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Foundry Partners - Taiwan Semiconductor Manufacturing Company (TSMC)

Taiwan Semiconductor Manufacturing CompanyTSMC is the world's largest dedicated semiconductor foundry. As the founder and leader of this industry, TSMC has built its reputation on offering advanced wafer production processes and unparalleled manufacturing efficiency. The company's manufacturing capacity exceeds 7 million 8-inch equivalent wafers in 2006, while its revenues represent some 50% of the dedicated foundry segment in the semiconductor industry

TSMC operates two advanced 300-mm wafer fabs, four 8-inch wafer fabs, and one 6-inch wafer fab. Fab operations are centralized in Taiwan. TSMC fabs are also located in Camas, Washington, Singapore, and Shanghai, China.

TSMC provides fabrication processes that include CMOS logic, mixed-mode/RF, volatile and non-volatile memory, BiCMOS, high-voltage and CMOS image sensor. It has the largest portfolio of process-proven libraries, IP, design tools, and reference flows and is a trusted partner for silicon manufacturing to both the smallest fabless start-up ventures and multi-national, multi-product companies.

Full front-to-back ADS PDK for TSMC’s dedicated “Integrated Passive Device” (IPD) process.

The ADS PDK with Schematic, Layout, Substrate Definition file and DRC support for TSMC IPD 0.18nm Process covers the following components: RF MIM Capacitors, Baseband MIM capacitors and RF Inductors as schematic and layout components.

Full TSMC process name: TSMC 0.18 UM PASSIVE DEVICE 0P3M USG Cu+Al Process

There is a broad range of ADS front-end PDKs for TSMC. Please see the full support matrix below:

Technology Node ADS 2009 PDK ADS 2011 PDK TSMC Doc No. Spice Model Card Version
cmos 028 nm No TSMC_N28nm_v1.01 T-N28-CR-SP-004, v03_2 crn28hpl_1d8_v0d3_2.scs & res_metal.scs
cmos 040 nm TSMC_CM040_v1.0 TSMC_CM040_v1.0 T-N40-CM-SP-001 (v1.3) crn40lp_2d5_v1d3.scs
cmos 045 nm TSMC_CM045_v1.0 on demand T-N45-CM-SP-003 crn45lp_2d5_v1d0.scs, toplevel.scs
cmos 055 nm TSMC_CRN55LP_2V5_v2.0 TSMC_CRN55LP_2V5_v2.0 T-N55-CM-SP-009, V1.0 crn55lp_2d5_v1d0.scs
cmos 065 nm

TSMC_CM065_2V5_v3.1

TSMC_CM065_3V3_v2.4

TSMC_CM065_2V5_v3.1

on demand

T-N65-CM-SP-007(V 1.5) crn65lp_v1d5.scs

T-N65-CM-SP-012(V 1.4) crn65lp_3d3_v1d4.scs

crn65lp_v1d5.scs

crn65lp_3d3_v1d4.scs

cmos 065 nm G TSMC_CRN65GP_v3 TSMC_CRN65GP_v3 T-N65-CM-SP-018 crn65gplus_2d5_lk_v1d1.scs
cmos 090 nm

tsmc_cm090rf_3v3_v2.6

tsmc_cm090rf_2v5_v3.0

on demand

tsmc_cm090rf_2v5_v3.0

T-N90-CM-SP-005 v1.2

T-N90-CM-SP-004, V1.2

crn90lp_3d3_lk_v1d2.scs

crn90lp_2d5_lk_v1d2.scs

cmos090 nm G TSMC_CRN90G_3V3_v1.1 TSMC_CRN90G_3V3_v1.1 T-N90-CM-SP-016, V1.1 CRN90G_3d3_lk_v1d1.scs, mosCAPrf_ahdl.va , mosCap_ahdl.va
cmos 130 nm

013CMOSFSG_2V5_ver1.1

TSMC_CM013RF_2V5_v1.41

tsmc_cm013rf_3V3_v1.2

tsmc_cm013rf_v2.13

TSMC_CM013RF_2V5_v1.41

on demand

Yes

on demand

tsmc_cm013rf_v2.13

TSMC_CM013RF_2V5_v2.0

T013CMSP005_2_1

T-013-MM-SP-001

T-013-CM-SP-006

T-013-CM-SP-002

T-013-MM-SP-001

cm013g_fsg.scs, ResModel.scs

cr013g_2d5_v1d4.scs, ResModel.scs

cm013g_fsg.scs, ResModel.scs

rf013_v1d3.scs,ResModel.scs

cr013g_2d5_v1d4.scs, ResModel.scs

cmos 180 nm

018CMOS_ver9.0

018SGBICMOS_ver0.1

018CMOS_ver9.0

on demand

T-018-MM-SP-001, V1.5

T-018-BM-SP-001 v 0.1

rf018.scs

sige018_v0d1.net

sige 180 nm

tsmc_sige018_v3.0

tsmc_sige018_v3.0

T-018-BM-SP-001 v1.8 sige018_v1d8.scs

The kits work seamlessly with ADS 2011, ADS 2009 Update 1 and prior ADS releases.

How to gain access to these ADS PDKs?

The PDKs can be downloaded from the restricted download area of the Agilent Knowledge Center. Please contact your Agilent EEsof contact person that he can grant you access. The PDKs do not include the corresponding “Spice Model Card”, for which you must contact your TSMC contact with the “Spice Model Card Version” stated in the table above.
In addition to the ADS PDK support, TSMC also supports GoldenGate and Momentum for a broad range of their Cadence® Virtuoso® PDKs.

