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Breakthrough in High Speed Interconnect Analysis and Compliance Testing

Webcast - enregistré | Where & When

As bit rates of digital systems increase, signal integrity of interconnects, transmitters & receivers drastically affects system performance. To ensure product reliability, compliance test specifications for high speed serial technologies become more complicating with multiple and yet strict measurement requirements on TDR, S parameter, and eye diagram. As a result, it is more challenging to have successful design for the next and deliver high standards to meet customer’s needs. In this session, we introduce new Agilent ENA Option TDR, a one-box solution that provides breakthroughs to traditional measurement solutions, which enables to address digital engineers advanced access and efficiency to signal integrity design and verification. The contents are delivered with real case studies from the contemporary compliance specifications.

Who should view this webcast:

  • Digital engineers who deal with design and verification for high speed digital applications and devices
  • Test engineers who perform compliance testing according to compliance specifications
  • Engineers and operators who use TDR oscilloscopes for TDR, S parameter, and eye diagram measurements.

Giveaway:
Registrants who completely fill out the feedback form by July 27, 2011 will be eligible to win one of two $75 Amazon.com gift certificates. Drawing only open to residents of the 50 United States and Canada (except Quebec).

Where & When

Price Location Pour plus d'information
Free At Your PC View the recording of the April 27, 2011 live broadcast 

Prix susceptibles de modification sans préavis.