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Introduction to EMI/EMC Challenges and Their Solution 
Agilent EEsof EDA presentation on how to, "Overcome High Speed Digital Design Challenges".

研讨会演示 2012-02-16

PDF PDF 3.46 MB
观看网络研讨会录像--为下一代 HDMI 标准做好准备 
为下一代 HDMI 标准做好准备

培训资料 2012-02-12

 
Overcome PI Challenges on Perforated Power/Groung Planes 
This presentation explains a different approach that's applicable to PI analysis on cost reduced consumer boards whose power/ground planes are perforated with signal traces.

研讨会演示 2012-01-19

PDF PDF 2.30 MB
Overcome Signal Integrity Challenges in the multigigabit(s) Era 
When digital signals reach gigabit/s speeds, the unpredictable becomes the norm. The process of getting your project back on track starts with the best tools for the job.

研讨会演示 2011-12-15

PDF PDF 781 KB
Design and Test Challenges in Next Generation High-Speed Serial Standards 
Attend this FREE education workshop at DesignCon 2012, brought to you by Agilent Technologies, Official Host Sponsor of the conference.

培训资料 2011-11-29

 
View the recorded webcast - How to handle USB 3.0 physical layer test requirements 
How to handle USB 3.0 physical layer test requirements.

培训资料 2011-11-08

 
View the recorded webcast - Be ready for the next generation HDMI standard 
Be ready for the next generation HDMI standard

培训资料 2011-11-08

 
Overcoming Return-Path-Discontinuity in DDR3 and GDDR5 Memory-Controller Packages 
A day in the life of a Memory Architect.

研讨会演示 2011-10-24

PDF PDF 1.86 MB
Successful High Speed Digital Design with ADS, EMPro, and SystemVue 
The materials in this self-guided workshop will show you the latest high speed digital capabilites in ADS 2011.

研讨会演示 2011-09-29

 
Signal Integrity Design Using Channel Simulation and EM Co-design 
The materials in this self-guided workshop will show you the “what if” design space exploration workflow that our new statistical eye diagram channel simulator enables

研讨会演示 2010-04-21

 
USB 3.0 Superspeed PHY Testing Challenges: Verify your 5Gbps design to the specification 

培训资料 2009-04-15

 
Tips to Debugging DDR 1, 2 and 3 Physical and Protocol Layer Issues webcast 

培训资料 2009-01-06

 
ADMF: Facing the challenges of Super speed USB 3.0 Product Development  
Agilent Digital Measurement Forum (ADMF): Facing the challenges of Super speed USB Product Development

研讨会演示 2008-11-12

PDF PDF 1.78 MB
Hacking the Backplane:Complete Differential Channel Characterization & Analysis from 4-port Meas. 

研讨会演示 2008-11-09

 
How to Solve DDR Signal Integrity Validation Challenges 
How to Solve DDR Signal Integrity Validation Challenges

培训资料 2008-02-13

 
Why Do Measurement-based Channel Modeling? 
Adobe .pdf of the paper presented at the High-Speed Digital Seminar, Ensuring MultiGigabit Design Success

研讨会演示 2008-01-20

PDF PDF 3.62 MB
Minimizing Crosstalk in Hi-Speed Interconnects using Measurement-based Modeling 
This Presentation presented by Mike Resso (Agilent Technologies) focuses on minimizing crosstalk in high speed interconnects using measurement-based modeling.

研讨会演示 2006-09-01

PDF PDF 1.50 MB
Jitter Measurements for High-Speed Digital 
Jitter Measurements for High-Speed Digital Transmission

研讨会演示 2006-06-14

PDF PDF 44 KB
Testing Receiver Jitter Tolerance eSeminar FAQs 
Testing Receiver Jitter Tolerance eSeminar FAQs

研讨会演示 2006-06-14

PDF PDF 50 KB
Solving Real World Jitter Problems for High-Speed Communications eSeminar FAQs 
FAQs from the eSeminar

研讨会演示 2006-05-11

PDF PDF 53 KB
Characterization and Modeling of a High Speed Backplane Differential Channels eSeminar FAQs 
FAQs from the eSeminar

研讨会演示 2006-05-11

PDF PDF 80 KB
Jitter Analysis: What Works, What Doesn't & Why eSeminar FAQs 
FAQs from the eSeminar

研讨会演示 2006-05-11

PDF PDF 63 KB
Jitter in Digital Circuits eSeminar FAQs 
FAQs from the eSeminar

研讨会演示 2006-05-11

PDF PDF 34 KB
Analyzing Digital Jitter and its Component eSeminar FAQs 
FAQs from the eSeminar

研讨会演示 2006-05-11

PDF PDF 35 KB
Jitter Measurements with a High-Speed Scope eSeminar FAQs 
FAQs from the eSeminar

研讨会演示 2006-05-11

PDF PDF 117 KB

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