Press Releases

Momentum Modules support matrix:

Process Name Technology Node Doc. No. Metal Options
TSMC 28nm CLN28HPL T-N28-CL-BL-010, v1.0
T-N28-CR-BL-005, v1.0
T-N28-CR-BL-038, v1.0
T-N28-CR-BL-007, v1.0
T-N28-CR-BL-088, v1.0

1P6M (4X1Z0U)
1P7M (4X1Z1U)
1P7M (5X1Z_AlRDL)
1P7M (5X1Z_UT-AlRDL)
1P9M (4X2Y2R)

TSMC 28nm CLN28HPM T-N28-CL-BL-102, v1.0
T-N28-CL-BL-094, v1.0
T-N28-CL-BL-091, v1.0
T-N28-CL-BL-069, v1.0
T-N28-CL-BL-046, v1.0
T-N28-CL-BL-061, v1.0
T-N28-CL-BL-098, v1.0
T-N28-CL-BL-105, v1.0
T-N28-CL-BL-096, v1.0
T-N28-CL-BL-089, v1.0
T-N28-CL-BL-090, v1.0
T-N28-CL-BL-092, v1.0
T-N28-CL-BL-066, v1.0
T-N28-CL-BL-085, v1.0
T-N28-CL-BL-071, v1.0

1P7M (4X1Y1Z_UT-AlRDL)
1P7M (5X1R_AlRDL)
1P7M (5X1R_UT-AlRDL)
1P7M (5X1Z_AlRDL)
1P8M (4X2Y1Z_AlRDL)
1P8M (5X2Z_AlRDL)
1P8M (5X2Z_UT-AlRDL)
1P8M (6X1R_AlRDL)
1P8M (6X1R_UT-AlRDL)
1P9M (4X2Y2R_AlRDL)
1P9M (4X2Y2R_UT-AlRDL)
1P9M (6X2R_UT-AlRDL)
1P10M (5X2Y2R_UT-AlRDL)
1P10M (5X2Y2Z_UT-AlRDL)
1P10M (7X2R_UT-AlRDL)

TSMC 40nm CRN40LP T-N40-CM-SP-001, V1.3

1P6M(3X1Z1U)
1P6M(4X1Z0U)
1P7M(4X2Z0U)
1P9M(6X2Z0U)
1P9M(7X1Z0U)
1P10M(7X1Z1U)
1P6M(4X1Z0U_14p5KA_RDL)
1P6M (4X1Z0U_28KA_RDL)
1P7M (4X2Z0U_14p5KA_RDL)
1P7M (4X2Z0U_28KA_RDL)
1P8M (5X1Z1U_28KA_RDL)
1P8M (5X2Z0U_28KA_RDL)
1P10M (7X2Z0U)

TSMC 45nm CRN45LP T-N45-CM-SP-003, V1.0 1P9M(7X0Y1Z0R0U)
1P8M(4X0Y1Z0R0U)
1P7M(4X0Y2Z0R0U)
TSMC 55nm CLN55GP T-N55-CL-SP-021, V1.1 1P9M(6X2Z0U)
1P8M(5X2Z0U)
1P7M(4X2Z0U)
1P6M(3X2Z0U)
1P6M(4X1Z0U)
1P7M(5X1Z0U)
1P8M(6X1Z0U)
TSMC 65nm CRN65LP T-N65-CM-SP-012, V1.3

1P9M(6X1Z1U)
1P8M(6X1Z0U)
1P7M(4X1Z1U)
1P6M(3X1Z1U)
1P6M(3X1Z1U_MIMCAP)
1P6M(4X1Z0U)
1P5M(2X1Z1U)
1P5M(3X1Z0U)
1P4M(2X1Z0U)
1P6M(4X0Z1U)
1P8M (5X1Z1U)
1P7M (4X1Z1U_28KA)
1P7M (4X2Z0U)
1P6M (4X0Z1U)

TSMC 65nm CRN65GP T-N65-CM-SP-018, v1.1 1P9M(6X1Z1U)
1P6M(4X1Z0U)
1P6M(4X0Z1U_MIMCAP_2p0)
1P6M(4X0Z1U_MIMCAP_1p5)
1P6M(4X0Z1U_MIMCAP_1p0)
1P6M(4X0Z1U)
1P8M (5X1Z1U)
1P8M (5X1Z1U_mim_ind_2p0)
1P8M (5X1Z1U_mimcap_2p0)
1P6M (3X1Z1U)
1P6M (3X1Z1U_mim_ind_2p0)
1P6M (3X1Z1U_mimcap_2p0)
TSMC 90nm CRN90LP T-N90-CM-SP-004, V1.0 1P6M_MRDL*
1P6M_MUTMRDL**
1P7M_MRDL
1P7M_MUTMRDL
1P8M_MRDL
1P8M_MUTMRDL
1P9M_MRDL
1P9M_MUTMRDL
1P9M_MUTMRDL_MIMCAP_2fF
1P9M_MUTMRDL_MIMCAP_1.5fF
1P6M_MUTMRDL_MIMCAP
TSMC 0.13µm CR013LP T-013-MM-SP-001, V1.0 1P8M_M8wiUTM
TSMC 0.18µm CR018G T-018-MM-SP-001, V1.5

1P6M_UTM
1P6M_MIM_1p0
1P6M_MIM_1p5
1P6M_MIM_2p0
1P6M_UTM_20K

* MRDL -------> 2Thick and 1 RDL (RDL Optional)
** MUTMRDL -------> 1Thick, 1 UTM and 1 RDL (RDL Optional)

How to gain access to Momentum Modules?

You need to request access from your TSMC contact. Please also copy (cc) pdl-eesof_pdk_support@agilent.com in the same e-mail. Once TSMC has approved your request, you will receive the Momentum Module from Agilent Technologies.

For more information, refer to http://www.tsmc.com/english/dedicatedFoundry/technology/index.htm 

TSMC