Parla con un Esperto

Agilent EEsof MMIC Design Symposium - Tuesday 8th November 2011

1   Day | Seminar

 

AGENDA
9:30 Welcome 
9:45 Multi-technology design flow: simulating GaAs MMICs with Package and Board effects
Agilent Technologies: Riccardo Giacometti / Paolo Galdini
 
10:45 Extending MMIC technology description for easy and accurate EM simulations of complex 3D structures
Agilent Technologies: Riccardo Giacometti / Paolo Galdini
 
11:00 Coffee Break 
11:30

Foundry Update (current technology status, roadmap) :
• UMS - Eric Leclerc, Foundry Dept Manager
• OMMIC - Remy Leblanc, Director of Product Development
• IHP Micro - René Scholz, Team Leader MPW and Foundry Service
• Triquint - Francesco Palomba, Senior Design Engineer

13:00 Lunch 
14:00

Stability Analysis of Microwave circuits – AMCAD Eng: Stéphane Dellier

 

14:30 Examples of high-performance MMIC Designs - MiMEG Group - Universita’ “Tor Vergata”: Prof. Ernesto Limiti
 
15:00

Foundry Panel discussion –

Moderators:

  • Prof. Ernesto Limiti (Universita’ Tor Vergata)
  • Ing. Maurizio Pagani (Huawei)

What are the main technology needs of ADS MMIC designers today?

16:00 End 

 

Abstracts:


Paper 1:
Multi-technology design flow: simulating GaAs MMICs with Package and Board effects

This paper shows an example of how the new capabilities of ADS2011 enable the complete characterization of a MMIC amplifier including the effects of bondwires, package and board transitions. This is made possible by the direct integration of the FEM simulator in the ADS platform which allows the designer to model 3D objects and take into account the interactions between them and the circuit. These new 3D-modeling capabilities are accessible through the new EM modeling interface which is shared with Momentum and offers a vastly improved use model and the possibility to stack different substrates to simulate multiple technologies together.

 

Paper 2:
Extending MMIC technology description for easy and accurate EM simulations of complex 3D structures

Beyond the new capabilities brought into the multi-technology design, ADS 2011.10 introduces the new concept of derived process layers. With that concept foundries can easily describe most of the semiconductor processing they are using. For example, much of semiconductor processing come down to three activities. In the deposition step, you are depositing material uniformly across the wafer, at a controlled thickness. The material could be metal or a dielectric film. In the patterning step, you coat the wafer with photo-resist, and pattern it using light (or x-ray or electron beam) and develop it to leave a negative or positive image of the desired pattern. In the etching step, you use chemicals (such as acids) to remove the material that you don't want. This new capability allows our integrated electromagnetic solvers (full 3D-EM or 3D planar) to get natively an unequalled 3D description of passive devices in integrated circuits. Based on a generic GaAs process, this paper will demonstrate how foundry can use these new capabilities to provide native support of air-bridges, high and low density capacitors or dielectric aperture.

 

Presentazione
Multi Technology Design in ADS 2011
Demo and Value Proposition
Extending MMIC technology description for
easy and accurate EM simulations of complex
3D structure
UMS_Company_Profile_ADS_Roma
IHP foundry service technology
TriQuint Commercial Foundry
Stability Analysis of Microwave Circuits (AMCAD)