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RF & Microwave Design
Agilent design software provides proven RF and Microwave solutions with very accurate models and powerful simulation technologies ranging from circuit, electromagnetic (EM), and system level designs. With Agilent, you'll be equipped to pinpoint, optimize and deliver - on time.
RF and Microwave Design Challenges
- Ever increasing substrate layer counts, smaller form factors, complex packaging technologies, and closer design proximities continue to make designs ever more challenging
- Seamlessly integrated circuit and EM simulation tools that flow from schematic entry through to production and verification
- Continuous innovation of simulation technology performance to increase accuracy while dramatically reducing simulation speeds
What's New
- Agilent Technologies to Demonstrate Leading-Edge RF/MW Design and Test Solutions at IMS
- ClioSoft Announces the Integration of SOS Design Data Management with Advanced Design System
- Agilent to Demonstrate Latest RF Circuit, System and 3-D EM Design & Simulation Solutions at WAMICON
- Agilent Technologies Simulation Software Selected by Plextek RF Integration
- Designing Multiple-Throw Switches in a MMIC Configuration
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- MMIC Design (34)
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- RFIC Design (32)
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- Seminar Materials (50)
- Training Materials (2)
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- Tradeshow (4)
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76-100 of 115
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Integrated RF Design Flow Part 5 - Release for Manufacturing
This part (5 of 5) of the Presentation on Integrated RF Design Flow (Concept to Fabrication) focuses on ADS graphics export options, Gerber artwork export, and IFF export options.
Seminar Materials 2005-02-14 |
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Making Your Most Accurate DDR4 Compliance Measurements Webcast
Originally broadcast January 23, 2013
Webcast - recorded |
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Millimeter Signal Measurements: Best Practices, Solutions, and Accuracy Webcast
Original broadcast Jan 26, 2012
Webcast - recorded |
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MMIC - Design of Experiments (DOE) Tutorial
A practical example that walks you through the basic ideas behind DOE.
Training Materials 2009-01-13 |
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MMIC Design Seminar Materials
Agilent EEsof EDA collection of MMIC Design Seminar Materials.
Seminar Materials 2010-03-11 |
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MMIC/RFIC Packaging Challenges Slides
These slides cover several applications including the Agilent custom TOPS package, Agilent QFN package, solder bumps for FC package, Balun & mixer IC module, and RFIC PA co-design.
Seminar Materials 2009-08-26 |
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New impedance measurement solutions & apps using 5 Hz to 3 GHz VNA
Originally broadcast April 19, 2011
Webcast - recorded |
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Noise in Mixers, Oscillators, Samplers & Logic - Intro to Cyclostationary Noise
A detailed Presentation on Cyclostationary Noise presented by Ken Kundert at CICC 2000; covers Noise in Mixers, Oscillators, Samplers and Logic in detail.
Seminar Materials 2007-07-01 |
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Nonlinear Characterization and Modeling Through Pulsed IV/S-Parameters
Original broadcast Mar 27, 2012
Webcast - recorded |
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Optimizing PXI Modular Functional Test System Throughput Webcast
Originally broadcast April 27, 2011
Webcast - recorded |
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Overcome High Speed Digital Design Challenges Webcast Series
Series of live and on-demand webcasts
Webcast - recorded |
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Physical Layer Test Challenges and Solutions for MIPI Interfaces Webcast
Original broadcast January 30, 2013
Webcast - recorded |
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Power Amplifier Design with X-Parameter* Power Transistor Models
Original broadcast September 6, 2012
Webcast - recorded |
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Presentation on Accurate Design of Low-Noise High-Frequency SAW Oscillators
This Presentation presents design steps which include the necessary measurements and modeling methods and the used simulation technologies in the Advanced Design System (ADS) to achieve the goal.
Seminar Materials 2001-09-01 |
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Presentation on ADS Momentum
A brief Presentation on ADS Momentum presented by Keefe Bohannan (Agilent EEsof Applications Engineer) covers an overview on Momentum, creating/importing Artwork in ADS layout.
Seminar Materials 2003-05-19 |
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Presentation on Agilent Technologies ADS/Genesys
This Presentation presents the features of ADS and Genesys highlighting integration of ADS with Genesys and vice versa.
Seminar Materials 2006-03-01 |
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Presentation on Characterization of a WLAN Transceiver
A detailed Presentation on increased insight with increased characterization of a WLAN transceiver presented by Andy Howard (Agilent Technologies) .
Seminar Materials 2007-07-24 |
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Presentation on Cross Modulation in a Full Duplex Transceiver
A detailed Presentation on Cross Modulation in a Full Duplex Transceiver presented by Jack Roan, a Senior Applications Engineer (July 2007) detailing its causes, effects and simulation requirements.
Seminar Materials 2007-07-01 |
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Presentation on Cross Modulation in CDMA Mobile Phone Transceivers
This Presentation by Rishi Mohindra (Adaptive RF, Inc) analyzes a CDMA mobile phone's transmitter induced Cross Modulation of a strong received single tone jammer.
Seminar Materials 2001-04-17 |
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Presentation on Design Techniques for First Pass RF Board Design
This Presentation highlights simulation methods using Agilent Genesys and Momentum GX, Key design choices and techniques for implementation and design examples (amplifiers, and antennas).
Seminar Materials 2008-01-10 |
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Presentation on High Yield MMIC Front-To-Back Design with ADS 2008
This Presentation by J Sifri discusses how to take advantage of the latest productivity enhancements in ADS 2008 to implement a robust methodology for high yield MMIC designs.
Seminar Materials 2008-02-19 |
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Presentation on Improved MMIC Design productivity with New ADS 2008
A Technical Presentation on new features supported by ADS 2008 for MMIC designers by J Sifri (Agilent Technologies).
Seminar Materials 2007-10-01 |
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Presentation on Momentum Optimization
This Presentation illustrates the use of momentum and momentum optimization as part of design flow to design a 3.2 GHz radial stub filter.
Seminar Materials 2000-11-01 |
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Presentation on Power Amplifier Design using ADS
This Presentation presented by Wilfredo Rivas-Torres (Agilent Technologies) explains the need of a Power Amplifier and PA design requirements using ADS in detail.
Seminar Materials 2004-10-12 |
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Presentation on RF System-in-Package Design in ADS
This Presentation by HeeSoo LEE (Agilent EEsof) presents an overview of RF System-in-Package (SiP) technology and also demonstrates ADS simulation capabilities for RF module applications.
Seminar Materials 2004-03-12 |
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