Innovations in EDA: Accurate Modeling of Packages and Interconnects
웹캐스트 - recorded | 시간 및 장소
An important step in high frequency / high speed IC design is the characterization of IC performance within a realistic environment including packaging, interconnects, connectors, etc. There are several approaches to creating accurate models of these elements, such as creating equivalent circuit models, EM simulations, and measurements. This webcast will compare these different methods and examine the trade-offs of each. Several case studies are presented which compare measured and simulated results.
시간 및 장소
2010-12-02 10:00 — 2010-12-02 11:00
|At Your PC||View the recording of the Dec 2 , 2010 broadcast on|
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교육 및 이벤트 자료
Accurate Modeling of Packages and Interconnects
Innovations in EDA Webcast Series presented on December 2, 2010.
세미나 프리젠테이션 2010-12-02
PDF 2.47 MB