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射频功率放大器设计系列 - 第 2 部分: 手机 PA 模块的端到端设计和仿真

1   小时 | 网上直播 -- 已存档的 | 地点和时间

Why this webcast is important:
What goes into real-life PA design considerations? Dr. Peter Zampardi and Dr. Hongxiao Shao share Skyworks design methodology considering all components necessary for a handset power amplifier (PA) or Front-end Module (FEM) based on III-V HBT and BiFET technologies.

Topics discussed include:
• How saturated and linear PA designs have slightly different requirements
• Compact model-based simulation of PA die
• Understanding why process statistics and statistical simulation (of both die and package) are important
• The use of compact HBT models for die design and discussion of common misconceptions regarding the importance of “array” level modeling
• EM simulation of on-chip passives, laminate and package – including process variation and its impact on front-end module performance and yield.

Join us for this practical and informative webcast.

Who should attend:
Target audience is designers, modelers, and design automation working on power amplifier design
 

地点和时间

价格 地点 更多信息
免费 At Your PC Enroll to view the Mar 1, 2012 recorded broadcast 

显示价格为标准定价,如有变更,恕不另行通知。

培训及活动材料

End-to-End Design and Simulation of Handset Modules 
What goes into real-life PA design considerations? Dr. Peter Zampardi and Dr. Hongxiao Shao share Skyworks design methodology considering all components necessary for a handset power amplifier (PA) or Front-end Module (FEM) based on III-V HBT and BiFET technologies.

研讨会演示 2012-02-27

PDF PDF 1.01 MB