Part 3 of 3) focuses on Viewing and Using Momentum Results, Momentum Datasets, Momentum Visualization and ADS Data Display.
Seminar Materials 2003-05-19 |
PDF
790 KB
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Detailed Presentation on Momentum Advanced Topics - (Part 2 of 5)
This Presentation (Part 2 of 5) focusses on Thick Conductor Simulation.
Seminar Materials 2003-05-19 |
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3.67 MB
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Presentation on Accurate Design of Low-Noise High-Frequency SAW Oscillators
This Presentation presents design steps which include the necessary measurements and modeling methods and the used simulation technologies in the Advanced Design System (ADS) to achieve the goal.
Seminar Materials 2001-09-01 |
PDF
2.71 MB
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