射频功率放大器设计系列 - 第 2 部分： 手机 PA 模块的端到端设计和仿真

Why this webcast is important:
What goes into real-life PA design considerations? Dr. Peter Zampardi and Dr. Hongxiao Shao share Skyworks design methodology considering all components necessary for a handset power amplifier (PA) or Front-end Module (FEM) based on III-V HBT and BiFET technologies.

Topics discussed include:
• How saturated and linear PA designs have slightly different requirements
• Compact model-based simulation of PA die
• Understanding why process statistics and statistical simulation (of both die and package) are important
• The use of compact HBT models for die design and discussion of common misconceptions regarding the importance of “array” level modeling
• EM simulation of on-chip passives, laminate and package – including process variation and its impact on front-end module performance and yield.

Join us for this practical and informative webcast.

Who should attend:
Target audience is designers, modelers, and design automation working on power amplifier design