射频与微波设计
安捷伦设计软件提供业经验证的射频和微波解决方案,这些解决方案具有极其精确的模型和功能强大的仿真技术,覆盖了电路、电磁场(EM)和系统级设计等方面。使用安捷伦产品,您将可以精确查明问题所在,优化设计并按时交付。
射频和微波设计挑战
- 不断增加的基片层数目、更小巧的外形、复杂的封装技术以及更好的设计接近性,这些因素使得设计更具挑战性。
- 无缝集成电路和电磁场仿真工具能够覆盖从原理图输入到生产、验证的整个过程。
- 仿真技术性能的不断创新在提高精度的同时,也会大幅降低仿真速度
新增内容
- Agilent Technologies to Demonstrate Leading-Edge RF/MW Design and Test Solutions at IMS
- ClioSoft Announces the Integration of SOS Design Data Management with Advanced Design System
- Agilent to Demonstrate Latest RF Circuit, System and 3-D EM Design & Simulation Solutions at WAMICON
- Agilent Technologies Simulation Software Selected by Plextek RF Integration
- Designing Multiple-Throw Switches in a MMIC Configuration
相关链接
缩小范围
按应用
- MMIC 设计 (49)
- RF & Microwave Board Design (100)
- 射频封装系统和射频模块设计 (86)
- RFIC Design (48)
按内容类型
- 研讨会演示 (59)
- 培训资料 (3)
- 课堂培训 (2)
- 研讨会资料 -- 已存档的 (1)
- 展览会 (6)
- 研讨会 (1)
- 网上直播 -- 已存档的 (80)
- 网上直播 (8)
按产品类别
1-25 / 160
|
Comprehensive mm-Wave Design Solutions for TSMC's 60-GHz CMOS RDK
An introduction to the 60 GHz reference design kit (RDK) and complete RFIC design solutions with dedicated mm-Wave support.
研讨会演示 2012-05-03 |
|
|
Fast Characterization of Power Amplifier Performance with Modulated Signals
Innovations in EDA Webcast Series: Part 3 of the RF Power Amplifier Design Series.
研讨会演示 2012-04-05 |
|
|
End-to-End Design and Simulation of Handset Modules
What goes into real-life PA design considerations? Dr. Peter Zampardi and Dr. Hongxiao Shao share Skyworks design methodology considering all components necessary for a handset power amplifier (PA) or Front-end Module (FEM) based on III-V HBT and BiFET technologies.
研讨会演示 2012-02-27 |
|
|
Agilent EEsof EDA 客户教育与服务
Brief overview of Agilent EEsof EDA Customer Education and Services.
培训资料 2012-02-02 |
|
|
RF System Architecture: Techniques for Optimal Design
Innovations in EDA Webcast presentation on RF System Architecture.
研讨会演示 2012-01-12 |
|
|
Agilent EEsof EDA 在欧洲微波周上展示
Europe's Premier Microwave, RF, Wireless and Radar Event. The week provides an opportunity for both academia and industry to consider the latest trends and developments that are widening the field of application of microwaves.
研讨会演示 2011-10-28 |
|
|
A Model-Based Approach for System-Level RFIC Verification
A new approach for verifying system-level behavior of a modern RFIC.
研讨会演示 2011-07-07 |
|
|
Agilent IMS 2011 微波应用文章
Microwave Applications Seminars (MicroApps) papers presented by Agilent Technologies and partners at the International Microwave Symposium (IMS) 2011.
研讨会演示 2011-06-10 |
|
|
Innovations in EDA: Applying the Latest Technologies to MMIC Design
This recorded Webcast uses an LTE RF power amplifier application to present the latest developments in design and simulation technologies.
研讨会演示 2010-11-15 |
|
|
Innovations in EDA: A Practical Approach to Verifying RFICs with Fast Mismatch Analysis
A new fast mismatch analysis that delivers the same level of accuracy with the benefit of significantly reducing overall cost, verification time and increased computed resource availability.
研讨会演示 2010-10-29 |
|
|
Agilent EEsof EDA Customer Education and Services
Brief overview of Agilent EEsof EDA Customer Education and Services.
培训资料 2010-08-11 |
|
|
MMIC Design Seminar Materials
Agilent EEsof EDA collection of MMIC Design Seminar Materials.
研讨会演示 2010-03-11 |
|
|
Filter Design for LTE
Genesys "How-To-Design" Part 2 of 6
研讨会演示 2009-11-19 |
|
|
Receiver Design for LTE
Genesys "How-To-Design" Part 1of 6
研讨会演示 2009-09-17 |
|
|
MMIC/RFIC Packaging Challenges Slides
These slides cover several applications including the Agilent custom TOPS package, Agilent QFN package, solder bumps for FC package, Balun & mixer IC module, and RFIC PA co-design.
研讨会演示 2009-08-26 |
|
|
EM Insights Series Episode #5: BGA Package Simulation
An Agilent Technologies Presentation (EM Insights Series, Episode #5) describes BGA package simulation in detail.
研讨会演示 2009-03-31 |
|
|
EM Insights Series Episode #2: Single and Multiple Band Microstrip Planar Array Antenna
An Agilent Technologies Presentation (EM Insights Series, Episode #2) decribes single (C Band) and multiple band (C and X band) microstrip planar array antenna in detail.
研讨会演示 2009-03-30 |
|
|
EM Insights Series Episode #3: Wireless Network Card Antenna Design
An Agilent Technologies Presentation (EM Insights Series, Episode #3) decribes wireless network card antenna design in detail.
研讨会演示 2009-03-30 |
|
|
MMIC - Design of Experiments (DOE) Tutorial
A practical example that walks you through the basic ideas behind DOE.
培训资料 2009-01-13 |
|
|
A New Circuit Design Methodology for CMOS Transceiver LSI Designs, using Agilent GoldenGate
A Toshiba Case Study from the Agilent EDA Forum 2008.
研讨会演示 2008-12-18 |
|
|
Presentation on High Yield MMIC Front-To-Back Design with ADS 2008
This Presentation by J Sifri discusses how to take advantage of the latest productivity enhancements in ADS 2008 to implement a robust methodology for high yield MMIC designs.
研讨会演示 2008-02-19 |
|
|
Presentation on Design Techniques for First Pass RF Board Design
This Presentation highlights simulation methods using Agilent Genesys and Momentum GX, Key design choices and techniques for implementation and design examples (amplifiers, and antennas).
研讨会演示 2008-01-10 |
|
|
Hands-on Workshop on RF SiP/Module Design
This Presentation serves as a workshop material detailing hand-on experience of ADS design tools, utilities in RF SiP/Module design and covers an overview on Electro-Magnetic Simulation Technologies.
研讨会演示 2007-11-15 |
|
|
Improved RF SiP/Module Design Productivity with New ADS 2008
This Presentation brings out details of new features in ADS 2008 that increase the productivity of RF SiP/Module designs.
研讨会演示 2007-11-15 |
|
|
A Faster and Effective RF Module/LTCC Design Flow with AMC
This Presentation details why Electro-Magnetic (EM) Simulation for RF Module/LTCC is required and usage of Advanced Model Composer (AMC) for faster and effective RF Module/LTCC Design Flow.
研讨会演示 2007-11-15 |
|
